SCHEMBL1043483

SCHEMBL1043483

Cc1ccccc1-c1ccccc1OP(=O)(O)O

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
INPPL1 O15357 7/20 0.50
INPP5A Q14642 4/20 0.50
INPP5B P32019 2/20 0.50
SRC P12931 4/20 0.49
KDM4E B2RXH2 2/20 0.49
USP2 O75604 1/20 0.49
ALDH1A1 P00352 1/20 0.49
HPGD P15428 1/20 0.49
PDE3A Q14432 1/20 0.49
HSD17B10 Q99714 1/20 0.49
AKT1 P31749 1/20 0.44
MAPT P10636 1/20 0.41
MEN1 O00255 1/20 0.40
LMNA P02545 1/20 0.40
KMT2A Q03164 1/20 0.40
CYP1A2 P05177 1/20 0.37
CYP3A4 P08684 1/20 0.37
CYP2C19 P33261 1/20 0.37
AKR1C3 P42330 1/20 0.37
AKR1C2 P52895 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9645945 0.88 INPPL1 (0.61) INPPL1INPP5AINPP5BSRCKDM4E
SCHEMBL3873601 0.88 INPPL1 (0.50) INPPL1INPP5AINPP5BSRCKDM4E
SCHEMBL15811768 0.86 INPPL1 (0.49) INPPL1INPP5AINPP5BSRCKDM4E
SCHEMBL31389012 0.86 INPPL1 (0.52) INPPL1INPP5AINPP5BSRCKDM4E
SCHEMBL3873597 0.85 INPPL1 (0.43) INPPL1INPP5AINPP5BSRCKDM4E
SCHEMBL28975675 0.85 MAPT (0.43) KDM4EALDH1A1HPGDMAPTMEN1
SCHEMBL1100136 0.84 INPPL1 (0.57) INPPL1INPP5AINPP5BSRCKDM4E
Hydrochloric Acid SCHEMBL11749404 0.82 INPPL1 (0.55) INPPL1INPP5AINPP5BSRCKDM4E
SCHEMBL29199066 0.82 INPPL1 (0.55) INPPL1INPP5AINPP5BSRCKDM4E
O-Xylene SCHEMBL29031713 0.82 INPPL1 (0.55) INPPL1INPP5AINPP5BSRCKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114716805-B Resin composition, connection structure for solar power generation module, and junction box for solar power generation module 旭化成株式会社 2024-11-26 CN disclosed
CN-115003756-B Resin composition 松下知识产权经营株式会社 2024-10-01 CN disclosed
CN-115942980-B Foam extinguishing agent 雅托普罗德克株式会社 2024-07-02 CN disclosed
CN-118234771-A Adhesive, laminate, and packaging material DIC株式会社 2024-06-21 CN disclosed
CN-118234824-A Adhesive, laminate, method for producing laminate, and packaging material DIC株式会社 2024-06-21 CN disclosed
CN-117897463-A Method for producing urethane prepolymer DIC株式会社 2024-04-16 CN disclosed
CN-117897462-A Adhesive, laminate, and packaging material DIC株式会社 2024-04-16 CN disclosed
CN-112789305-B Photocurable composition 三键有限公司 2023-08-15 CN disclosed
CN-115942980-A Foam fire extinguishing agent 雅托普罗德克株式会社 2023-04-07 CN disclosed
CN-115461424-A Adhesive, laminate, method for producing laminate, and packaging material DIC株式会社 2022-12-09 CN disclosed
CN-112143206-A Shaped body 旭化成株式会社 2020-12-29 CN disclosed
CN-111954697-A Resin composition, molded article, and use thereof AGC株式会社 2020-11-17 CN disclosed
CN-111849162-A Thin-walled component and container 旭化成株式会社 2020-10-30 CN disclosed
CN-107995891-B Insulating film and flexible flat cable 株式会社斗山 2020-10-30 CN disclosed
CN-107072924-B Photocurable composition for top coat of nail or artificial nail 三键有限公司 2020-08-14 CN disclosed
CN-106687490-B Polyol composition for rigid polyurethane foam, and method for producing rigid polyurethane foam 积水索夫兰薇姿株式会社 2020-02-07 CN disclosed
EP-2270091-B1 THERMOPLASTIC RESIN COMPOSITION DENKI KAGAKU KOGYO KK (JP) 2014-07-30 EP disclosed
US-8461264-B2 Thermoplastic resin composition DENKI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 2013-06-11 US disclosed
US-20110040038-A1 THERMOPLASTIC RESIN COMPOSITION DENKI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 2011-02-17 US disclosed
EP-2270091-A1 THERMOPLASTIC RESIN COMPOSITION Denki Kagaku Kogyo Kabushiki Kaisha (JP) 2011-01-05 EP disclosed