⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7795741 | 0.78 | — | — | |
| SCHEMBL19874957 | 0.78 | — | — | |
| SCHEMBL6438557 | 0.77 | — | — | |
| SCHEMBL661674 | 0.72 | — | — | |
| Methoxymethane SCHEMBL28523857 | 0.72 | — | — | |
| SCHEMBL20556575 | 0.70 | — | — | |
| SCHEMBL28575447 | 0.69 | — | — | |
| SCHEMBL15453 | 0.69 | — | — | |
| SCHEMBL20541888 | 0.69 | — | — | |
| SCHEMBL27940545 | 0.69 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7998875-B2 | Vapor phase repair and pore sealing of low-K dielectric materials | LAM RESEARCH CORPORATION (US) | 2011-08-16 | — | — | US | claimed |
| US-20110020955-A1 | VAPOR PHASE REPAIR AND PORE SEALING OF LOW-K DIELECTRIC MATERIALS | LAM RESEARCH CORPORATION | 2011-01-27 | — | — | US | claimed |
| WO-2009085098-A1 | VAPOR PHASE REPAIR AND PORE SEALING OF LOW-K DIELECTRIC MATERIALS | LAM RESEARCH CORPORATION (US) | 2009-07-09 | — | — | WO | claimed |
| US-7998875-B2 | Vapor phase repair and pore sealing of low-K dielectric materials | LAM RESEARCH CORPORATION (US) | 2011-08-16 | — | — | US | disclosed |
| US-20110020955-A1 | VAPOR PHASE REPAIR AND PORE SEALING OF LOW-K DIELECTRIC MATERIALS | LAM RESEARCH CORPORATION | 2011-01-27 | — | — | US | disclosed |
| WO-2009085098-A1 | VAPOR PHASE REPAIR AND PORE SEALING OF LOW-K DIELECTRIC MATERIALS | LAM RESEARCH CORPORATION (US) | 2009-07-09 | — | — | WO | disclosed |