⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15301808 | 0.77 | — | — | |
| SCHEMBL21847344 | 0.76 | — | — | |
| SCHEMBL8582007 | 0.74 | — | — | |
| SCHEMBL28795096 | 0.74 | — | — | |
| SCHEMBL1065653 | 0.72 | — | — | |
| SCHEMBL1066528 | 0.70 | — | — | |
| SCHEMBL21847338 | 0.70 | — | — | |
| SCHEMBL1066037 | 0.70 | — | — | |
| SCHEMBL1066676 | 0.70 | — | — | |
| SCHEMBL21847351 | 0.69 | GAA (0.37) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2584005-B1 | TYPICAL METAL CONTAINING POLYSILOXANE COMPOSITION, PROCESS FOR PRODUCTION OF SAME, AND USES THEREOF | TOSOH CORP (JP) | 2018-02-21 | — | — | EP | disclosed |
| EP-2278612-B1 | Material composed of organosilane or organosiloxane compound for insulating film, its production method and semiconductor device | TOSOH CORP (JP) | 2014-12-10 | — | — | EP | disclosed |
| US-8907038-B2 | Typical metal containing polysiloxane composition, process for its production, and its uses | TOSOH CORPORATION (JP) | 2014-12-09 | — | — | US | disclosed |
| US-8791221-B2 | Addition-curable metallosiloxane compound | DAICEL CORPORATION (JP) | 2014-07-29 | — | — | US | disclosed |
| EP-2650319-A1 | ADDITION-CURABLE METALLOSILOXANE COMPOUND | Daicel Corporation (JP) | 2013-10-16 | — | — | EP | disclosed |
| US-20130267653-A1 | ADDITION-CURABLE METALLOSILOXANE COMPOUND | DAICEL CORPORATION (JP) | 2013-10-10 | — | — | US | disclosed |
| EP-2584005-A1 | TYPICAL METAL CONTAINING POLYSILOXANE COMPOSITION, PROCESS FOR PRODUCTION OF SAME, AND USES THEREOF | Tosoh Corporation (JP) | 2013-04-24 | — | — | EP | disclosed |
| US-20130090447-A1 | TYPICAL METAL CONTAINING POLYSILOXANE COMPOSITION, PROCESS FOR ITS PRODUCTION, AND ITS USES | TOSOH CORPORATION (JP) | 2013-04-11 | — | — | US | disclosed |
| EP-1566835-B1 | INSULATING FILM MATERIAL CONTAINING ORGANIC SILANE OR ORGANIC SILOXANE COMPOUND, METHOD FOR PRODUCING SAME, AND SEMICONDUCTOR DEVICE | TOSOH CORP (JP) | 2012-08-01 | — | — | EP | disclosed |
| US-7935425-B2 | Insulating film material containing organic silane or organic siloxane compound, method for producing same, and semiconductor device | TOSOH CORPORATION (JP) | 2011-05-03 | — | — | US | disclosed |
| EP-2278612-A2 | Material composed of organosilane or organosiloxane compound for insulating film, its production method and semiconductor device | Tosoh Corporation (JP) | 2011-01-26 | — | — | EP | disclosed |
| US-20060151884-A1 | Insulatng film material containing organic silane or organic siloxane compound, method for produing sane, and semiconductor device | TOSOH CORPORATION (JP) | 2006-07-13 | — | — | US | disclosed |
| EP-1566835-A1 | INSULATING FILM MATERIAL CONTAINING ORGANIC SILANE OR ORGANIC SILOXANE COMPOUND, METHOD FOR PRODUCING SAME, AND SEMICONDUCTOR DEVICE | Tosoh Corporation (JP) | 2005-08-24 | — | — | EP | disclosed |