⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL215959 | 0.84 | — | — | |
| SCHEMBL108925 | 0.84 | — | — | |
| SCHEMBL5573124 | 0.84 | — | — | |
| SCHEMBL3622939 | 0.81 | — | — | |
| SCHEMBL8726339 | 0.77 | — | — | |
| SCHEMBL6912433 | 0.71 | — | — | |
| SCHEMBL6672780 | 0.69 | — | — | |
| SCHEMBL1639304 | 0.68 | TSHR (0.42) | — | |
| SCHEMBL10708772 | 0.68 | — | — | |
| SCHEMBL409695 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 219 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2628744-B1 | Silicon-containing surface modifier, resist underlayer film composition containing this, and patterning process | SHINETSU CHEMICAL CO (JP) | 2016-11-30 | — | — | EP | claimed |
| EP-2628745-B1 | Silicon-containing surface modifier, resist lower layer film-forming composition containing the same, and patterning process | SHINETSU CHEMICAL CO (JP) | 2015-03-25 | — | — | EP | claimed |
| CN-101917826-B | Method for increasing binding force between electric conductor and non-conductive polymer dielectric layer in printed circuit board substrate | DONGGUAN RENJI ELECTRONIC MATERIALS CO LTD | 2013-08-21 | — | — | CN | claimed |
| CN-101917826-A | Method for increasing binding force between electric conductor and non-conductive polymer dielectric layer in printed circuit board substrate | DONGGUAN RENJI ELECTRONIC MATERIALS CO LTD | 2010-12-15 | — | — | CN | claimed |
| US-6805964-B2 | CONTACTING AT LEAST ONE SIDE OF THE METAL FOIL WITH AN INERT SILANE, TITANATE OR ZIRCONATE COMPOUND TO FORM A PROTECTIVE FILM HAVING THICKNESS 0.001 TO 1 MICRON ON THE SURFACE OF THE METAL FOIL | NIKKO MATERIALS USA, INC. | 2004-10-19 | — | — | US | claimed |
| US-20030178139-A1 | Protective coatings for improved tarnish resistance in metal foils | NIKKO MATERIALS USA, INC. | 2003-09-25 | — | — | US | claimed |
| US-6589381-B2 | Contacting copper foil with an inert silane, titanate or zirconate compound to form a resin dust resistant film, laminating metal foil to a resin selected from polyimde, polyester or epoxy resin | GOULD ELECTRONICS, INC. | 2003-07-08 | — | — | US | claimed |
| US-6537675-B1 | Protective film of at least one inert silane, titanate or zirconate overlying the first side of the metal foil; and a metal sheet having a first side and a second side, the first side overlying the protective film | GA-TEK, INC. | 2003-03-25 | — | — | US | claimed |
| US-6299721-B1 | CONTACTING FIRST SIDE OF METAL FOIL WITH SOLUTION COMPRISING HYDROCARBYLSILANE, WATER, ORGANIC SOLVENT AND TRIAZOLE COMPOUND TO FORM RESIN DUST RESISTANT FILM ON SURFACE OF METAL | GOULD ELECTRONICS INCL | 2001-10-09 | — | — | US | claimed |
| US-20010015257-A1 | Coatings for improved resin dust resistance | NIKKO MATERIALS USA, INC. | 2001-08-23 | — | — | US | claimed |
| EP-1011299-A2 | Coatings for improved resin dust resistance | GA-TEK Inc. (US) | 2000-06-21 | — | — | EP | claimed |
| US-20260118767-A1 | REVERSE PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-04-30 | — | — | US | disclosed |
| EP-4700067-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING FILM, METHOD FOR FORMING FILM, AND SUPERSTRATE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-02-25 | — | — | EP | disclosed |
| US-20260044081-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST FILM AND PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-02-12 | — | — | US | disclosed |
| EP-4692941-A2 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST FILM AND PATTERNING PROCESS | Shin-Etsu Chemical Co., Ltd. (JP) | 2026-02-11 | — | — | EP | disclosed |
| EP-1011299-A2 | Coatings for improved resin dust resistance | GA-TEK Inc. (US) | 2000-06-21 | — | — | EP | disclosed |
| WO-1998009913-A1 | REVERSIBLE COVALENT ATTACHMENT OF FULLERENES TO INSOLUBLE SUPPORTS | UNIVERSITY OF MASSACHUSETTS (US) | 1998-03-12 | — | — | WO | disclosed |
| US-4704428-A | ANCHORING AGENT FOR SILICATE FILER | DEGUSSA AKTIENGESELLSCHAFT (DE) | 1987-11-03 | — | — | US | disclosed |
| US-4645850-A | CROSSLINKING | DEGUSSA AKTIENGESELLSCHAFT (DE) | 1987-02-24 | — | — | US | disclosed |
| EP-0170011-A2 | Silyl-substituted cyclopentadienes, process for their preparation and mixtures of synthetic material and rubber containing these | Degussa Aktiengesellschaft (DE) | 1986-02-05 | — | — | EP | disclosed |