Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ROCK1 | Q13464 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL13845364 | 0.97 | ROCK1 (0.33) | ROCK1 | |
| SCHEMBL16557001 | 0.97 | ROCK1 (0.33) | ROCK1 | |
| SCHEMBL13370638 | 0.95 | ROCK1 (0.33) | ROCK1 | |
| SCHEMBL9808379 | 0.91 | ROCK1 (0.31) | ROCK1 | |
| SCHEMBL8995774 | 0.81 | — | — | |
| SCHEMBL8995777 | 0.81 | — | — | |
| SCHEMBL8995781 | 0.81 | — | — | |
| SCHEMBL8995783 | 0.81 | — | — | |
| SCHEMBL8995780 | 0.81 | — | — | |
| SCHEMBL2010475 | 0.80 | CA1 (0.31) | ROCK1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 48 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114106324-A | Polyamide acid solution and preparation method and application thereof | 吉林奥来德光电材料股份有限公司 | 2022-03-01 | — | — | CN | disclosed |
| CN-107312329-B | Polyimide film and copper-clad laminate | 日铁化学材料株式会社 | 2021-09-21 | — | — | CN | disclosed |
| EP-1627901-B1 | PRIMER, CONDUCTOR FOIL WITH RESIN, LAMINATE AND PROCESS FOR PRODUCING THE LAMINATE | HITACHI CHEMICAL CO LTD (JP) | 2020-02-19 | — | — | EP | disclosed |
| EP-2886339-B1 | RESIN SHEET, SUPPORT BODY WITH RESIN LAYER, LAMINATE PLATE, AND METAL-CLAD LAMINATE PLATE | MITSUBISHI GAS CHEMICAL CO (JP) | 2017-03-01 | — | — | EP | disclosed |
| US-20150210832-A1 | RESIN SHEET, SUPPORT WITH RESIN LAYER, LAMINATE AND METAL FOIL-CLAD LAMINATE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2015-07-30 | — | — | US | disclosed |
| EP-2886339-A1 | RESIN SHEET, SUPPORT BODY WITH RESIN LAYER, LAMINATE PLATE, AND METAL-CLAD LAMINATE PLATE | Mitsubishi Gas Chemical Company, Inc. (JP) | 2015-06-24 | — | — | EP | disclosed |
| US-20150056454-A1 | RESIN COMPOSITION, PREPREG, AND METAL FOIL-CLAD LAMINATE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2015-02-26 | — | — | US | disclosed |
| US-8956732-B2 | Polyamideimide resin, adhesive agent, material for flexible substrate, flexible laminate, and flexible print wiring board | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2015-02-17 | — | — | US | disclosed |
| EP-2826800-A1 | RESIN COMPOSITION, PREPREG, AND METAL FOIL-CLAD LAMINATE | Mitsubishi Gas Chemical Company, Inc. (JP) | 2015-01-21 | — | — | EP | disclosed |
| US-8815334-B2 | Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board | HITACHI CHEMICAL CO., LTD. (JP) | 2014-08-26 | — | — | US | disclosed |
| EP-1627901-A1 | PRIMER, CONDUCTOR FOIL WITH RESIN, LAMINATE AND PROCESS FOR PRODUCING THE LAMINATE | Hitachi Chemical Co., Ltd. (JP) | 2006-02-22 | — | — | EP | disclosed |
| US-20050202261-A1 | Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board | RESONAC CORPORATION (JP) | 2005-09-15 | — | — | US | disclosed |
| US-20050106370-A1 | Formation method of metal layer on resin layer, printed wiring board, and production method thereof | HITACHI CHEMICAL CO., LTD. (JP) | 2005-05-19 | — | — | US | disclosed |
| US-6316170-B2 | COATING, EXPOSURE, DEVELOPMENT AND HEAT TREATMENT | KABUSHIKI KAISHA TOSHIBA (JP) | 2001-11-13 | — | — | US | disclosed |
| US-20010006767-A1 | Developing solution and method of forming polyimide pattern by using the developing solution | YOSHIAKI KAWAMONZEN | 2001-07-05 | — | — | US | disclosed |
| US-6183934-B1 | FOE USE IN FORMATION OF PATTERN OF INSULATION FILM, PASSIVATION FILM, .ALPHA.-RAY SHIELDING FILM, OPTICAL WAVEGUIDE | KABUSHIKI KAISHA TOSHIBA (JP) | 2001-02-06 | — | — | US | disclosed |
| US-6159654-A | Negative photosensitive polymer composition of a thermosetting polymer precursor curable by cyclodehydration upon heating | KABUSHIKI KAISHA TOSHIBA (JP) | 2000-12-12 | — | — | US | disclosed |
| US-6001517-A | A THERMOSETTING POLYMER WHICH CAN BE CURED THROUGH CYCLODEHYDRATION UPON HEATING AND A CURE ACCELERATOR WHICH CAN BE DEACTIVATED OF ITS CURE ACCELERATION PROPERTY BY IRRIDIATION OF LIGHT | KABUSHIKI KAISHA TOSHIBA (JP) | 1999-12-14 | — | — | US | disclosed |
| US-5756650-A | COMPOSITION COMPRISING POLYAMIC ACID, CURE ACCELERATOR SELECTED FROM GROUP CONSISTING OF NITROGEN-CONTAINING HETEROCYCLIC COMPOUND, AMINO ACID COMPOUND, AROMATIC COMPOUND HAVING TWO OR MORE HYDROXYL GROUPS | KABUSHIKI KAISHA TOSHIBA (JP) | 1998-05-26 | — | — | US | disclosed |
| US-5578697-A | DIELECTRIC POLYMERS FOR ELECTRONICS | KABUSHIKI KAISHA TOSHIBA (JP) | 1996-11-26 | — | — | US | disclosed |