Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | AR | P10275 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10993439 | 0.96 | — | — | |
| SCHEMBL17930118 | 0.88 | — | — | |
| SCHEMBL13199174 | 0.88 | — | — | |
| SCHEMBL20411814 | 0.87 | — | — | |
| SCHEMBL24211020 | 0.84 | — | — | |
| SCHEMBL17321834 | 0.83 | AR (0.30) | AR | |
| SCHEMBL17547700 | 0.82 | — | — | |
| SCHEMBL16348189 | 0.80 | — | — | |
| SCHEMBL21244245 | 0.78 | — | — | |
| SCHEMBL24117877 | 0.77 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 64 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117402172-A | Synthesis method of 3, 6-bis (trifluoromethyl) -pyromellitic dianhydride | 中国科学院上海有机化学研究所 | 2024-01-16 | — | — | CN | claimed |
| CN-117402172-A | Synthesis method of 3, 6-bis (trifluoromethyl) -pyromellitic dianhydride | 中国科学院上海有机化学研究所 | 2024-01-16 | — | — | CN | disclosed |
| CN-117402172-A | Synthesis method of 3, 6-bis (trifluoromethyl) -pyromellitic dianhydride | 中国科学院上海有机化学研究所 | 2024-01-16 | — | — | CN | disclosed |
| CN-117384121-A | Preparation method of 2,2' -di (trifluoromethyl) -4,4', 5' -biphenyl dianhydride | 中国科学院上海有机化学研究所 | 2024-01-12 | — | — | CN | disclosed |
| US-11319410-B2 | Precursor for polyimide and use thereof | ETERNAL MATERIALS CO., LTD. (TW) | 2022-05-03 | — | — | US | disclosed |
| US-11034797-B2 | Polyimide precursor composition, use thereof and polyimide made therefrom | ETERNAL MATERIALS CO., LTD. (TW) | 2021-06-15 | — | — | US | disclosed |
| US-20210079161-A1 | POLYIMIDE PRECURSOR COMPOSITION, USE THEREOF AND POLYIMIDE MADE THEREFROM | ETERNAL MATERIALS CO., LTD. (TW) | 2021-03-18 | — | — | US | disclosed |
| US-10731004-B2 | Polyimide precursor composition and use thereof | ETERNAL MATERIALS CO., LTD. (TW) | 2020-08-04 | — | — | US | disclosed |
| US-10696793-B2 | Process for preparing polyimides | ETERNAL MATERIALS CO., LTD. (TW) | 2020-06-30 | — | — | US | disclosed |
| US-10639876-B2 | Solvent-containing dry film and method for applying the same on a substrate | ETERNAL MATERIALS CO., LTD. (TW) | 2020-05-05 | — | — | US | disclosed |
| US-20100086874-A1 | Photosensitive polymides | ETERNAL CHEMICAL CO., LTD. (TW) | 2010-04-08 | — | — | US | disclosed |
| US-20100086874-A1 | Photosensitive polymides | ETERNAL CHEMICAL CO., LTD. (TW) | 2010-04-08 | — | — | US | disclosed |
| US-20100086871-A1 | PHOTOSENSITIVE POLYIMIDES | ETERNAL CHEMICAL CO., LTD. | 2010-04-08 | — | — | US | disclosed |
| WO-2010001780-A1 | HEAT-RESISTANT RESIN PRECURSOR AND PHOTOSENSITIVE RESIN COMPOSITION COMPRISING THE SAME | 旭化成イーマテリアルズ株式会社 (JP) | 2010-01-07 | — | — | WO | disclosed |
| US-20090181324-A1 | PHOTOSENSITIVE POLYIMIDES | ETERNAL CHEMICAL CO., LTD. | 2009-07-16 | — | — | US | disclosed |
| US-20090181324-A1 | PHOTOSENSITIVE POLYIMIDES | ETERNAL CHEMICAL CO., LTD. | 2009-07-16 | — | — | US | disclosed |
| US-20080103275-A1 | Negative photosensitive polyimide polymer and uses thereof | ETERNAL CHEMICAL CO., LTD. | 2008-05-01 | — | — | US | disclosed |
| US-20080103275-A1 | Negative photosensitive polyimide polymer and uses thereof | ETERNAL CHEMICAL CO., LTD. | 2008-05-01 | — | — | US | disclosed |
| US-20080096997-A1 | Amic acid ester oligomer precursor composition for polyimide resin containing the same, and uses | ETERNAL MATERIALS CO., LTD. (TW) | 2008-04-24 | — | — | US | disclosed |
| US-20080096997-A1 | Amic acid ester oligomer precursor composition for polyimide resin containing the same, and uses | ETERNAL MATERIALS CO., LTD. (TW) | 2008-04-24 | — | — | US | disclosed |