SCHEMBL1123773

SCHEMBL1123773

O=C(O)C1(CC2CC=CCC2)CC=CCC1

nearest known ligand 0.35

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 10/20 0.35
TDP1 Q9NUW8 3/20 0.35
MEN1 O00255 2/20 0.35
KMT2A Q03164 2/20 0.35
ALDH1A1 P00352 6/20 0.35
GAA P10253 2/20 0.33
POLB P06746 1/20 0.33
HTT P42858 1/20 0.33
CYP1A2 P05177 1/20 0.33
CYP2D6 P10635 1/20 0.33
CYP2C19 P33261 1/20 0.33
PKM P14618 1/20 0.33
HSD17B10 Q99714 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17092523 0.84 KDM4E (0.36) KDM4ETDP1MEN1KMT2AALDH1A1
SCHEMBL28067611 0.80 KDM4E (0.35) KDM4ETDP1MEN1KMT2AALDH1A1
SCHEMBL9124355 0.76 KDM4E (0.36) KDM4ETDP1MEN1KMT2AALDH1A1
SCHEMBL28355203 0.74
SCHEMBL9350019 0.73
SCHEMBL873448 0.71 CYP2C19 (0.32) CYP2C19
SCHEMBL29988018 0.71 CYP2C19 (0.32) CYP2C19
SCHEMBL2419343 0.71 CYP2C19 (0.32) CYP2C19
SCHEMBL7825176 0.71 CYP2C19 (0.50) ALDH1A1CYP1A2CYP2C19
SCHEMBL29352013 0.71 SLC6A4 (0.33) ALDH1A1CYP1A2CYP2C19

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 172 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113444058-A Continuous preparation method of alicyclic epoxy compound 常州强力先端电子材料有限公司 2021-09-28 CN claimed
EP-1893702-B1 CURABLE COMPOSITION AND SUBSTRATES POSSESSING PROTECTIVE LAYER OBTAINED THEREFROM SABIC INNOVATIVE PLASTICS IP (NL) 2011-07-20 EP claimed
US-7622514-B2 curable formualtion containing a functionalized colloidal silica obtained from the reaction of surface hydroxyl groups of colloidal silica with at least one functionalizing silane, an acryalate monomer, a epoxy resin or polyepoxide, acrylate with epoxy functionality, a curing agent ( photoinitiators) SABIC INNOVATIVE PLASTICS IP B.V. (NL) 2009-11-24 US claimed
EP-1665375-B1 SOLVENT-MODIFIED RESIN COMPOSITIONS AND METHODS OF USE THEREOF MOMENTIVE PERFORMANCE MAT INC (US) 2009-10-21 EP claimed
EP-1899423-A1 CURABLE COMPOSITION AND ARTICLE POSSESSING PROTECTIVE LAYER OBTAINED THEREFROM Momentive Performance Materials Inc. (US) 2008-03-19 EP claimed
EP-1893702-A1 CURABLE COMPOSITION AND SUBSTRATES POSSESSING PROTECTIVE LAYER OBTAINED THEREFROM Momentive Performance Materials Inc. (US) 2008-03-05 EP claimed
EP-1882254-A1 OPTICAL INFORMATION STORAGE MEDIUM POSSESSING A MULTILAYER COATING General Electric Company (US) 2008-01-30 EP claimed
EP-1863874-A1 RESIN COMPOSITIONS AND METHODS OF USE THEREOF General Electric Company (US) 2007-12-12 EP claimed
JP-2007504334-A 2007-03-01 JP claimed
WO-2006121603-A1 CURABLE COMPOSITION AND SUBSTRATES POSSESSING PROTECTIVE LAYER OBTAINED THEREFROM MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2006-11-16 WO claimed
US-20060251901-A1 Curable composition and substrates possessing protective layer obtained therefrom MOMENTIVE PERFORMANCE MATERIALS INC. 2006-11-09 US claimed
WO-2006107659-A1 RESIN COMPOSITIONS AND METHODS OF USE THEREOF GENERAL ELECTRIC COMPANY (US) 2006-10-12 WO claimed
US-20060147719-A1 Curable epoxy composition with colloidal silica and phenolic resins on substrates MOMENTIVE PERFORMANCE MATERIALS INC. 2006-07-06 US claimed
EP-1665375-A1 SOLVENT-MODIFIED RESIN COMPOSITIONS AND METHODS OF USE THEREOF General Electric Company, (a New York Corporation) (US) 2006-06-07 EP claimed
US-20050170188-A1 Resin compositions and methods of use thereof GENERAL ELECTRIC COMPANY 2005-08-04 US claimed
US-20050131106-A1 Combinations of resin compositions and methods of use thereof MOMENTIVE PERFORMANCE MATERIALS INC. 2005-06-16 US claimed
WO-2005024938-A1 SOLVENT-MODIFIED RESIN COMPOSITIONS AND METHODS OF USE THEREOF GENERAL ELECTRIC COMPANY (US) 2005-03-17 WO claimed
US-20050049352-A1 Solvent-modified resin compositions and methods of use thereof GENERAL ELECTRIC COMPANY 2005-03-03 US claimed
US-20050048700-A1 No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance GENERAL ELECTRIC COMPANY 2005-03-03 US claimed
EP-0300163-A1 Process for the preparation of epoxides Degussa Aktiengesellschaft (DE) 1989-01-25 EP claimed