SCHEMBL11047704

SCHEMBL11047704

CC1C(N)CCC(N)C1C

nearest known ligand 0.38

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
THRB P10828 1/20 0.38
MEN1 O00255 1/20 0.38
KMT2A Q03164 1/20 0.38
FUCA1 P04066 3/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23265403 0.87 FUCA1 (0.31) THRBMEN1KMT2AFUCA1
SCHEMBL25712524 0.87 FUCA1 (0.31) THRBMEN1KMT2AFUCA1
SCHEMBL20857695 0.87 FUCA1 (0.31) THRBMEN1KMT2AFUCA1
SCHEMBL25712525 0.87 FUCA1 (0.31) THRBMEN1KMT2AFUCA1
SCHEMBL11271786 0.87 FUCA1 (0.31) THRBMEN1KMT2AFUCA1
SCHEMBL4149556 0.82
SCHEMBL21287450 0.82
SCHEMBL26707972 0.82
SCHEMBL21829061 0.80
SCHEMBL23484652 0.80

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4467100-A Epoxy resin compositions cured with imide-amine at ambient temperatures to afford products having useful properties at high temperatures LORD CORPORATION (US) 1984-08-21 US disclosed
US-4366302-A HEAT RESISTANCE CURING AGENTS LORD CORPORATION (US) 1982-12-28 US disclosed
US-4340715-A Epoxy resin compositions cured with imide-amines LORD CORPORATION (US) 1982-07-20 US disclosed