Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA12 | O43570 | 5/20 | 0.39 |
| ▸ | CA6 | P23280 | 5/20 | 0.39 |
| ▸ | CA7 | P43166 | 5/20 | 0.39 |
| ▸ | CA9 | Q16790 | 5/20 | 0.39 |
| ▸ | CA14 | Q9ULX7 | 5/20 | 0.39 |
| ▸ | CA5B | Q9Y2D0 | 5/20 | 0.39 |
| ▸ | CA2 | P00918 | 4/20 | 0.39 |
| ▸ | CA4 | P22748 | 4/20 | 0.39 |
| ▸ | CA5A | P35218 | 4/20 | 0.39 |
| ▸ | CA3 | P07451 | 3/20 | 0.39 |
| ▸ | ALOX15 | P16050 | 3/20 | 0.38 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.38 |
| ▸ | CYP1A2 | P05177 | 3/20 | 0.38 |
| ▸ | CYP2C19 | P33261 | 3/20 | 0.38 |
| ▸ | MEN1 | O00255 | 2/20 | 0.38 |
| ▸ | RECQL | P46063 | 2/20 | 0.38 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.38 |
| ▸ | TSHR | P16473 | 2/20 | 0.38 |
| ▸ | F13A1 | P00488 | 2/20 | 0.38 |
| ▸ | THPO | P40225 | 2/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11655308 | 0.95 | CA12 (0.46) | CA12CA6CA7CA9CA14 | |
| SCHEMBL1930645 | 0.94 | CA12 (0.41) | CA12CA6CA7CA9CA14 | |
| SCHEMBL5005062 | 0.93 | CA12 (0.41) | CA12CA6CA7CA9CA14 | |
| SCHEMBL11762178 | 0.89 | CA12 (0.43) | CA12CA6CA7CA9CA14 | |
| SCHEMBL978491 | 0.86 | TSHR (0.40) | ALDH1A1CYP1A2CYP2C19MEN1KMT2A | |
| SCHEMBL2872173 | 0.86 | CA12 (0.45) | CA12CA6CA7CA9CA14 | |
| SCHEMBL37493 | 0.85 | CA12 (0.42) | CA12CA6CA7CA9CA14 | |
| SCHEMBL6708449 | 0.84 | TSHR (0.39) | ALDH1A1CYP1A2CYP2C19MEN1KMT2A | |
| SCHEMBL483545 | 0.83 | CA12 (0.42) | CA12CA6CA7CA9CA14 | |
| SCHEMBL8582451 | 0.83 | CA12 (0.41) | CA12CA6CA7CA9CA14 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0276860-A2 | Method for preparing urea-functional organosilicon compounds | Toray Silicone Company, Ltd. (JP) | 1988-08-03 | — | — | EP | claimed |
| CN-115968394-A | Ink composition containing luminescent particles, light conversion layer and light-emitting element | DIC株式会社 | 2023-04-14 | — | — | CN | disclosed |
| WO-2022244669-A1 | INK COMPOSITION, LIGHT CONVERSION LAYER, COLOR FILTER, AND LIGHT CONVERSION FILM | DIC株式会社 | 2022-11-24 | — | — | WO | disclosed |
| WO-2022244668-A1 | INK COMPOSITION, LIGHT CONVERSION LAYER, COLOR FILTER, AND LIGHT CONVERSION FILM | DIC株式会社 | 2022-11-24 | — | — | WO | disclosed |
| CN-115362220-A | Resin composition containing light-emitting particles, method for producing same, light-converting layer, and light-emitting element | DIC株式会社 | 2022-11-18 | — | — | CN | disclosed |
| CN-113748185-B | Method for producing light-emitting particle, light-emitting particle dispersion, ink composition, and light-emitting element | DIC株式会社 | 2022-10-04 | — | — | CN | disclosed |
| CN-113785031-B | Method for producing light-emitting particle, light-emitting particle dispersion, ink composition, and light-emitting element | DIC株式会社 | 2022-07-26 | — | — | CN | disclosed |
| US-20220195290-A1 | METHOD FOR PRODUCING LIGHT-EMITTING PARTICLES, LIGHT-EMITTING PARTICLES, LIGHT-EMITTING PARTICLE DISPERSION, INK COMPOSITION, AND LIGHT-EMITTING ELEMENT | DIC CORPORATION (JP) | 2022-06-23 | — | — | US | disclosed |
| US-20220145108-A1 | METHOD FOR PRODUCING LIGHT-EMITTING PARTICLES, LIGHT-EMITTING PARTICLES, LIGHT-EMITTING PARTICLE DISPERSION, INK COMPOSITION, AND LIGHT-EMITTING ELEMENT | DIC CORPORATION (JP) | 2022-05-12 | — | — | US | disclosed |
| EP-3974497-A1 | METHOD FOR PRODUCING LIGHT EMITTING PARTICLES, LIGHT EMITTING PARTICLES, LIGHT EMITTING PARTICLE DISPERSION, INK COMPOSITION AND LIGHT EMITTING ELEMENT | DIC Corporation (JP) | 2022-03-30 | — | — | EP | disclosed |
| US-11209735-B2 | Composition for forming metal-containing film, method of producing composition for forming metal-containing film, semiconductor device, and method of producing semiconductor device | MITSUI CHEMICALS, INC. (JP) | 2021-12-28 | — | — | US | disclosed |
| CN-113785031-A | Method for producing light-emitting particle, light-emitting particle dispersion, ink composition, and light-emitting element | DIC株式会社 | 2021-12-10 | — | — | CN | disclosed |
| CN-113748185-A | Method for producing light-emitting particle, light-emitting particle dispersion, ink composition, and light-emitting element | DIC株式会社 | 2021-12-03 | — | — | CN | disclosed |
| CN-109153884-B | Composition for forming metal-containing film, method for producing composition for forming metal-containing film, semiconductor device, and method for producing semiconductor device | 三井化学株式会社 | 2021-03-09 | — | — | CN | disclosed |
| WO-2020235420-A1 | METHOD FOR PRODUCING LIGHT EMITTING PARTICLES, LIGHT EMITTING PARTICLES, LIGHT EMITTING PARTICLE DISPERSION, INK COMPOSITION AND LIGHT EMITTING ELEMENT | DIC株式会社 (JP) | 2020-11-26 | — | — | WO | disclosed |
| WO-2020235480-A1 | METHOD FOR PRODUCING LIGHT-EMITTING PARTICLES, LIGHT-EMITTING PARTICLES, LIGHT-EMITTING PARTICLE DISPERSION, INK COMPOSITION, AND LIGHT-EMITTING ELEMENT | DIC株式会社 (JP) | 2020-11-26 | — | — | WO | disclosed |
| WO-2020045088-A1 | AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING AND CHEMICAL MECHANICAL POLISHING METHOD | JSR株式会社 | 2020-03-05 | — | — | WO | disclosed |
| US-20190187560-A1 | COMPOSITION FOR FORMING METAL-CONTAINING FILM, METHOD OF PRODUCING COMPOSITION FOR FORMING METAL-CONTAINING FILM, SEMICONDUCTOR DEVICE, AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE | MITSUI CHEMICALS, INC. (JP) | 2019-06-20 | — | — | US | disclosed |
| EP-0276860-A2 | Method for preparing urea-functional organosilicon compounds | Toray Silicone Company, Ltd. (JP) | 1988-08-03 | — | — | EP | disclosed |
| US-4098840-A | THERMOSETTING RESIN COMPOSITION | JAPAN ATOMIC ENERGY RESEARCH INSTITUTE (JP) | 1978-07-04 | — | — | US | disclosed |