Oxalic Acid

Oxalic Acid

SCHEMBL1029259

C=C.C=C.O=C(O)C(=O)O

nearest known ligand 0.44

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Known targets — ChEMBL curated mechanism

OPRM1SLC6A4

The experimentally established mechanism targets of Oxalic Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA1 P00915 1/20 0.44
CA2 P00918 1/20 0.44
CA9 Q16790 1/20 0.44
LDHA P00338 2/20 0.42
LDHB P07195 1/20 0.42
LMNA P02545 2/20 0.39
ACHE P22303 1/20 0.36
FFAR3 O14843 1/20 0.36
LCK P06239 1/20 0.36
FYN P06241 1/20 0.36
KDM5B Q9UGL1 1/20 0.36
OR51E2 Q9H255 1/20 0.33
TSHR P16473 2/20 0.31
EGLN1 Q9GZT9 2/20 0.31
SRR Q9GZT4 1/20 0.31
TP53 P04637 1/20 0.31
ALKBH5 Q6P6C2 1/20 0.31
SUCNR1 Q9BXA5 1/20 0.31
EGLN3 Q9H6Z9 1/20 0.31
PEPD P12955 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Oxalic Acid SCHEMBL34345 1.00
Oxalic Acid SCHEMBL29462943 1.00 CA1 (0.44) CA1CA2CA9LDHALDHB
Oxalic Acid SCHEMBL11343962 0.94 CA1 (0.40) CA1CA2CA9LDHALDHB
Oxalic Acid SCHEMBL28028643 0.94
Oxalic Acid SCHEMBL21145304 0.94
Oxalic Acid SCHEMBL6968373 0.88
Oxalic Acid SCHEMBL11805656 0.87 CA1 (0.57) CA1CA2CA9LDHALDHB
Oxalic Acid SCHEMBL8432824 0.87
Oxalic Acid SCHEMBL11211823 0.87 CA1 (0.57) CA1CA2CA9LDHALDHB
Oxalic Acid SCHEMBL776 0.87

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0784326-B1 Flexible thick film conductor composition DU PONT (US) 2003-04-23 EP claimed
US-5653918-A ELECTRICAL CONDUCTIVE METAL DISPERSED IN A TERPOLYMER OF VINYL ACETATE, VINYL CHLORIDE WITH VINYL ALCOHOL OR A HYDROXYALKYL ACRYLATE; COHESIVE STRENGTH; ADHESION; DURABLE, FLEXIBLE MEMBRANE TOUCH SWITCHES E. I. DU PONT DE NEMOURS AND COMPANY (US) 1997-08-05 US claimed
EP-0784326-A2 Flexible thick film conductor composition E.I. DU PONT DE NEMOURS AND COMPANY (US) 1997-07-16 EP claimed
EP-3625284-B1 POLYESTER COPOLYMER AVANTIUM KNOWLEDGE CENTRE BV (NL) 2025-05-07 EP disclosed
US-11306179-B2 Polyester copolymer AVANTIUM KNOWLEDGE CENTRE B.V. (NL) 2022-04-19 US disclosed
EP-2274651-A1 THICK FILM RECYCLING METHOD E. I. du Pont de Nemours and Company (US) 2011-01-19 EP disclosed
US-20100209843-A1 PROCESS FOR THICK FILM CIRCUIT PATTERNING E. I. DU PONT DE NEMOURS AND COMPANY (US) 2010-08-19 US disclosed
WO-2010094017-A1 PROCESS FOR THICK FILM CIRCUIT PATTERNING E. I. DU PONT DE NEMOURS AND COMPANY (US) 2010-08-19 WO disclosed
US-7741013-B2 Process for thick film circuit patterning E.I. DU PONT DE NEMOURS AND COMPANY (US) 2010-06-22 US disclosed
US-20100104829-A1 PROCESS FOR THICK FILM CIRCUIT PATTERNING E.I.DU PONT DE NEMOURS AND COMPANY (US) 2010-04-29 US disclosed
US-20090277582-A1 THICK FILM RECYCLING METHOD E. I. DU PONT DE NEMOURS AND COMPANY (US) 2009-11-12 US disclosed
EP-1355519-A2 An improved method to embed thick film components E.I. DUPONT DE NEMOURS AND COMPANY (US) 2003-10-22 EP disclosed
US-20030154592-A1 Method to embed thick film components CHEMTRON RESEARCH LLC 2003-08-21 US disclosed
EP-1321949-A2 Thick film composition yielding magnetic properties E.I. DU PONT DE NEMOURS AND COMPANY (US) 2003-06-25 EP disclosed
US-20030113573-A1 Thick film composition yielding magnetic properties E. I. DU PONT DE NEMOURS AND COMPANY 2003-06-19 US disclosed
EP-0784326-B1 Flexible thick film conductor composition DU PONT (US) 2003-04-23 EP disclosed
EP-1295518-A2 PROCESS FOR THICK FILM CIRCUIT PATTERNING E. I. du Pont de Nemours and Company (US) 2003-03-26 EP disclosed
WO-2002003766-A2 PROCESS FOR THICK FILM CIRCUIT PATTERNING E. I. DU PONT DE NEMOURS AND COMPANY (US) 2002-01-10 WO disclosed
US-5653918-A ELECTRICAL CONDUCTIVE METAL DISPERSED IN A TERPOLYMER OF VINYL ACETATE, VINYL CHLORIDE WITH VINYL ALCOHOL OR A HYDROXYALKYL ACRYLATE; COHESIVE STRENGTH; ADHESION; DURABLE, FLEXIBLE MEMBRANE TOUCH SWITCHES E. I. DU PONT DE NEMOURS AND COMPANY (US) 1997-08-05 US disclosed
EP-0784326-A2 Flexible thick film conductor composition E.I. DU PONT DE NEMOURS AND COMPANY (US) 1997-07-16 EP disclosed