⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9596247 | 0.69 | — | — | |
| SCHEMBL11723650 | 0.69 | — | — | |
| SCHEMBL19018527 | 0.69 | — | — | |
| SCHEMBL15466580 | 0.69 | — | — | |
| SCHEMBL18818085 | 0.69 | — | — | |
| SCHEMBL9150068 | 0.69 | — | — | |
| SCHEMBL9865789 | 0.69 | — | — | |
| SCHEMBL2759612 | 0.65 | — | — | |
| SCHEMBL10750893 | 0.65 | — | — | |
| SCHEMBL8311824 | 0.65 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 627 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118244583-A | Negative photosensitive polyimide precursor resin composition | 深圳先进电子材料国际创新研究院 | 2024-06-25 | — | — | CN | claimed |
| CN-118240213-A | Negative photosensitive polyimide precursor and composition thereof | 深圳先进电子材料国际创新研究院 | 2024-06-25 | — | — | CN | claimed |
| CN-107155367-B | Aqueous and semi-aqueous cleaners utilizing tungsten and cobalt compatibility to remove post-etch residue | 恩特格里斯公司 | 2021-12-21 | — | — | CN | claimed |
| EP-3191823-B1 | SABRE NMR ANALYSIS METHOD | STICHTING KATHOLIEKE UNIV NIJMEGEN (NL) | 2019-11-20 | — | — | EP | claimed |
| US-10224485-B2 | Process for preparing a crystalline organic semiconductor material | BASF SE (DE) | 2019-03-05 | — | — | US | claimed |
| EP-3191823-A1 | SABRE NMR ANALYSIS METHOD | Stichting Katholieke Universiteit Nijmegen (NL) | 2017-07-19 | — | — | EP | claimed |
| US-20170012208-A1 | ORGANIC SEMICONDUCTOR FORMULATIONS | USINVEST LLC | 2017-01-12 | — | — | US | claimed |
| WO-2016038013-A1 | SABRE NMR ANALYSIS METHOD | STICHTING KATHOLIEKE UNIVERSITEIT (NL) | 2016-03-17 | — | — | WO | claimed |
| JP-H09503518-A | — | — | 1997-04-08 | — | — | JP | claimed |
| EP-0722447-A1 | 3-PYRROLIDINYLTHIO-CARBAPENEM DERIVATIVES AND THEIR ANTIMICROBAL ACTIVITY | FUJISAWA PHARMACEUTICAL CO., LTD. (JP) | 1996-07-24 | — | — | EP | claimed |
| WO-1995010520-A1 | 3-PYRROLIDINYLTHIO-CARBAPENEM DERIVATIVES AND THEIR ANTIMICROBAL ACTIVITY | FUJISAWA PHARMACEUTICAL CO., LTD. (JP) | 1995-04-20 | — | — | WO | claimed |
| WO-2026100734-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, PATTERNED CURED PRODUCT PRODUCTION METHOD, AND ELECTRONIC COMPONENT | ＨＤマイクロシステムズ株式会社 | 2026-05-15 | — | — | WO | disclosed |
| WO-2026100338-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN | 旭化成株式会社 | 2026-05-15 | — | — | WO | disclosed |
| WO-2026100079-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, PATTERNED CURED PRODUCT PRODUCTION METHOD, AND ELECTRONIC COMPONENT | ＨＤマイクロシステムズ株式会社 | 2026-05-15 | — | — | WO | disclosed |
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-28 | — | — | US | disclosed |
| EP-0215739-A1 | Synthesis of beta-lactam compounds | CIBA-GEIGY AG (CH) | 1987-03-25 | — | — | EP | disclosed |
| EP-0201459-A1 | Acylaminomethyl-penem compounds, their preparation and pharmaceutical formulations containing them | CIBA-GEIGY AG (CH) | 1986-11-12 | — | — | EP | disclosed |
| EP-0034924-B1 | PROCESS FOR PREPARING 3-IODOMETHYL CEPHALOSPORINS | ELI LILLY AND COMPANY (US) | 1984-07-04 | — | — | EP | disclosed |
| EP-0034924-A2 | Process for preparing 3-iodomethyl cephalosporins | ELI LILLY AND COMPANY (US) | 1981-09-02 | — | — | EP | disclosed |
| US-4266049-A | Process for 3-iodomethyl cephalosporins | ELI LILLY AND COMPANY (US) | 1981-05-05 | — | — | US | disclosed |