SCHEMBL11049038

SCHEMBL11049038

C1=COC(SSC2C=CC=CO2)C=C1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23877690 0.83
SCHEMBL30917991 0.82
SCHEMBL8735126 0.79
SCHEMBL3068640 0.65
SCHEMBL27883711 0.63
SCHEMBL13399574 0.63
SCHEMBL3628169 0.63
SCHEMBL4576759 0.61
SCHEMBL276152 0.61
SCHEMBL1230809 0.61

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0023988-B1 USE OF A CONDUCTIVE ORGANIC CHARGE TRANSFER MATERIAL AS ELECTRON BEAM SENSITIVE RESIST COMPOSITION, AND METHOD OF FORMING POSITIVE AND NEGATIVE RESIST IMAGES International Business Machines Corporation (US) 1984-02-29 EP claimed
EP-0023988-A2 Use of a conductive organic charge transfer material as electron beam sensitive resist composition, and method of forming positive and negative resist images International Business Machines Corporation (US) 1981-02-18 EP claimed
CN-114175293-A Bispyrans, dithiodipyrans and diseleno-dipyrans and use thereof 塞勒锐科有限公司 2022-03-11 CN disclosed
CN-114175293-A Bispyrans, dithiodipyrans and diseleno-dipyrans and use thereof 塞勒锐科有限公司 2022-03-11 CN disclosed
EP-0023988-B1 USE OF A CONDUCTIVE ORGANIC CHARGE TRANSFER MATERIAL AS ELECTRON BEAM SENSITIVE RESIST COMPOSITION, AND METHOD OF FORMING POSITIVE AND NEGATIVE RESIST IMAGES International Business Machines Corporation (US) 1984-02-29 EP disclosed
EP-0023988-A2 Use of a conductive organic charge transfer material as electron beam sensitive resist composition, and method of forming positive and negative resist images International Business Machines Corporation (US) 1981-02-18 EP disclosed