⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2681724 | 0.87 | — | — | |
| SCHEMBL28054193 | 0.78 | — | — | |
| SCHEMBL13622768 | 0.73 | — | — | |
| SCHEMBL7029276 | 0.73 | — | — | |
| SCHEMBL661434 | 0.73 | — | — | |
| SCHEMBL29619571 | 0.73 | — | — | |
| SCHEMBL28956942 | 0.71 | — | — | |
| SCHEMBL2454715 | 0.70 | — | — | |
| SCHEMBL197341 | 0.70 | — | — | |
| SCHEMBL16300039 | 0.70 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 312 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250207006-A1 | Moisture-curable Polyurethane Hot Melt Adhesive Composition | HENKEL AG & CO. KGAA (DE) | 2025-06-26 | — | — | US | claimed |
| US-20250171667-A1 | Solvent-free Polyurethane Adhesive Composition and Use Thereof | HENKEL AG & CO. KGAA (DE) | 2025-05-29 | — | — | US | claimed |
| EP-4558574-A1 | SOLVENT-FREE POLYURETHANE ADHESIVE COMPOSITION AND USE THEREOF | Henkel AG & Co. KGaA (DE) | 2025-05-28 | — | — | EP | claimed |
| US-20250101266-A1 | High Bio-Content Polyurethane Hot Melt Adhesive Composition | HENKEL AG & CO KGAA (DE) | 2025-03-27 | — | — | US | claimed |
| WO-2025050354-A1 | SOLVENT-FREE POLYURETHANE ADHESIVE COMPOSITION AND USE THEREOF | HENKEL AG & CO. KGAA (DE) | 2025-03-13 | — | — | WO | claimed |
| US-20250059416-A1 | Reactive Hot Melt Adhesive Composition and the Use Thereof | HENKEL AG & CO KGAA (DE) | 2025-02-20 | — | — | US | claimed |
| EP-4463521-A1 | HIGH BIO-CONTENT POLYURETHANE HOT MELT ADHESIVE COMPOSITION | Henkel AG & Co. KGaA (DE) | 2024-11-20 | — | — | EP | claimed |
| EP-4460543-A1 | REACTIVE HOT MELT ADHESIVE COMPOSITION AND THE USE THEREOF | Henkel AG & Co. KGaA (DE) | 2024-11-13 | — | — | EP | claimed |
| WO-2023133744-A9 | HIGH BIO-CONTENT POLYURETHANE HOT MELT ADHESIVE COMPOSITION | HENKEL AG & CO. KGAA (DE) | 2024-08-22 | — | — | WO | claimed |
| US-20240218221-A1 | Moisture-Curable Polyurethane Hot Melt Adhesive Composition | HENKEL AG & CO KGAA (DE) | 2024-07-04 | — | — | US | claimed |
| WO-2024055230-A1 | MOISTURE-CURABLE POLYURETHANE HOT MELT ADHESIVE COMPOSITION | HENKEL AG & CO. KGAA (DE) | 2024-03-21 | — | — | WO | claimed |
| EP-3938447-B1 | DIGITALLY PRINTED LABELS | SUN CHEMICAL CORP (US) | 2024-03-06 | — | — | EP | claimed |
| WO-2024016319-A1 | SOLVENT-FREE POLYURETHANE ADHESIVE COMPOSITION AND USE THEREOF | HENKEL AG & CO. KGAA (DE) | 2024-01-25 | — | — | WO | claimed |
| WO-2023130370-A1 | REACTIVE HOT MELT ADHESIVE COMPOSITION AND THE USE THEREOF | HENKEL AG & CO. KGAA (DE) | 2023-07-13 | — | — | WO | claimed |
| WO-2023050032-A1 | MOISTURE-CURABLE POLYURETHANE HOT MELT ADHESIVE COMPOSITION | HENKEL AG & CO. KGAA (DE) | 2023-04-06 | — | — | WO | claimed |
| US-20220145090-A1 | DIGITALLY PRINTED LABELS | SUN CHEMICAL CORPORATION (US) | 2022-05-12 | — | — | US | claimed |
| EP-3938447-A1 | DIGITALLY PRINTED LABELS | Sun Chemical Corporation (US) | 2022-01-19 | — | — | EP | claimed |
| WO-2020190723-A1 | DIGITALLY PRINTED LABELS | SUN CHEMICAL CORPORATION (US) | 2020-09-24 | — | — | WO | claimed |
| WO-2018236656-A1 | COATINGS WITH FAST RETURN TO SERVICE | COVESTRO LLC (US) | 2018-12-27 | — | — | WO | claimed |
| US-20180362801-A1 | COATINGS WITH FAST RETURN TO SERVICE | COVESTRO LLC | 2018-12-20 | — | — | US | claimed |