SCHEMBL1023960

SCHEMBL1023960

C=CC(=O)OC(C)CC1(C(=O)O)C=CCCC1C(=O)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3948148 0.79 CYP3A4 (0.33)
SCHEMBL15789417 0.77 TSHR (0.35)
SCHEMBL21618418 0.77
SCHEMBL8465029 0.75
SCHEMBL23121532 0.75
SCHEMBL29507134 0.75 TSHR (0.40)
SCHEMBL29670349 0.74 TSHR (0.42)
SCHEMBL987630 0.74
SCHEMBL3158509 0.72
SCHEMBL691185 0.71 TSHR (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 51 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117363183-A UV adhesive composition, preparation process and polarizing plate thereof 福州恒美光电材料有限公司 2024-01-09 CN claimed
US-12091537-B2 Composition and molded article containing fluorine-containing polymer DAIKIN INDUSTRIES, LTD. (JP) 2024-09-17 US disclosed
CN-117363183-A UV adhesive composition, preparation process and polarizing plate thereof 福州恒美光电材料有限公司 2024-01-09 CN disclosed
CN-116157738-A Photocurable colored resin composition, cured product, color filter, and display device DNP精细化工股份有限公司 2023-05-23 CN disclosed
US-11629262-B2 Liquid composition set, cured product forming method, and liquid composition RICOH COMPANY, LTD. (JP) 2023-04-18 US disclosed
CN-112513175-B Fluoropolymer-containing composition and molded article 大金工业株式会社 2023-02-21 CN disclosed
WO-2022070977-A1 PHOTOCURABLE COLORED RESIN COMPOSITION, CURED PRODUCT, COLOR FILTER, AND DISPLAY DEVICE 株式会社DNPファインケミカル 2022-04-07 WO disclosed
US-20210317295-A1 COMPOSITION AND MOLDED ARTICLE CONTAINING FLUORINE-CONTAINING POLYMER DAIKIN INDUSTRIES, LTD. (JP) 2021-10-14 US disclosed
US-11061175-B2 Polarizing film, method for producing same, optical film, image display device, and adhesion improvement-treated polarizer NITTO DENKO CORPORATION (JP) 2021-07-13 US disclosed
US-11046719-B2 Organic metal compound-containing composition NITTO DENKO CORPORATION (JP) 2021-06-29 US disclosed
US-20110036914-A1 ANTENNA CIRCUIT CONSTITUENT BODY FOR IC CARD/TAG AND IC CARD TOYO ALUMINIUM KABUSHIKI KAISHA (JP) 2011-02-17 US disclosed
EP-2276113-A1 ANTENNA CIRCUIT CONFIGURING BODY FOR IC CARD/TAG, AND IC CARD TOYO ALUMINIUM KABUSHIKI KAISHA (JP) 2011-01-19 EP disclosed
EP-1477928-B1 Antenna coil for IC card and manufacturing method thereof TOYO ALUMINIUM KK (JP) 2009-06-17 EP disclosed
EP-1172760-B1 Antenna coil for IC card and manufacturing method thereof TOYO ALUMINIUM KK (JP) 2004-12-01 EP disclosed
EP-1477928-A1 Antenna coil for IC card and manufacturing method thereof TOYO ALUMINIUM KABUSHIKI KAISHA (JP) 2004-11-17 EP disclosed
EP-1432770-A1 COATING COMPOSITIONS HAVING EPOXY FUNCTIONAL STABILIZER Valspar Sourcing, Inc. (US) 2004-06-30 EP disclosed
WO-2003022944-A1 COATING COMPOSITIONS HAVING EPOXY FUNCTIONAL STABILIZER VALSPAR SOURCING, INC. (US) 2003-03-20 WO disclosed
US-6400323-B2 BASE MATERIAL CONTAINING RESIN AND HAVING A THICKNESS OF 15-70 MUM; AND CIRCUIT PATTERN LAYER FORMED ON A SURFACE OF SAID BASE MATERIAL, HAVING A THICKNESS OF 7-60 MUM, FORMED OF A FOIL CONTAINING ALUMINUM OF 97.5-99.7 MASS % TOYO ALUMINIUM KABUSHIKI KAISHA (JP) 2002-06-04 US disclosed
US-20020015002-A1 Antenna coil for IC card and manufacturing method thereof TOYO ALUMINIUM KABUSHIKI KAISHA (JP) 2002-02-07 US disclosed
EP-1172760-A1 Antenna coil for IC card and manufacturing method thereof TOYO ALUMINIUM KABUSHIKI KAISHA (JP) 2002-01-16 EP disclosed