Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | FFAR3 | O14843 | 3/20 | 0.93 |
| ▸ | HDAC3 | O15379 | 3/20 | 0.93 |
| ▸ | HDAC1 | Q13547 | 3/20 | 0.93 |
| ▸ | HDAC2 | Q92769 | 3/20 | 0.93 |
| ▸ | HDAC8 | Q9BY41 | 3/20 | 0.93 |
| ▸ | CA1 | P00915 | 3/20 | 0.60 |
| ▸ | CES2 | O00748 | 2/20 | 0.59 |
| ▸ | CES1 | P23141 | 2/20 | 0.59 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.48 |
| ▸ | GPR84 | Q9NQS5 | 1/20 | 0.46 |
| ▸ | TSHR | P16473 | 1/20 | 0.45 |
| ▸ | FABP3 | P05413 | 2/20 | 0.44 |
| ▸ | CA2 | P00918 | 1/20 | 0.44 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Butyric Acid SCHEMBL11286276 | 0.97 | FFAR3 (0.88) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| Butyric Acid SCHEMBL9620629 | 0.97 | FFAR3 (0.88) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| Butyric Acid SCHEMBL30072232 | 0.94 | FFAR3 (0.82) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| Butyric Acid SCHEMBL5050950 | 0.93 | FFAR3 (0.93) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| Butyric Acid SCHEMBL11419652 | 0.93 | FFAR3 (0.93) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| Butyric Acid SCHEMBL1330878 | 0.93 | — | — | |
| Butyric Acid SCHEMBL10908702 | 0.93 | FFAR3 (0.93) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| Butyric Acid SCHEMBL4292004 | 0.93 | FFAR3 (1.00) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| Butyric Acid SCHEMBL11441641 | 0.93 | FFAR3 (0.93) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| Butyric Acid SCHEMBL5571749 | 0.93 | FFAR3 (0.93) | FFAR3HDAC3HDAC1HDAC2HDAC8 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 822 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115873224-B | Catalyst composition for polyester, hydrolysis-resistant polyester film and preparation method | 中国石油化工股份有限公司 | 2025-03-07 | — | — | CN | claimed |
| CN-118949964-A | Preparation method of high-efficiency anthraquinone degradation product regenerated catalyst | 广西化工研究院有限公司 | 2024-11-15 | — | — | CN | claimed |
| CN-114300679-B | High-first-time-efficiency anode material and preparation method thereof | 云南中晟新材料有限责任公司 | 2024-03-29 | — | — | CN | claimed |
| CN-116803908-A | Alumina, preparation method and application thereof | 嘉庚创新实验室 | 2023-09-26 | — | — | CN | claimed |
| CN-112993393-B | Polymer electrolyte with Al as center and preparation method and application thereof | 北京卫蓝新能源科技有限公司 | 2023-04-21 | — | — | CN | claimed |
| CN-115873224-A | Catalyst composition for polyester, hydrolysis-resistant polyester film and preparation method | 中国石油化工股份有限公司 | 2023-03-31 | — | — | CN | claimed |
| CN-114300679-A | High-first-time-efficiency negative electrode material and preparation method thereof | 云南中晟新材料有限责任公司 | 2022-04-08 | — | — | CN | claimed |
| CN-113856253-A | Efficient water-based paint defoaming agent and preparation method thereof | 江苏四新科技应用研究所股份有限公司 | 2021-12-31 | — | — | CN | claimed |
| CN-113257458-B | Conductor paste for chip resistor electrode | 西安宏星电子浆料科技股份有限公司 | 2021-10-08 | — | — | CN | claimed |
| CN-109694771-B | Lubricating grease composition and preparation method thereof | 中国石油化工股份有限公司 | 2021-10-08 | — | — | CN | claimed |
| EP-0919593-B1 | Aromatic polyimide film having improved adhesion | UBE INDUSTRIES (JP) | 2004-04-07 | — | — | EP | claimed |
| US-6652770-B2 | For prevention of the increase of temperature in heat sensitive devices through the absorption of heat during heat generating conditions | HAYES CLAUDE Q C (US) | 2003-11-25 | — | — | US | claimed |
| US-20020100894-A1 | Heat absorbing temperature control devices and method | HAYES CLAUDE Q C (US) | 2002-08-01 | — | — | US | claimed |
| US-6261475-B1 | THERMOSENSITIVE ELEMENTS | HAYES CLAUDE Q C (US) | 2001-07-17 | — | — | US | claimed |
| US-6129982-A | HIGH HEAT RESISTANCE, LOW ELECTROCONDUCTIVITY, AND HIGH BONDING STRENGTH, USED FOR ELECTRONICS; ALUMINUM OR ALUMINUM OXIDE LAYERS ON BOTH SIDE OF AROMATIC POLYIMIDE FILM | UBE INDUSTRIES, LTD. (JP) | 2000-10-10 | — | — | US | claimed |
| EP-0919593-A1 | Aromatic polyimide film having improved adhesion | UBE INDUSTRIES, LTD. (JP) | 1999-06-02 | — | — | EP | claimed |
| US-5520725-A | Dental glass ionomer cement composition | GC CORPORATION (JP) | 1996-05-28 | — | — | US | claimed |
| EP-0438886-B1 | Water- and oil-repellent treatment agent | MINNESOTA MINING & MFG (US) | 1994-02-02 | — | — | EP | claimed |
| US-4622069-A | Catalyst composition for forming electroless plating on ceramics | OKUNO CHEMICAL INDUSTRY CO., LTD. (JP) | 1986-11-11 | — | — | US | claimed |
| US-4482476-A | COUPLER | DAIKIN KOGYO CO., LTD. (JP) | 1984-11-13 | — | — | US | claimed |