Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.56 |
| ▸ | TSHR | P16473 | 5/20 | 0.49 |
| ▸ | HPGD | P15428 | 1/20 | 0.49 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.37 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.36 |
| ▸ | ATM | Q13315 | 1/20 | 0.35 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.33 |
| ▸ | HCAR2 | Q8TDS4 | 1/20 | 0.33 |
| ▸ | TP53 | P04637 | 1/20 | 0.32 |
| ▸ | THRB | P10828 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL221053 | 0.93 | ALDH1A1 (0.64) | ALDH1A1TSHRHPGDSMN1; SMN2CYP3A4 | |
| Acrylic Acid Ethyl Ester SCHEMBL21493215 | 0.93 | ALDH1A1 (0.48) | ALDH1A1TSHRHPGDSMN1; SMN2CYP3A4 | |
| Acrylic Acid Ethyl Ester SCHEMBL20702243 | 0.93 | ALDH1A1 (0.48) | ALDH1A1TSHRHPGDSMN1; SMN2CYP3A4 | |
| SCHEMBL28233475 | 0.92 | ALDH1A1 (0.59) | ALDH1A1TSHRHPGDSMN1; SMN2CYP3A4 | |
| Ethylene SCHEMBL3475332 | 0.92 | ALDH1A1 (0.62) | ALDH1A1TSHRHPGDSMN1; SMN2CYP3A4 | |
| SCHEMBL29136554 | 0.92 | ALDH1A1 (0.62) | ALDH1A1TSHRHPGDSMN1; SMN2CYP3A4 | |
| Acrylonitrile SCHEMBL28796018 | 0.91 | TSHR (0.56) | ALDH1A1TSHRHPGDSMN1; SMN2CYP3A4 | |
| Methacrylic Acid SCHEMBL4814817 | 0.90 | ALDH1A1 (0.59) | ALDH1A1TSHRHPGDSMN1; SMN2CYP3A4 | |
| Vinyl Chloride SCHEMBL28543043 | 0.90 | ALDH1A1 (0.59) | ALDH1A1TSHRHPGDSMN1; SMN2CYP3A4 | |
| Acrylic Acid Ethyl Ester SCHEMBL7639859 | 0.90 | ALDH1A1 (0.59) | ALDH1A1TSHRHPGDSMN1; SMN2CYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240204351-A1 | WATER-IMPERMEABLE DEGASSING FILM FOR POWER STORAGE DEVICE | DAI NIPPON PRINTING CO., LTD. (JP) | 2024-06-20 | — | — | US | disclosed |
| US-20240186627-A1 | ADHESIVE FILM, POWER STORAGE DEVICE, AND METHOD FOR MANUFACTURING POWER STORAGE DEVICE | DAI NIPPON PRINTING CO., LTD. (JP) | 2024-06-06 | — | — | US | disclosed |
| US-20240186628-A1 | ADHESIVE FILM, ELECTRICITY STORAGE DEVICE, AND METHOD FOR PRODUCING ELECTRICITY STORAGE DEVICE | DAI NIPPON PRINTING CO., LTD. (JP) | 2024-06-06 | — | — | US | disclosed |
| EP-4343801-A1 | WATER-IMPERMEABLE DEGASSING FILM FOR POWER STORAGE DEVICE | DAI NIPPON PRINTING CO., LTD. (JP) | 2024-03-27 | — | — | EP | disclosed |
| EP-4333007-A1 | ADHESIVE FILM, ELECTRICITY STORAGE DEVICE, AND METHOD FOR PRODUCING ELECTRICITY STORAGE DEVICE | DAI NIPPON PRINTING CO., LTD. (JP) | 2024-03-06 | — | — | EP | disclosed |
| EP-4333006-A1 | ADHESIVE FILM, POWER STORAGE DEVICE, AND METHOD FOR MANUFACTURING POWER STORAGE DEVICE | DAI NIPPON PRINTING CO., LTD. (JP) | 2024-03-06 | — | — | EP | disclosed |
| US-11377546-B2 | Resin composition, laminate sheet, and multilayer printed wiring board | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2022-07-05 | — | — | US | disclosed |
| US-20190241729-A1 | RESIN COMPOSITION, LAMINATE SHEET, AND MULTILAYER PRINTED WIRING BOARD | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2019-08-08 | — | — | US | disclosed |
| EP-3489308-A1 | RESIN COMPOSITION, LAMINATE SHEET, AND MULTILAYER PRINTED WIRING BOARD | Hitachi Chemical Company, Ltd. (JP) | 2019-05-29 | — | — | EP | disclosed |
| CN-109476923-A | Resin composition, laminate, and multilayer printed wiring board | 日立化成株式会社 | 2019-03-15 | — | — | CN | disclosed |
| CN-102132212-A | Positive-type photosensitive resin composition, method for producing resist pattern, and electronic component | HITACHI CHEMICAL CO LTD | 2011-07-20 | — | — | CN | disclosed |
| CN-101855596-A | Positive-type photosensitive resin composition, method for production of resist pattern, semiconductor device, and electronic device | HITACHI CHEMICAL CO LTD | 2010-10-06 | — | — | CN | disclosed |
| EP-2221666-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCTION OF RESIST PATTERN, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE | Hitachi Chemical Company, Ltd. (JP) | 2010-08-25 | — | — | EP | disclosed |
| CN-101681107-A | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board | HITACHI CHEMICAL CO LTD | 2010-03-24 | — | — | CN | disclosed |
| US-5080958-A | MULTILAYER INTERCONNECTS | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 1992-01-14 | — | — | US | disclosed |
| EP-0411551-A2 | Multilayer interconnects | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 1991-02-06 | — | — | EP | disclosed |
| US-4980410-A | LOWER ACRYLATE, ACRYLONITRILE, AND GLYCIDYL ACRYLATE | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 1990-12-25 | — | — | US | disclosed |
| US-4975484-A | TERPOLYMER OF AN ALKYL ACRYLATE, ACRYLONITRILE OR METHACRYLO-NITRILE AND GLYCIDYL ACRYLATE OR GLYCIDYL METHACRYLATE | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 1990-12-04 | — | — | US | disclosed |
| EP-0201102-B1 | ACRYLIC COPOLYMER COMPOSITION AND ADHESIVE COATINGS THEREFROM | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 1990-08-29 | — | — | EP | disclosed |
| EP-0201102-A2 | Acrylic copolymer composition and adhesive coatings therefrom | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 1986-11-12 | — | — | EP | disclosed |