Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TP53 | P04637 | 1/20 | 0.74 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.74 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.52 |
| ▸ | MGLL | Q99685 | 3/20 | 0.40 |
| ▸ | TSHR | P16473 | 1/20 | 0.38 |
| ▸ | LMNA | P02545 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL18428568 | 1.00 | TP53 (0.74) | TP53CYP3A4ALDH1A1MGLLTSHR | |
| SCHEMBL31688117 | 0.93 | TP53 (0.85) | TP53CYP3A4ALDH1A1MGLLTSHR | |
| SCHEMBL1464481 | 0.92 | TP53 (0.65) | TP53CYP3A4ALDH1A1MGLLLMNA | |
| SCHEMBL1644180 | 0.88 | TP53 (0.65) | TP53CYP3A4ALDH1A1MGLL | |
| SCHEMBL7726456 | 0.88 | TP53 (0.70) | TP53CYP3A4ALDH1A1MGLLTSHR | |
| SCHEMBL444257 | 0.88 | TP53 (0.65) | TP53CYP3A4ALDH1A1MGLLTSHR | |
| SCHEMBL14550604 | 0.86 | TP53 (0.73) | TP53CYP3A4ALDH1A1MGLLTSHR | |
| SCHEMBL20195894 | 0.86 | TP53 (0.62) | TP53CYP3A4ALDH1A1MGLL | |
| SCHEMBL8728323 | 0.85 | TP53 (1.00) | TP53CYP3A4ALDH1A1MGLLTSHR | |
| SCHEMBL18513488 | 0.85 | TP53 (1.00) | TP53CYP3A4ALDH1A1MGLLTSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 129 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12428524-B2 | Fluorine-containing copolymer | DAIKIN INDUSTRIES, LTD. (JP) | 2025-09-30 | — | — | US | disclosed |
| US-20250101228-A1 | COMPOSITION AND ARTICLE | DAIKIN INDUSTRIES, LTD. (JP) | 2025-03-27 | — | — | US | disclosed |
| EP-4512861-A1 | COMPOSITION AND ARTICLE | DAIKIN INDUSTRIES, LTD. (JP) | 2025-02-26 | — | — | EP | disclosed |
| US-20240206322-A1 | OPTICAL SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SAME, SOLID-STATE IMAGING DEVICE, AND ELECTRONIC DEVICE | KANEKA CORPORATION (JP) | 2024-06-20 | — | — | US | disclosed |
| EP-4299677-A1 | SURFACE TREATMENT AGENT | Daikin Industries, Ltd. (JP) | 2024-01-03 | — | — | EP | disclosed |
| US-20230406974-A1 | SURFACE TREATMENT AGENT | DAIKIN INDUSTRIES, LTD. (JP) | 2023-12-21 | — | — | US | disclosed |
| US-20230408923-A1 | SUBSTRATE LAMINATE, IMAGE SENSOR, AND METHOD FOR MANUFACTURING SUBSTRATE LAMINATE | KANEKA CORPORATION (JP) | 2023-12-21 | — | — | US | disclosed |
| CN-117121184-A | Optical semiconductor device, method for manufacturing the same, solid-state imaging device, and electronic apparatus | 株式会社钟化 | 2023-11-24 | — | — | CN | disclosed |
| CN-117083706-A | Substrate laminate, image sensor, and method for manufacturing substrate laminate | 株式会社钟化 | 2023-11-17 | — | — | CN | disclosed |
| EP-4209523-A1 | SILICONE COPOLYMER | Daikin Industries, Ltd. (JP) | 2023-07-12 | — | — | EP | disclosed |
| WO-2006057421-A1 | LIGHT-EMITTING DIODE ILLUMINATION SOURCE | SHOWA DENKO K.K. (JP) | 2006-06-01 | — | — | WO | disclosed |
| WO-2006038638-A1 | ORGANOPOLYSILOXANE AND CURABLE SILICONE COMPOSITION THAT CONTAINS AFOREMENTIONED ORGANOPOLYSILOXANE | DOW CORNING TORAY CO., LTD. (JP) | 2006-04-13 | — | — | WO | disclosed |
| CN-1753966-A | Curable composition and method for preparing same, light-shielding paste, light-shielding resin and method for forming same, package for light-emitting diode, and semiconductor device | KANEGAFUCHI CHEMICAL IND (JP) | 2006-03-29 | — | — | CN | disclosed |
| WO-2006025512-A1 | LIGHT-EMITTING BODY, LIGHTING DEVICE AND DISPLAY DEVICE USING THE SAME | SHOWA DENKO K.K. (JP) | 2006-03-09 | — | — | WO | disclosed |
| EP-1609835-A1 | CURING COMPOSITION AND METHOD FOR PREPARING SAME, LIGHT-SHIELDING PASTE, LIGHT-SHIELDING RESIN AND METHOD FOR PRODUCING SAME, PACKAGE FOR LIGHT-EMITTING DIODE, AND SEMICONDUCTOR DEVICE | KANEKA CORPORATION (JP) | 2005-12-28 | — | — | EP | disclosed |
| US-20050209400-A1 | 1,3,5,7-tetramethylcyclotetrasiloxane and triallyl isocyanurate, a hydrosilylation catalyst, a silane coupling agent and/or an epoxy group-containing compound, and a silanol condensation catalyst | KANEKA CORPORATION (JP) | 2005-09-22 | — | — | US | disclosed |
| CN-1649964-A | Curable composition, cured product, method for producing the same, and light emitting diode sealed with the cured product | KANEGAFUCHI CHEMICAL IND (JP) | 2005-08-03 | — | — | CN | disclosed |
| EP-1505121-A1 | HARDENABLE COMPOSITION, HARDENING PRODUCT, PROCESS FOR PRODUCING THE SAME AND LIGHT EMITTING DIODE SEALED WITH THE HARDENING PRODUCT | KANEKA CORPORATION (JP) | 2005-02-09 | — | — | EP | disclosed |
| US-20040126504-A1 | curing agent having at least two SiH groups obtained by subjecting a compound having at least two carbon-carbon double bonds (e.g., triallyl isocyanurate) an acyclic and/or cyclic siloxane having at least two SiH groupsto hydrosilylation | KANEKA CORPORATION (JP) | 2004-07-01 | — | — | US | disclosed |
| EP-1369458-A1 | CURING AGENTS, CURABLE COMPOSITIONS, COMPOSITIONS FOR OPTICAL MATERIALS, OPTICAL MATERIALS, THEIR PRODUCTION, AND LIQUID CRYSTAL DISPLAYS AND LED'S MADE BY USING THE MATERIALS | KANEKA CORPORATION (JP) | 2003-12-10 | — | — | EP | disclosed |