SCHEMBL11025912

SCHEMBL11025912

O=[AlH].[Cu].[MgH2]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28118710 0.89
SCHEMBL62847 0.89
SCHEMBL28414194 0.89
SCHEMBL153522 0.89
SCHEMBL25216067 0.80
SCHEMBL2793044 0.80
SCHEMBL60829 0.80
SCHEMBL356890 0.80
SCHEMBL7632347 0.80
SCHEMBL6720365 0.80

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240215305-A1 DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME SAMSUNG DISPLAY CO., LTD. (KR) 2024-06-27 US claimed
CN-118251059-A Display device and method of manufacturing the same 三星显示有限公司 2024-06-25 CN claimed
CN-112237900-A Bentonite-loaded copper-magnesium-aluminum oxide nanocomposite and preparation method and application thereof 新疆大学 2021-01-19 CN claimed
US-8580136-B2 Etching solution composition for metal thin film consisting primarily of copper KANTO KAGAKU KABUSHIKI KAISHA (JP) 2013-11-12 US claimed
CN-102995021-A Etching solution composition and etching method for copper and copper alloy KANTO KAGAKU 2013-03-27 CN claimed
US-20120187087-A1 ETCHING SOLUTION COMPOSITION FOR METAL THIN FILM CONSISTING PRIMARILY OF COPPER KANTO KAGAKU KABUSHIKI KAISHA (JP) 2012-07-26 US claimed
US-20240215305-A1 DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME SAMSUNG DISPLAY CO., LTD. (KR) 2024-06-27 US disclosed
CN-118251059-A Display device and method of manufacturing the same 三星显示有限公司 2024-06-25 CN disclosed
EP-3564313-B1 THERMALLY-CONDUCTIVE RESIN COMPOSITION, AND COMPLEX COMPRISING SAME LOTTE ADVANCED MAT CO LTD (KR) 2023-12-20 EP disclosed
CN-110114409-B Thermally conductive resin composition and composite material including the same 乐天尖端材料株式会社 2022-07-22 CN disclosed
US-11208554-B2 Thermally-conductive resin composition, and complex comprising same LOTTE ADVANCED MATERIALS CO., LTD. (KR) 2021-12-28 US disclosed
CN-112237900-A Bentonite-loaded copper-magnesium-aluminum oxide nanocomposite and preparation method and application thereof 新疆大学 2021-01-19 CN disclosed
CN-112237900-A Bentonite-loaded copper-magnesium-aluminum oxide nanocomposite and preparation method and application thereof 新疆大学 2021-01-19 CN disclosed
CN-110114409-A Heat-conductive resin composition and composite material including it 乐天尖端材料株式会社 2019-08-09 CN disclosed
CN-109328108-A Copper-aluminum oxide catalyst for preparing furfuryl alcohol from furfural and preparation of catalyst PTT全球化学股份有限公司 2019-02-12 CN disclosed
CN-105405973-A Mesoscopic solar cell based on perovskite-kind light absorption material and preparation method thereof UNIV HUAZHONG SCIENCE TECH 2016-03-16 CN disclosed
US-8580136-B2 Etching solution composition for metal thin film consisting primarily of copper KANTO KAGAKU KABUSHIKI KAISHA (JP) 2013-11-12 US disclosed
US-20130200382-A1 THIN-FILM TRANSISTOR SUBSTRATE AND METHOD OF MANUFACTURING A THIN-FILM TRANSISTOR SUBSTRATE SAMSUNG DISPLAY CO., LTD. (KR) 2013-08-08 US disclosed
CN-102995021-A Etching solution composition and etching method for copper and copper alloy KANTO KAGAKU 2013-03-27 CN disclosed
US-20120187087-A1 ETCHING SOLUTION COMPOSITION FOR METAL THIN FILM CONSISTING PRIMARILY OF COPPER KANTO KAGAKU KABUSHIKI KAISHA (JP) 2012-07-26 US disclosed