SCHEMBL1000160

SCHEMBL1000160

O=C(O)C=CC1(C=CC(=O)O)C=CC=C1

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.40
TP53 P04637 1/20 0.40
EGLN1 Q9GZT9 1/20 0.40
EGLN3 Q9H6Z9 1/20 0.40
HCAR2 Q8TDS4 4/20 0.31
HDAC3 O15379 1/20 0.31
TNKS O95271 1/20 0.31
HDAC4 P56524 1/20 0.31
HDAC1 Q13547 1/20 0.31
HDAC7 Q8WUI4 1/20 0.31
HDAC2 Q92769 1/20 0.31
HDAC10 Q969S8 1/20 0.31
HDAC11 Q96DB2 1/20 0.31
HDAC8 Q9BY41 1/20 0.31
TNKS2 Q9H2K2 1/20 0.31
HDAC6 Q9UBN7 1/20 0.31
HDAC9 Q9UKV0 1/20 0.31
HDAC5 Q9UQL6 1/20 0.31
ALDH1A1 P00352 1/20 0.30
ALOX15 P16050 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Maleic Acid SCHEMBL27583410 0.62 TSHR (0.82) TSHRTP53EGLN1EGLN3HCAR2
Fumaric Acid SCHEMBL9342231 0.62 TSHR (0.82) TSHRTP53EGLN1EGLN3HCAR2
Maleic Acid SCHEMBL28275189 0.62 TSHR (0.82) TSHRTP53EGLN1EGLN3HCAR2
Maleic Acid SCHEMBL1092313 0.62 TSHR (0.82) TSHRTP53EGLN1EGLN3HCAR2
Maleic Acid SCHEMBL4369536 0.62 TSHR (0.82) TSHRTP53EGLN1EGLN3HCAR2
Fumaric Acid SCHEMBL30516198 0.62 TSHR (0.82) TSHRTP53EGLN1EGLN3HCAR2
Fumaric Acid SCHEMBL2046433 0.61 TSHR (1.00) TSHRTP53EGLN1EGLN3HCAR2
Fumaric Acid SCHEMBL3998225 0.61
Fumaric Acid SCHEMBL615 0.61
Maleic Acid SCHEMBL20487516 0.61 TSHR (1.00) TSHRTP53EGLN1EGLN3HCAR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 47 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3583159-B1 WATER-SWELLABLE POLYMER PARTICLES BASF SE (DE) 2021-01-20 EP claimed
EP-2379669-A1 METHOD FOR BLOCKING SUBTERRANEAN FORMATIONS BASF SE (DE) 2011-10-26 EP claimed
EP-2294098-A2 TIME-DELAYED SUPER-ABSORBENT POLYMERS Construction Research & Technology GmbH (DE) 2011-03-16 EP claimed
EP-2204431-A1 Method for blocking subterranean formations BASF SE (DE) 2010-07-07 EP claimed
WO-2010069607-A1 METHOD FOR BLOCKING SUBTERRANEAN FORMATIONS BASF SE (DE) 2010-06-24 WO claimed
WO-2009156229-A2 TIME-DELAYED SUPER-ABSORBENT POLYMERS CONSTRUCTION RESEARCH & TECHNOLOGY GMBH (DE) 2009-12-30 WO claimed
EP-4139265-A1 MIXTURES CONTAINING SUPERABSORBERS Wacker Chemie AG (DE) 2023-03-01 EP disclosed
WO-2021213652-A1 MIXTURES CONTAINING SUPERABSORBERS WACKER CHEMIE AG (DE) 2021-10-28 WO disclosed
US-11015006-B2 Coated polymer particles comprising a water-swellable polymer core and a sol-gel coating BASF SE 2021-05-25 US disclosed
US-20190211127-A1 COATED POLYMER PARTICLES COMPRISING A WATER-SWELLABLE POLYMER CORE AND A SOL-GEL COATING BASF SE (DE) 2019-07-11 US disclosed
EP-3442925-A1 COATED POLYMER PARTICLES COMPRISING A WATER-SWELLABLE POLYMER CORE AND A SOL-GEL COATING BASF SE (DE) 2019-02-20 EP disclosed
WO-2017178302-A1 COATED POLYMER PARTICLES COMPRISING A WATER-SWELLABLE POLYMER CORE AND A SOL-GEL COATING BASF SE (DE) 2017-10-19 WO disclosed
EP-1332169-B1 ABSORBENT MATERIAL WITH IMPROVED BLOCKING PROPERTIES EVONIK DEGUSSA GMBH (DE) 2016-12-28 EP disclosed
EP-1453891-B1 COMPACTED ABSORBENT POLYMERS, THE PRODUCTION THEREOF AND THE USE OF THE SAME STOCKHAUSEN CHEM FAB GMBH (DE) 2006-03-22 EP disclosed
EP-1453891-A1 COMPACTED ABSORBENT POLYMERS, THE PRODUCTION THEREOF AND THE USE OF THE SAME Stockhausen GmbH & Co. KG (DE) 2004-09-08 EP disclosed
WO-2003051963-A1 COMPACTED ABSORBENT POLYMERS, THE PRODUCTION THEREOF AND THE USE OF THE SAME STOCKHAUSEN GMBH & CO. KG (DE) 2003-06-26 WO disclosed
US-6515869-B2 Supporting substrate for a semiconductor bare chip NEC CORPORATION (JP) 2003-02-04 US disclosed
US-20020092610-A1 SUPPORTING SUBSTRATE TO BE BONDED WITH SEMICONDUCTOR BARE CHIP AND METHOD OF THERMOCOMPRESSION-BONDING THE SAME GODO KAISHA IP BRIDGE 1 (JP) 2002-07-18 US disclosed
WO-2002032213-A1 MUSHROOM CULTIVATION USING A WATER-ABSORBING POLYMER STOCKHAUSEN GMBH & CO. KG (DE) 2002-04-25 WO disclosed
US-6042682-A Method of thermocompression bonding a supporting substrate to a semiconductor bare chip NEC CORPORATION (JP) 2000-03-28 US disclosed