Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.38 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.38 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.38 |
| ▸ | MAPT | P10636 | 1/20 | 0.38 |
| ▸ | HPGD | P15428 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Dimethylamine SCHEMBL28651792 | 1.00 | KDM4E (0.38) | KDM4EALDH1A1CYP3A4MAPTHPGD | |
| Dimethylamine SCHEMBL11121485 | 1.00 | — | — | |
| Dimethylamine SCHEMBL27858418 | 0.91 | — | — | |
| Dimethylamine SCHEMBL14797794 | 0.91 | — | — | |
| Dimethylamine SCHEMBL1330452 | 0.89 | — | — | |
| Dimethylamine SCHEMBL13695986 | 0.89 | — | — | |
| Dimethylamine SCHEMBL392668 | 0.89 | — | — | |
| Dimethylamine SCHEMBL1030 | 0.89 | — | — | |
| Dimethylamine SCHEMBL11567323 | 0.80 | — | — | |
| Dimethylamine SCHEMBL733 | 0.80 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7091135-B2 | Method of manufacturing semiconductor device | KABUSHIKI KAISHA TOSHIBA (JP) | 2006-08-15 | — | — | US | claimed |
| US-20040235254-A1 | Method of manufacturing semiconductor device | MICROSOFT TECHNOLOGY LICENSING, LLC | 2004-11-25 | — | — | US | claimed |
| CN-113195596-B | Branched organosilicon compounds, methods of making branched organosilicon compounds, and compositions comprising branched organosilicon compounds | 美国陶氏有机硅公司 | 2023-02-28 | — | — | CN | disclosed |
| CN-113330054-B | Branched organosilicon compounds, methods of making, and copolymers formed therewith | 美国陶氏有机硅公司 | 2023-02-21 | — | — | CN | disclosed |
| CN-113166423-B | Branched organosilicon compounds, method for producing branched organosilicon compounds, and compositions containing branched organosilicon compounds | 美国陶氏有机硅公司 | 2023-02-17 | — | — | CN | disclosed |
| CN-113348199-B | Branched organosilicon compounds, methods of making branched organosilicon compounds, and copolymers formed therewith | 美国陶氏有机硅公司 | 2023-02-17 | — | — | CN | disclosed |
| CN-115052932-A | Composition, method for preparing copolymer and end use of copolymer | 美国陶氏有机硅公司 | 2022-09-13 | — | — | CN | disclosed |
| CN-110177847-B | Emulsions, compositions comprising emulsions, films formed therefrom, and related methods | 美国陶氏有机硅公司 | 2022-04-19 | — | — | CN | disclosed |
| CN-113348199-A | Branched organosilicon compounds, methods of making branched organosilicon compounds, and copolymers formed therewith | 美国陶氏有机硅公司 | 2021-09-03 | — | — | CN | disclosed |
| CN-113348174-A | Branched organosilicon compounds, methods of making the branched organosilicon compounds, and related compositions | 美国陶氏有机硅公司 | 2021-09-03 | — | — | CN | disclosed |
| CN-113330054-A | Branched organosilicon compounds, methods of making, and copolymers formed therewith | 美国陶氏有机硅公司 | 2021-08-31 | — | — | CN | disclosed |
| CN-113330055-A | Acrylate-functional branched organosilicon compounds, methods of making, and copolymers formed therewith | 美国陶氏有机硅公司 | 2021-08-31 | — | — | CN | disclosed |
| CN-113195596-A | Branched organosilicon compounds, method for producing branched organosilicon compounds, and compositions containing branched organosilicon compounds | 美国陶氏有机硅公司 | 2021-07-30 | — | — | CN | disclosed |
| CN-113166423-A | Branched organosilicon compounds, method for producing branched organosilicon compounds, and compositions containing branched organosilicon compounds | 美国陶氏有机硅公司 | 2021-07-23 | — | — | CN | disclosed |
| US-7863125-B2 | Manufacturing method of CMOS type semiconductor device, and CMOS type semiconductor device | RENESAS ELECTRONICS CORPORATION (JP) | 2011-01-04 | — | — | US | disclosed |
| US-20090263945-A1 | MANUFACTURING METHOD OF CMOS TYPE SEMICONDUCTOR DEVICE, AND CMOS TYPE SEMICONDUCTOR DEVICE | RENESAS TECHNOLOGY CORP., (JP) | 2009-10-22 | — | — | US | disclosed |
| US-7569890-B2 | Manufacturing method of CMOS type semiconductor device, and CMOS type semiconductor device | RENESAS TECHNOLOGY CORP. (JP) | 2009-08-04 | — | — | US | disclosed |
| US-20060273401-A1 | Manufacturing method of CMOS type semiconductor device, and CMOS type semiconductor device | RENESAS TECHNOLOGY CORP. (JP) | 2006-12-07 | — | — | US | disclosed |
| US-7091135-B2 | Method of manufacturing semiconductor device | KABUSHIKI KAISHA TOSHIBA (JP) | 2006-08-15 | — | — | US | disclosed |
| US-20040235254-A1 | Method of manufacturing semiconductor device | MICROSOFT TECHNOLOGY LICENSING, LLC | 2004-11-25 | — | — | US | disclosed |