⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10412070 | 1.00 | — | — | |
| SCHEMBL10412067 | 0.98 | — | — | |
| SCHEMBL14854110 | 0.92 | — | — | |
| SCHEMBL24071197 | 0.91 | — | — | |
| SCHEMBL2112356 | 0.89 | — | — | |
| SCHEMBL8715169 | 0.86 | — | — | |
| SCHEMBL30277176 | 0.86 | — | — | |
| SCHEMBL5349532 | 0.86 | — | — | |
| SCHEMBL30277230 | 0.86 | — | — | |
| SCHEMBL14265464 | 0.86 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2025106343-A1 | ETCHING METHODS | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2025-05-22 | — | — | WO | claimed |
| US-20250157825-A1 | ETCHING METHODS | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. | 2025-05-15 | — | — | US | claimed |
| US-20240258111-A1 | Surface Treatment Compositions and Methods | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. | 2024-08-01 | — | — | US | claimed |
| US-20230048767-A1 | Surface Treatment Compositions and Methods | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. | 2023-02-16 | — | — | US | claimed |
| US-11447642-B2 | Methods of using surface treatment compositions | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2022-09-20 | — | — | US | claimed |
| EP-4017924-A1 | SURFACE TREATMENT COMPOSITIONS AND METHODS | FUJIFILM Electronic Materials U.S.A., Inc. (US) | 2022-06-29 | — | — | EP | claimed |
| CN-114258420-A | Surface treatment composition and method | 富士胶片电子材料美国有限公司 | 2022-03-29 | — | — | CN | claimed |
| US-11174394-B2 | Surface treatment compositions and articles containing same | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2021-11-16 | — | — | US | claimed |
| US-20210122925-A1 | METHODS OF USING SURFACE TREATMENT COMPOSITIONS | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. | 2021-04-29 | — | — | US | claimed |
| US-20210057210-A1 | Surface Treatment Compositions and Methods | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. | 2021-02-25 | — | — | US | claimed |
| US-20200035494-A1 | Surface Treatment Compositions and Methods | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. | 2020-01-30 | — | — | US | claimed |
| US-20190211210-A1 | SURFACE TREATMENT COMPOSITIONS AND METHODS | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. | 2019-07-11 | — | — | US | claimed |
| US-20150275127-A1 | LOW VISCOSITY, LOW VOLATILITY LUBRICATING OIL BASESTOCKS | EXXONMOBIL RESEARCH AND ENGINEERING COMPANY (US) | 2015-10-01 | — | — | US | claimed |
| WO-2025106343-A1 | ETCHING METHODS | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2025-05-22 | — | — | WO | disclosed |
| US-20250157825-A1 | ETCHING METHODS | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. | 2025-05-15 | — | — | US | disclosed |
| WO-2025096565-A1 | ETCHING COMPOSITIONS | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2025-05-08 | — | — | WO | disclosed |
| US-20120315536-A1 | Materials for Battery Electrolytes and Methods for Use | WILDCAT DISCOVERY TECHNOLOGIES, INC. (US) | 2012-12-13 | — | — | US | disclosed |
| US-20120315534-A1 | Materials for Battery Electrolytes and Methods for Use | WILDCAT DISCOVERY TECHNOLOGIES, INC. (US) | 2012-12-13 | — | — | US | disclosed |
| US-8308971-B1 | Materials for battery electrolytes and methods for use | WILDCAT DISCOVERY TECHNOLOGIES, INC. (US) | 2012-11-13 | — | — | US | disclosed |
| US-4968828-A | IMPROVING HEAT AND CHEMICAL RESISTANCE OF SILICONES | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1990-11-06 | — | — | US | disclosed |