⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3938417 | 1.00 | — | — | |
| SCHEMBL29661122 | 1.00 | — | — | |
| SCHEMBL5546303 | 1.00 | — | — | |
| SCHEMBL31474277 | 1.00 | — | — | |
| SCHEMBL31175725 | 1.00 | — | — | |
| SCHEMBL448550 | 1.00 | — | — | |
| SCHEMBL25319315 | 0.82 | — | — | |
| SCHEMBL532900 | 0.82 | — | — | |
| SCHEMBL738608 | 0.82 | — | — | |
| Methane SCHEMBL1248440 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 50 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-101692438-A | Monolithic integrated manufacturing method for indium phosphide-based resonant tunneling diodes and high-electron-mobility transistors | NO 55 INST OF CHINA ELECTRONIC | 2010-04-07 | — | — | CN | claimed |
| US-6828677-B2 | Precision electroplated solder bumps and method for manufacturing thereof | HRL LABORATORIES, LLC. | 2004-12-07 | — | — | US | claimed |
| JP-2004502294-A | — | — | 2004-01-22 | — | — | JP | claimed |
| EP-1266397-A2 | PRECISION ELECTROPLATED SOLDER BUMPS AND METHOD FOR MANUFACTURING THEREOF | HRL Laboratories, LLC (US) | 2002-12-18 | — | — | EP | claimed |
| US-20020090805-A1 | Electroplating method of fabrication of the solder bumps which method does not damage air bridges, micro-electromechanical structures, or optical surfaces that can be otherwise damaged | HRL LABORATORIES, LLC | 2002-07-11 | — | — | US | claimed |
| US-6387793-B1 | METALLIZATION; APPLYING SOLDER BUMPS; HEATING | HRL LABORATORIES, LLC | 2002-05-14 | — | — | US | claimed |
| WO-2001067494-A2 | PRECISION ELECTROPLATED SOLDER BUMPS AND METHOD FOR MANUFACTURING THEREOF | HRL LABORATORIES, LLC. (US) | 2001-09-13 | — | — | WO | claimed |
| CN-119997688-A | Micro light emitting diode and micro light emitting diode chip | 上海显耀显示科技有限公司 | 2025-05-13 | — | — | CN | disclosed |
| CN-119997687-A | Reflector layer for micro light emitting diode and forming method thereof | 上海显耀显示科技有限公司 | 2025-05-13 | — | — | CN | disclosed |
| CN-118662137-A | Flexible implantation probe with variable rigidity and preparation method thereof | 浙江大学 | 2024-09-20 | — | — | CN | disclosed |
| CN-118571961-A | Photoelectric detector chip and processing method thereof | 弥尔光半导体(北京)有限公司 | 2024-08-30 | — | — | CN | disclosed |
| CN-112657053-B | Implanted double-sided electrode and preparation method thereof | 深圳硅基仿生科技股份有限公司 | 2024-03-29 | — | — | CN | disclosed |
| CN-116139398-A | Pad structure of flexible stimulating electrode and preparation method thereof | 深圳硅基传感科技有限公司 | 2023-05-23 | — | — | CN | disclosed |
| US-20040212076-A1 | Multilayer substrate | MEDTRONIC MINIMED, INC. | 2004-10-28 | — | — | US | disclosed |
| EP-1436605-A1 | SENSOR SUBSTRATE AND METHOD OF FABRICATING SAME | Medtronic MiniMed, Inc. (US) | 2004-07-14 | — | — | EP | disclosed |
| US-20040061232-A1 | Alternating metallization and dielectric layers formed without firing; vias formed by placing pillars on top; printing sheets contain conductive ink and pressure plates | MEDTRONIC MINIMED, INC. | 2004-04-01 | — | — | US | disclosed |
| WO-2003023388-A1 | SENSOR SUBSTRATE AND METHOD OF FABRICATING SAME | MEDTRONIC MINIMED, INC. (US) | 2003-03-20 | — | — | WO | disclosed |
| US-20030049166-A1 | Used for sensing a variety of parameters, including physiological parameters; portable diagnostic medical equipment | MEDTRONIC MINIMED, INC. | 2003-03-13 | — | — | US | disclosed |
| US-20020090805-A1 | Electroplating method of fabrication of the solder bumps which method does not damage air bridges, micro-electromechanical structures, or optical surfaces that can be otherwise damaged | HRL LABORATORIES, LLC | 2002-07-11 | — | — | US | disclosed |
| US-6387793-B1 | METALLIZATION; APPLYING SOLDER BUMPS; HEATING | HRL LABORATORIES, LLC | 2002-05-14 | — | — | US | disclosed |