Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | NR1H4 | Q96RI1 | 1/20 | 0.56 |
| ▸ | PRSS1 | P07477 | 7/20 | 0.55 |
| ▸ | ACR | P10323 | 5/20 | 0.55 |
| ▸ | KMT2A | Q03164 | 7/20 | 0.54 |
| ▸ | F2 | P00734 | 2/20 | 0.54 |
| ▸ | PRSS2 | P07478 | 2/20 | 0.54 |
| ▸ | PRSS3 | P35030 | 2/20 | 0.54 |
| ▸ | PKM | P14618 | 1/20 | 0.54 |
| ▸ | MEN1 | O00255 | 3/20 | 0.53 |
| ▸ | MAPT | P10636 | 3/20 | 0.49 |
| ▸ | PARP10 | Q53GL7 | 1/20 | 0.49 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.49 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.48 |
| ▸ | MITF | O75030 | 1/20 | 0.48 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.48 |
| ▸ | GAA | P10253 | 1/20 | 0.48 |
| ▸ | GFER | P55789 | 1/20 | 0.48 |
| ▸ | NLRP1 | Q9C000 | 1/20 | 0.48 |
| ▸ | NOD2 | Q9HC29 | 1/20 | 0.48 |
| ▸ | LMNA | P02545 | 2/20 | 0.47 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9185619 | 0.93 | NR1H4 (0.54) | NR1H4PRSS1ACRKMT2AF2 | |
| SCHEMBL17744786 | 0.92 | NR1H4 (0.50) | NR1H4PRSS1ACRKMT2AF2 | |
| SCHEMBL31555689 | 0.92 | PRSS1 (0.68) | NR1H4PRSS1ACRKMT2AF2 | |
| SCHEMBL18325182 | 0.90 | PRSS1 (0.59) | NR1H4PRSS1ACRKMT2AF2 | |
| SCHEMBL22826274 | 0.90 | PRSS1 (0.56) | NR1H4PRSS1ACRKMT2AF2 | |
| SCHEMBL13292720 | 0.89 | PRSS1 (0.51) | NR1H4PRSS1ACRKMT2AF2 | |
| SCHEMBL30473277 | 0.89 | PRSS1 (0.51) | NR1H4PRSS1ACRKMT2AF2 | |
| SCHEMBL17744876 | 0.87 | MAPT (0.49) | NR1H4PRSS1ACRKMT2AF2 | |
| SCHEMBL451331 | 0.86 | PARP10 (0.65) | NR1H4PRSS1ACRKMT2AF2 | |
| SCHEMBL30957000 | 0.85 | PRSS1 (0.52) | NR1H4PRSS1ACRKMT2AF2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 80 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3227363-B1 | BONDING OF COMPOSITE MATERIALS | CYTEC IND INC (US) | 2020-10-07 | — | — | EP | claimed |
| US-10119001-B2 | Extended room temperature storage of epoxy resins | HEXCEL CORPORATION (US) | 2018-11-06 | — | — | US | claimed |
| EP-3114153-B1 | EXTENDED ROOM TEMPERATURE STORAGE OF EPOXY RESINS | HEXCEL CORP (US) | 2017-11-29 | — | — | EP | claimed |
| US-9789646-B2 | Bonding of composite materials | CYTEC INDUSTRIES INC. (US) | 2017-10-17 | — | — | US | claimed |
| EP-3227363-A1 | BONDING OF COMPOSITE MATERIALS | Cytec Industries Inc. (US) | 2017-10-11 | — | — | EP | claimed |
| EP-3114153-A1 | EXTENDED ROOM TEMPERATURE STORAGE OF EPOXY RESINS | Hexcel Corporation (US) | 2017-01-11 | — | — | EP | claimed |
| US-20160362528-A1 | EXTENDED ROOM TEMPERATURE STORAGE OF EPOXY RESINS | HEXCEL CORPORATION | 2016-12-15 | — | — | US | claimed |
| WO-2016073192-A1 | BONDING OF COMPOSITE MATERIALS | CYTEC INDUSTRIES INC. (US) | 2016-05-12 | — | — | WO | claimed |
| US-20160121591-A1 | BONDING OF COMPOSITE MATERIALS | CYTEC INDUSTRIES INC. (US) | 2016-05-05 | — | — | US | claimed |
| WO-2015134240-A1 | EXTENDED ROOM TEMPERATURE STORAGE OF EPOXY RESINS | HEXCEL CORPORATION (US) | 2015-09-11 | — | — | WO | claimed |
| EP-0659553-A1 | Coextruded multi-layer aromatic polyimide film and preparation thereof | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 1995-06-28 | — | — | EP | claimed |
| US-5411765-A | Coating a polyamic acid film, polyimide gel film and curing | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 1995-05-02 | — | — | US | claimed |
| US-5298331-A | Metal clad laminates for printed circuits and tape automated bonding | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 1994-03-29 | — | — | US | claimed |
| US-20240417592-A1 | POLYIMIDE COATING MATERIAL | PI ADVANCED MATERIALS CO., LTD. (KR) | 2024-12-19 | — | — | US | disclosed |
| US-20240318034-A1 | POLYAMIC ACID COMPOSITION AND POLYIMIDE COATING MATERIAL COMPRISING SAME | PI ADVANCED MATERIALS CO., LTD. (KR) | 2024-09-26 | — | — | US | disclosed |
| EP-4424762-A1 | POLYAMIC ACID COMPOSITION AND METHOD FOR PREPARING SAME | PI Advanced Materials Co., Ltd. (KR) | 2024-09-04 | — | — | EP | disclosed |
| EP-0659553-A1 | Coextruded multi-layer aromatic polyimide film and preparation thereof | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 1995-06-28 | — | — | EP | disclosed |
| US-5411765-A | Coating a polyamic acid film, polyimide gel film and curing | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 1995-05-02 | — | — | US | disclosed |
| US-5298331-A | Metal clad laminates for printed circuits and tape automated bonding | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 1994-03-29 | — | — | US | disclosed |
| EP-0474054-A2 | Flexible multi-layer polyimide film laminates and preparation thereof | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 1992-03-11 | — | — | EP | disclosed |