⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29817 | 0.97 | — | — | |
| SCHEMBL27426594 | 0.93 | — | — | |
| SCHEMBL8069604 | 0.93 | — | — | |
| SCHEMBL29168876 | 0.93 | — | — | |
| SCHEMBL8961816 | 0.93 | — | — | |
| SCHEMBL3238828 | 0.93 | — | — | |
| SCHEMBL29043129 | 0.93 | — | — | |
| Ammonia Solution, Strong SCHEMBL11219484 | 0.93 | — | — | |
| SCHEMBL11454433 | 0.90 | — | — | |
| Fluoride SCHEMBL4324230 | 0.88 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 75 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0998523-B1 | COMPOSITION CONTAINING AMPHIIONIC RESIN AND POLYVALENT METAL COMPLEX | DOW GLOBAL TECHNOLOGIES INC (US) | 2004-08-25 | — | — | EP | claimed |
| EP-0998523-A1 | COMPOSITION CONTAINING AMPHIIONIC RESIN AND POLYVALENT METAL COMPLEX | THE DOW CHEMICAL COMPANY (US) | 2000-05-10 | — | — | EP | claimed |
| US-5959016-A | POLYMER WITH PENDANT CATIONIC GROUPS AND WEAK SALT GROUPS AND SOLVENT WITH POLYVALENT METAL COMPLEXES TACK-FREE, SOLVENT-RESISTANT COATING. | THE DOW CHEMICAL COMPANY (US) | 1999-09-28 | — | — | US | claimed |
| WO-1999006478-A1 | COMPOSITION CONTAINING AMPHIIONIC RESIN AND POLYVALENT METAL COMPLEX | THE DOW CHEMICAL COMPANY (US) | 1999-02-11 | — | — | WO | claimed |
| US-20230390214-A1 | ADHESIVE PATCH | TOYO INK SC HOLDINGS CO., LTD. (JP) | 2023-12-07 | — | — | US | disclosed |
| WO-2022039195-A1 | ADHESIVE PATCH | 東洋インキＳＣホールディングス株式会社 | 2022-02-24 | — | — | WO | disclosed |
| EP-2371360-B1 | Selegiline-containing adhesive preparation | FUJIMOTO CO LTD (JP) | 2017-11-29 | — | — | EP | disclosed |
| EP-2671587-B1 | PATCH PREPARATION | NITTO DENKO CORP (JP) | 2017-07-26 | — | — | EP | disclosed |
| US-20140023695-A1 | PATCH PREPARATION | NITTO DENKO CORPORATION (JP) | 2014-01-23 | — | — | US | disclosed |
| EP-2671587-A1 | PATCH PREPARATION | Nitto Denko Corporation (JP) | 2013-12-11 | — | — | EP | disclosed |
| CN-103347541-A | Method for producing patch preparation | NITTO DENKO CORP | 2013-10-09 | — | — | CN | disclosed |
| EP-2638906-A1 | Stabilized adhesive preparation containing donepezil | NITTO DENKO CORPORATION (JP) | 2013-09-18 | — | — | EP | disclosed |
| US-20010043987-A1 | Polymer surface coating made by coalescing a polymer particulate with a coalescing agent | ECOLAB INC. | 2001-11-22 | — | — | US | disclosed |
| WO-2000064597-A1 | POLYMER SURFACE COATING MADE BY COALESCING POLYMER PARTICULATE WITH A COALESCING AGENT | ECOLAB INC. (US) | 2000-11-02 | — | — | WO | disclosed |
| EP-0998523-A1 | COMPOSITION CONTAINING AMPHIIONIC RESIN AND POLYVALENT METAL COMPLEX | THE DOW CHEMICAL COMPANY (US) | 2000-05-10 | — | — | EP | disclosed |
| US-5959016-A | POLYMER WITH PENDANT CATIONIC GROUPS AND WEAK SALT GROUPS AND SOLVENT WITH POLYVALENT METAL COMPLEXES TACK-FREE, SOLVENT-RESISTANT COATING. | THE DOW CHEMICAL COMPANY (US) | 1999-09-28 | — | — | US | disclosed |
| WO-1999006478-A1 | COMPOSITION CONTAINING AMPHIIONIC RESIN AND POLYVALENT METAL COMPLEX | THE DOW CHEMICAL COMPANY (US) | 1999-02-11 | — | — | WO | disclosed |
| EP-0228481-A1 | Coating composition | YUHO CHEMICALS INC. (JP) | 1987-07-15 | — | — | EP | disclosed |
| US-4622360-A | FLOORS, POLYURETHANE CONTAINING CARBOXYLATE GROUPS CROSSLINKED WITH METAL | YUHO CHEMICALS INC. (JP) | 1986-11-11 | — | — | US | disclosed |
| US-4168255-A | Oligomeric aqueous finishes | ROHM AND HAAS COMPANY (US) | 1979-09-18 | — | — | US | disclosed |