SCHEMBL10697729

SCHEMBL10697729

C1CCC2OC2C1.CC1CCC2OC2C1

nearest known ligand 0.30

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
L3MBTL1 Q9Y468 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14272643 0.92
SCHEMBL716267 0.92
SCHEMBL14707871 0.92
SCHEMBL14161621 0.92
SCHEMBL15013882 0.92
SCHEMBL18435263 0.92
SCHEMBL19416670 0.92
SCHEMBL15013857 0.92
SCHEMBL15013880 0.92
SCHEMBL15013858 0.92

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-103619927-A High-temperature-resistant foams having low thermal conductivity BAYER IP GMBH 2014-03-05 CN disclosed
CN-101910275-B Additive for polymerizable composition, polymerizable composition containing the same, and use of the polymerizable composition MITSUI CHEMICALS INC 2013-06-05 CN disclosed
CN-102203184-B polylactic acid composition and molded article thereof TEIJIN CHEMICALS LTD 2013-03-27 CN disclosed
CN-102203184-A polylactic acid composition and molded article thereof TEIJIN CHEMICALS LTD 2011-09-28 CN disclosed
CN-101910275-A Additive for polymerizable composition, polymerizable composition containing the same, and use of the polymerizable composition MITSUI CHEMICALS INC 2010-12-08 CN disclosed
EP-0272563-A2 Two-step process for the production of moulded articles BAYER AG (DE) 1988-06-29 EP disclosed