SCHEMBL109742

SCHEMBL109742

[Cu].[InH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28057242 1.00
Water SCHEMBL3628113 0.82
SCHEMBL7263063 0.82
SCHEMBL16536593 0.82
SCHEMBL106069 0.82
SCHEMBL8451974 0.82
SCHEMBL4269300 0.82
SCHEMBL1628265 0.82
Hydrogen Sulfide SCHEMBL235613 0.82
SCHEMBL503513 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 3339 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115910803-B Low-temperature bonding method based on hydrophobic copper micron layer 广州华立学院 2026-05-12 CN claimed
CN-122028536-A Preparation method of thiourea dioxide-nano selenium sol anion source precursor solution 电子科技大学中山学院 2026-05-12 CN claimed
CN-121583780-A Infrared electrochemical cell based on tellurium-based quantum dots and preparation method thereof 天府绛溪实验室 2026-02-27 CN claimed
WO-2025244626-A1 COMPOSITE THERMAL HOTSPOT MANAGEMENT IN DIE PACKAGING DIAMOND FOUNDRY INCORPORATED (US) 2025-11-27 WO claimed
US-20250357263-A1 COMPOSITE THERMAL HOTSPOT MANAGEMENT IN DIE PACKAGING DIAMOND FOUNDRY INC (US) 2025-11-20 US claimed
CN-120089655-A High-power SiP package based on stacked HTCC substrate and dielectric-free metal interconnection structure 浙江臻镭科技股份有限公司 2025-06-03 CN claimed
CN-119864326-A Electronic package 矽品精密工业股份有限公司 2025-04-22 CN claimed
EP-4000105-B1 METHOD OF MANUFACTURING A THIN-FILM PHOTOVOLTAIC PRODUCT TNO (NL) 2025-01-08 EP claimed
CN-119121258-A Copper-indium bimetallic organic framework catalyst and preparation method and application thereof 浙江万里学院 2024-12-13 CN claimed
CN-119020808-A Copper oxide/indium oxide nanoparticle electrocatalytic material and preparation method and application thereof 中国地质大学(武汉) 2024-11-26 CN claimed
CN-1359127-A Sealed getter TANG JIANZHENG (CN) 2002-07-17 CN claimed
US-6368892-B1 COPPER INDIUM DISELENIDE; BP CORPORATION NORTH AMERICA INC. 2002-04-09 US claimed
US-6121541-A EFFICIENT BROADER SPECTRUM MONOLITHIC SOLAR CELLS PRODUCED BY COUPLING A CADMIUM INDIUM SELENIDE (CIS) POLYCRYSTALLINE SEMICONDUCTOR TO AN AMORPHOUS SILICON THIN FILM SEMICONDUCTOR BY AN N-TYPE CONDUCTOR, E.G. CADMIUM SULFIDE BP SOLAREX (US) 2000-09-19 US claimed
CN-1145139-A Multiple layer thin film solar cells with buried contacts PACIFIC SOLAR PTY LTD (AU) 1997-03-12 CN claimed
CN-1025580-C Hgbrid integrated two-dimension surface emission laser array UNIV JILIN (CN) 1994-08-03 CN claimed
CN-1071778-A A kind of electroluminescence screen products and manufacture method thereof UNIV OF ELECTRONIC SCIENCE & T (CN) 1993-05-05 CN claimed
US-5195244-A Leaded bronze alloys, diffusion indium, no interlayer VANDERVELL LIMITED (GB) 1993-03-23 US claimed
US-5045409-A Process for making thin film solar cell ATLANTIC RICHFIELD COMPANY (US) 1991-09-03 US claimed
EP-0211529-B1 METHOD FOR FORMING CUINSE2 FILMS ATLANTIC RICHFIELD COMPANY (US) 1990-09-12 EP claimed
EP-0318315-A2 Process for making thin film solar cell SIEMENS SOLAR INDUSTRIES L.P. (US) 1989-05-31 EP claimed