SCHEMBL1007136

SCHEMBL1007136

NCC(N)(Cl)Cl.[Pd]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2571536 0.95
SCHEMBL408314 0.91
SCHEMBL28001225 0.91
SCHEMBL11230787 0.91
SCHEMBL16241836 0.73 TSHR (0.40)
SCHEMBL10854227 0.72
SCHEMBL304888 0.70
SCHEMBL7694297 0.67
SCHEMBL304887 0.67
Water SCHEMBL8631225 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 55 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119173651-A Palladium catalyst liquid 奥野制药工业株式会社 2024-12-20 CN claimed
CN-107109653-A Bath compositions and method for chemical palladium-plating 埃托特克德国有限公司 2017-08-29 CN claimed
CN-107002242-A Plating bath composition and method for electroless palladium plating 埃托特克德国有限公司 2017-08-01 CN claimed
CN-104512902-B A kind of micro porous molecular sieve and its preparation method and application 华东理工大学 2017-06-06 CN claimed
CN-104512902-A Microporous molecular sieve and preparation method and application thereof UNIV EAST CHINA SCIENCE & TECH 2015-04-15 CN claimed
US-7887692-B2 comprising a soluble germanium salt having a concentration ranging from 1 mg/l to 1000 mg/l in terms of a reduced value of palladium metal, a soluble palladium salt, and an electrically conductive salt; improved heat resistance, solder wettability ELECTROPLATING ENGINEERS OF JAPAN LIMITED (JP) 2011-02-15 US claimed
EP-1852525-B1 Palladium plating solution ELECTROPLATING ENG (JP) 2010-04-07 EP claimed
EP-1852525-A1 Palladium plating solution Electroplating Engineers of Japan Limited (JP) 2007-11-07 EP claimed
US-20070205109-A1 Palladium plating solution ELECTROPLATING ENGINEERS OF JAPAN LIMITED 2007-09-06 US claimed
CN-119173651-A Palladium catalyst liquid 奥野制药工业株式会社 2024-12-20 CN disclosed
US-20230190730-A1 4-OXOQUINOLINE COMPOUND AND USE THEREOF AS PHARMACEUTICAL AGENT JAPAN TOBACCO INC. (JP) 2023-06-22 US disclosed
EP-4059923-A1 4-OXOQUINOLINE COMPOUND AND USE THEREOF AS HIV INTEGRASE INHIBITOR Japan Tobacco Inc. (JP) 2022-09-21 EP disclosed
EP-2479314-B1 METHOD FOR PRODUCING COPPER METAL FILM HITACHI CHEMICAL CO LTD (JP) 2020-09-09 EP disclosed
US-20200101061-A1 4-OXOQUINOLINE COMPOUND AND USE THEREOF AS PHARMACEUTICAL AGENT JAPAN TOBACCO INC. (JP) 2020-04-02 US disclosed
US-6376057-B1 LIGHT SHIELDING THERMOPLASTIC RESINS FUJI PHOTO FILM, CO., LTD. (JP) 2002-04-23 US disclosed
EP-1090902-A2 Method for producing alcohols such as cyclohexanedimethanol Nippon Shokubai Co., Ltd. (JP) 2001-04-11 EP disclosed
EP-0965383-A1 Catalyst and method for producing benzyl esters Nippon Shokubai Co., Ltd. (JP) 1999-12-22 EP disclosed
EP-0543340-B1 Process for preparing lactones TOSOH CORP (JP) 1998-05-20 EP disclosed
US-5502217-A MULTISTAGE PROCESS WITH HYDROGENATION OF MALEIC ACID OR SUCCINIC ACID IN THE PRESENCE OF METAL TO FORM BUTYROLACTONE TOSOH CORPORATION (JP) 1996-03-26 US disclosed
EP-0543340-A1 Process for preparing lactones Tosoh Corporation (JP) 1993-05-26 EP disclosed