⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4943786 | 1.00 | — | — | |
| SCHEMBL4948167 | 1.00 | — | — | |
| SCHEMBL4946891 | 1.00 | — | — | |
| SCHEMBL4942419 | 1.00 | — | — | |
| SCHEMBL3654581 | 1.00 | — | — | |
| SCHEMBL4946208 | 1.00 | — | — | |
| SCHEMBL412622 | 0.95 | — | — | |
| SCHEMBL10579854 | 0.91 | — | — | |
| SCHEMBL662584 | 0.91 | — | — | |
| SCHEMBL1638796 | 0.86 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 131 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11725388-B2 | Post-functionalized roofing granules and process for preparing same | CERTAINTEED LLC (US) | 2023-08-15 | — | — | US | claimed |
| US-11021877-B2 | Post-functionalized roofing granules and process for preparing same | CERTAINTEED LLC (US) | 2021-06-01 | — | — | US | claimed |
| CN-107406983-B | Addressing line bending for FCVD by deposition tuning | 应用材料公司 | 2021-03-16 | — | — | CN | claimed |
| US-9896326-B2 | FCVD line bending resolution by deposition modulation | APPLIED MATERIALS, INC. (US) | 2018-02-20 | — | — | US | claimed |
| US-20160181089-A1 | FCVD LINE BENDING RESOLUTION BY DEPOSITION MODULATION | APPLIED MATERIALS, INC. (US) | 2016-06-23 | — | — | US | claimed |
| US-7943531-B2 | Methods for forming a silicon oxide layer over a substrate | APPLIED MATERIALS, INC. (US) | 2011-05-17 | — | — | US | claimed |
| EP-2208222-A1 | METHODS FOR FORMING A SILICON OXIDE LAYER OVER A SUBSTRATE | Applied Materials, Inc. (US) | 2010-07-21 | — | — | EP | claimed |
| CN-101528974-A | Formation of high quality dielectric films of silicon dioxide for sti: usage of different siloxane-based precursors for harp II-remote plasma enhanced deposition processes | APPLIED MATERIALS INC (US) | 2009-09-09 | — | — | CN | claimed |
| EP-2082078-A2 | FORMATION OF HIGH QUALITY DIELECTRIC FILMS OF SILICON DIOXIDE FOR STI: USAGE OF DIFFERENT SILOXANE-BASED PRECURSORS FOR HARP II - REMOTE PLASMA ENHANCED DEPOSITION PROCESSES | Applied Materials, INC. (US) | 2009-07-29 | — | — | EP | claimed |
| WO-2009055340-A1 | METHODS FOR FORMING A SILICON OXIDE LAYER OVER A SUBSTRATE | APPLIED MATERIALS, INC. (US) | 2009-04-30 | — | — | WO | claimed |
| US-20090104791-A1 | Methods for Forming a Silicon Oxide Layer Over a Substrate | APPLIED MATERIALS, INC. A DELAWARE CORPORATION (US) | 2009-04-23 | — | — | US | claimed |
| US-7498273-B2 | Formation of high quality dielectric films of silicon dioxide for STI: usage of different siloxane-based precursors for harp II—remote plasma enhanced deposition processes | APPLIED MATERIALS, INC. (US) | 2009-03-03 | — | — | US | claimed |
| WO-2008048862-A2 | FORMATION OF HIGH QUALITY DIELECTRIC FILMS OF SILICON DIOXIDE FOR STI: USAGE OF DIFFERENT SILOXANE-BASED PRECURSORS FOR HARP II - REMOTE PLASMA ENHANCED DEPOSITION PROCESSES | APPLIED MATERIALS, INC. (US) | 2008-04-24 | — | — | WO | claimed |
| US-20070281495-A1 | FORMATION OF HIGH QUALITY DIELECTRIC FILMS OF SILICON DIOXIDE FOR STI: USAGE OF DIFFERENT SILOXANE-BASED PRECURSORS FOR HARP II - REMOTE PLASMA ENHANCED DEPOSITION PROCESSES | APPLIED MATERIALS, INC. (US) | 2007-12-06 | — | — | US | claimed |
| US-12590185-B2 | Rapid-curing two-component silicone composition having a longer mixer open time | SIKA TECHNOLOGY AG (CH) | 2026-03-31 | — | — | US | disclosed |
| EP-4711411-A1 | FAST-CURING TWO-COMPONENT SILICONE COMPOSITION WITH IMPROVED TEMPERATURE STABILITY | Sika Technology AG (CH) | 2026-03-18 | — | — | EP | disclosed |
| US-20250246538-A1 | TECHNIQUES TO INHIBIT DELAMINATION FROM FLOWABLE GAP-FILL DIELECTRIC | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2025-07-31 | — | — | US | disclosed |
| EP-0337322-A2 | Process for producing monosilane | MITSUBISHI KASEI CORPORATION (JP) | 1989-10-18 | — | — | EP | disclosed |
| US-4226793-A | Process for the manufacture of monomeric and oligomeric silicic acid esters | DYNAMIT NOBEL AKTIENGESELLSCHAFT (DE) | 1980-10-07 | — | — | US | disclosed |
| US-3982955-A | Aluminum oxide fibers and their production | BAYER AKTIENGESELLSCHAFT (DT) | 1976-09-28 | — | — | US | disclosed |