SCHEMBL10076810

SCHEMBL10076810

CCCC(C)(C)[S+]([O-])C(C)(C)CC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL777151 0.92
SCHEMBL776630 0.86 TSHR (0.38)
SCHEMBL14392629 0.81
SCHEMBL20446614 0.76 TSHR (0.32)
SCHEMBL14538816 0.75 TSHR (0.33)
SCHEMBL1111201 0.72 TSHR (0.40)
SCHEMBL19035762 0.70
SCHEMBL30341800 0.70
SCHEMBL13520583 0.65
SCHEMBL4137728 0.65

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8192649-B2 Capped poly(arylene ether) composition and method SABIC INNOVATIVE PLASTICS IP B.V. (NL) 2012-06-05 US disclosed
US-7781537-B2 Functionalized poly(arylene ether) composition and method SABIC INNOVATIVE PLASTICS IP B.V. (NL) 2010-08-24 US disclosed
US-7495047-B2 Poly(arylene ether) composition, method, and article AT&T INTELLECTUAL PROPERTY, I, L.P. (US) 2009-02-24 US disclosed
US-7488766-B2 Polymer composition, method, and article SABIC INNOVATIVE PLASTICS IP B.V. (NL) 2009-02-10 US disclosed
US-7354533-B2 Electrically conductive thermoset composition, method for the preparation thereof, and articles derived therefrom GENERAL ELECTRIC COMPANY (US) 2008-04-08 US disclosed
US-20080051522-A1 FUNCTIONALIZED POLY(ARYLENE ETHER) COMPOSITION AND METHOD SHPP GLOBAL TECHNOLOGIES B.V. (NL) 2008-02-28 US disclosed
US-7329708-B2 Functionalized poly(arylene ether) composition and method GENERAL ELECTRIC COMPANY (US) 2008-02-12 US disclosed
WO-2007130063-A1 ELECTRONIC MOLDING COMPOSITION AND METHOD MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2007-11-15 WO disclosed
WO-2007044294-A1 POLYMER COMPOSITION, METHOD, AND ARTICLE GENERAL ELECTRIC COMPANY (US) 2007-04-19 WO disclosed
US-7205035-B2 Thermoset composition, method, and article GENERAL ELECTRIC COMPANY (US) 2007-04-17 US disclosed
WO-2007037940-A1 METHOD FOR ELECTRICAL INSULATION VIA APPLYING A POLY (ARYLENE ETHER) COMPOSITION AND INSULATED ELECTRICAL CONDUCTOR GENERAL ELECTRIC COMPANY (US) 2007-04-05 WO disclosed