⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1065649 | 0.78 | — | — | |
| SCHEMBL1065426 | 0.75 | — | — | |
| SCHEMBL1066950 | 0.75 | — | — | |
| SCHEMBL1066673 | 0.73 | — | — | |
| SCHEMBL15914973 | 0.73 | — | — | |
| SCHEMBL1066529 | 0.70 | — | — | |
| SCHEMBL1313815 | 0.69 | — | — | |
| SCHEMBL1066628 | 0.69 | — | — | |
| SCHEMBL81570 | 0.67 | — | — | |
| SCHEMBL1066376 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2584005-B1 | TYPICAL METAL CONTAINING POLYSILOXANE COMPOSITION, PROCESS FOR PRODUCTION OF SAME, AND USES THEREOF | TOSOH CORP (JP) | 2018-02-21 | — | — | EP | disclosed |
| EP-2278612-B1 | Material composed of organosilane or organosiloxane compound for insulating film, its production method and semiconductor device | TOSOH CORP (JP) | 2014-12-10 | — | — | EP | disclosed |
| US-8907038-B2 | Typical metal containing polysiloxane composition, process for its production, and its uses | TOSOH CORPORATION (JP) | 2014-12-09 | — | — | US | disclosed |
| EP-2584005-A1 | TYPICAL METAL CONTAINING POLYSILOXANE COMPOSITION, PROCESS FOR PRODUCTION OF SAME, AND USES THEREOF | Tosoh Corporation (JP) | 2013-04-24 | — | — | EP | disclosed |
| US-20130090447-A1 | TYPICAL METAL CONTAINING POLYSILOXANE COMPOSITION, PROCESS FOR ITS PRODUCTION, AND ITS USES | TOSOH CORPORATION (JP) | 2013-04-11 | — | — | US | disclosed |
| CN-101442003-B | Organosilane-containing material for insulation film, method for producing the same, and semiconductor device | TOSOH CORP | 2012-12-26 | — | — | CN | disclosed |
| EP-1566835-B1 | INSULATING FILM MATERIAL CONTAINING ORGANIC SILANE OR ORGANIC SILOXANE COMPOUND, METHOD FOR PRODUCING SAME, AND SEMICONDUCTOR DEVICE | TOSOH CORP (JP) | 2012-08-01 | — | — | EP | disclosed |
| US-7935425-B2 | Insulating film material containing organic silane or organic siloxane compound, method for producing same, and semiconductor device | TOSOH CORPORATION (JP) | 2011-05-03 | — | — | US | disclosed |
| EP-2278612-A2 | Material composed of organosilane or organosiloxane compound for insulating film, its production method and semiconductor device | Tosoh Corporation (JP) | 2011-01-26 | — | — | EP | disclosed |
| CN-101442003-A | Organosilane-containing material for insulation film, method for producing the same, and semiconductor device | TOSOH CORP (JP) | 2009-05-27 | — | — | CN | disclosed |
| CN-100444330-C | Material for insulating film containing organosilane and organosiloxane compound, method for producing same, and semiconductor device | TOSOH CORP (JP) | 2008-12-17 | — | — | CN | disclosed |
| US-20060151884-A1 | Insulatng film material containing organic silane or organic siloxane compound, method for produing sane, and semiconductor device | TOSOH CORPORATION (JP) | 2006-07-13 | — | — | US | disclosed |
| CN-1717792-A | Material for insulating film containing organosilane and organosiloxane compound, method for producing same, and semiconductor device | TOSOH CORP (JP) | 2006-01-04 | — | — | CN | disclosed |
| EP-1566835-A1 | INSULATING FILM MATERIAL CONTAINING ORGANIC SILANE OR ORGANIC SILOXANE COMPOUND, METHOD FOR PRODUCING SAME, AND SEMICONDUCTOR DEVICE | Tosoh Corporation (JP) | 2005-08-24 | — | — | EP | disclosed |