SCHEMBL1060929

SCHEMBL1060929

FCc1c(F)c(F)c(F)c(F)c1[B-](c1c(F)c(F)c(F)c(F)c1CF)(c1c(F)c(F)c(F)c(F)c1CF)c1c(F)c(F)c(F)c(F)c1CF

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8511134 0.75
SCHEMBL4870244 0.72
SCHEMBL8591536 0.71
SCHEMBL22478 0.71
Methylamine SCHEMBL30023004 0.69
SCHEMBL29486245 0.69
SCHEMBL4660651 0.68
Potassium Ion SCHEMBL134248 0.68
SCHEMBL6378515 0.68
SCHEMBL951299 0.68

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 95 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240240066-A1 REACTIVE ADHESIVE TAPE THAT CAN BE STAMPED TESA SE (DE) 2024-07-18 US disclosed
EP-4397545-A2 RIGID CABLE HARNESS WITH A CURABLE SLEEVE AND METHOD FOR FORMING SUCH CABLE HARNESS TESA SE (DE) 2024-07-10 EP disclosed
US-20240206322-A1 OPTICAL SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SAME, SOLID-STATE IMAGING DEVICE, AND ELECTRONIC DEVICE KANEKA CORPORATION (JP) 2024-06-20 US disclosed
EP-4363514-A1 REACTIVE ADHESIVE TAPE THAT CAN BE STAMPED TESA SE (DE) 2024-05-08 EP disclosed
US-11965121-B2 UV-curable adhesive tape and method for jacketing elongated items, especially leads TESA SE (DE) 2024-04-23 US disclosed
US-20240117223-A1 POLYVINYL AROMATE-POLYDIENE-BLOCK COPOLYMER-BASED ADHESIVE COMPOUNDS HAVING IMPROVED THERMAL SHEAR STRENGTH TESA SE (DE) 2024-04-11 US disclosed
US-20240106046-A1 METHOD FOR CLADDING A BATTERY CELL TESA SE (DE) 2024-03-28 US disclosed
US-11926769-B2 Storage-stable, reactive, pressure-sensitive adhesive tape TESA SE (DE) 2024-03-12 US disclosed
US-11866614-B2 Pressure-sensitive adhesive compound containing a cross-linked nanoparticle network, method of production and use thereof TESA SE (DE) 2024-01-09 US disclosed
US-20230408923-A1 SUBSTRATE LAMINATE, IMAGE SENSOR, AND METHOD FOR MANUFACTURING SUBSTRATE LAMINATE KANEKA CORPORATION (JP) 2023-12-21 US disclosed
US-20090252932-A1 ACTINIC ENERGY RAY CURABLE RESION COMPOSITION AND USE THEREOF KURARAY CO., LTD. (JP) 2009-10-08 US disclosed
US-20090234072-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2009-09-17 US disclosed
EP-1923431-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2008-05-21 EP disclosed
US-20070189671-A1 Method for manufacturing optical waveguide chip SR CORPORATION (JP) 2007-08-16 US disclosed
US-7162131-B2 Radiation-curable composition, optical waveguide and method for formation thereof JSR CORPORATION (JP) 2007-01-09 US disclosed
US-20060165362-A1 Radiation curable composition, optical waveguide and method for formation thereof JSR CORPORATION (JP) 2006-07-27 US disclosed
US-7005231-B2 Positive type radiosensitive composition and method for forming pattern JSR CORPORATION (JP) 2006-02-28 US disclosed
EP-1605021-A1 RADIATION CURABLE COMPOSITION, OPTICAL WAVEGUIDE AND METHOD FOR FORMATION THEREOF JSR Corporation (JP) 2005-12-14 EP disclosed
US-20040197698-A1 Positive type radiosensitive composition and method for forming pattern JSR CORPORATION (JP) 2004-10-07 US disclosed
EP-1411390-A1 POSITIVE TYPE RADIOSENSITIVE COMPOSITION AND METHOD FOR FORMING PATTERN JSR Corporation (JP) 2004-04-21 EP disclosed