⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5992339 | 0.73 | — | — | |
| SCHEMBL28159028 | 0.70 | — | — | |
| SCHEMBL4432856 | 0.65 | — | — | |
| SCHEMBL250650 | 0.64 | — | — | |
| SCHEMBL21679572 | 0.62 | — | — | |
| Ammonia Solution, Strong SCHEMBL7108016 | 0.62 | — | — | |
| SCHEMBL2284844 | 0.62 | — | — | |
| SCHEMBL28916294 | 0.61 | — | — | |
| SCHEMBL1889149 | 0.61 | — | — | |
| SCHEMBL4101160 | 0.61 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7998875-B2 | Vapor phase repair and pore sealing of low-K dielectric materials | LAM RESEARCH CORPORATION (US) | 2011-08-16 | — | — | US | claimed |
| US-20110020955-A1 | VAPOR PHASE REPAIR AND PORE SEALING OF LOW-K DIELECTRIC MATERIALS | LAM RESEARCH CORPORATION | 2011-01-27 | — | — | US | claimed |
| WO-2009085098-A1 | VAPOR PHASE REPAIR AND PORE SEALING OF LOW-K DIELECTRIC MATERIALS | LAM RESEARCH CORPORATION (US) | 2009-07-09 | — | — | WO | claimed |
| US-7998875-B2 | Vapor phase repair and pore sealing of low-K dielectric materials | LAM RESEARCH CORPORATION (US) | 2011-08-16 | — | — | US | disclosed |
| US-20110020955-A1 | VAPOR PHASE REPAIR AND PORE SEALING OF LOW-K DIELECTRIC MATERIALS | LAM RESEARCH CORPORATION | 2011-01-27 | — | — | US | disclosed |
| WO-2009085098-A1 | VAPOR PHASE REPAIR AND PORE SEALING OF LOW-K DIELECTRIC MATERIALS | LAM RESEARCH CORPORATION (US) | 2009-07-09 | — | — | WO | disclosed |