SCHEMBL1090239

SCHEMBL1090239

CC(=O)OC1=CC2CCC1C2

nearest known ligand 0.52

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
CYP19A1 P11511 1/20 0.52
LMNA P02545 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4966393 0.83 CYP19A1 (0.54) CYP19A1
SCHEMBL4966164 0.83 CYP19A1 (0.54) CYP19A1
SCHEMBL9625158 0.78 CYP19A1 (0.57) CYP19A1LMNA
SCHEMBL5715344 0.77 CYP19A1 (0.59) CYP19A1
SCHEMBL7561100 0.77 CYP19A1 (0.49) CYP19A1
SCHEMBL2951880 0.77 CYP19A1 (0.49) CYP19A1
SCHEMBL4982703 0.75 CYP19A1 (0.50) CYP19A1LMNA
SCHEMBL9191167 0.74
SCHEMBL12964377 0.72 CYP19A1 (0.44) CYP19A1
SCHEMBL7511514 0.71 CYP19A1 (0.47) CYP19A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-121319065-A Preparation and application of nickel imide chloride catalyst 芜湖职业技术学院 2026-01-13 CN disclosed
CN-107602734-B A kind of palladium-containing catalyst, preparation method, composition as made from it and application 东华大学 2019-10-18 CN disclosed
US-8535872-B2 Thermally cured underlayer for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2013-09-17 US disclosed
US-20120178871-A1 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION DE BINOD B (US) 2012-07-12 US disclosed
US-8153346-B2 Hydroxyl containing polymer, amino crosslinking agent and thermal acid generator; undercoating for multilayer lithography material FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2012-04-10 US disclosed
US-20080206676-A1 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS, U.S.A, INC 2008-08-28 US disclosed
WO-2008103776-A2 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2008-08-28 WO disclosed
EP-1599511-A2 A QUASI-LIVING METAL CATALYST FOR ETHYLENE HOMO-POLYMERIZATION AND CO-POLYMERIZATION WITH 5-NORBORNEN-2-YL ACETATE The Regents of the University of California (US) 2005-11-30 EP disclosed
WO-2004078337-A2 A QUASI-LIVING METAL CATALYST FOR ETHYLENE HOMO-POLYMERIZATION AND CO-POLYMERIZATION WITH 5-NORBORNEN-2-YL ACETATE THE REGENTS OF THE UNIVERSITY OF CALIFORNIA (US) 2004-09-16 WO disclosed
EP-0451858-B1 Molded article of norbornene-based polymer NIPPON ZEON CO (JP) 1996-10-09 EP disclosed
US-5302656-A Heat resistance, crack resistance NIPPON ZEON CO., LTD. (JP) 1994-04-12 US disclosed
EP-0451858-A2 Molded article of norbornene-based polymer NIPPON ZEON CO., LTD. (JP) 1991-10-16 EP disclosed
EP-0286839-A1 Metathesis polymerized copolymer HERCULES INCORPORATED (US) 1988-10-19 EP disclosed