SCHEMBL1134050

SCHEMBL1134050

C[CH]OC(C)(C)CC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6175625 0.78 TSHR (0.47)
SCHEMBL1475815 0.77
SCHEMBL1475816 0.77
SCHEMBL3317232 0.77
SCHEMBL6179549 0.75
SCHEMBL1001964 0.73
SCHEMBL9935762 0.73
SCHEMBL20527523 0.73
SCHEMBL28088 0.73
SCHEMBL1219337 0.73

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 189 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6455223-B1 COMPOSITION COMPRISING AS BASE RESIN DENDRITIC OR HYPERBRANCHED POLYMER OF PHENOL DERIVATIVE HAVING SPECIFIED WEIGHT AVERAGE MOLECULAR WEIGHT; HIGH RESOLUTION, HIGH SENSITIVITY, MINIMIZED LINE EDGE ROUGHNESS, ETCH RESISTANCE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2002-09-24 US claimed
US-6369279-B1 STYRENE WITH ETHER OR FLUORINE GROUPS FOR POLYMERS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2002-04-09 US claimed
US-5856561-A Bisphenol carboxylic acid tertiary ester derivatives and chemically amplified positive resist compositions SHIN-ETSU CHEMICAL CO., LTD. (JP) 1999-01-05 US claimed
CN-108107676-B Chemically amplified positive resist film laminate and pattern formation method 信越化学工业株式会社 2023-02-21 CN disclosed
CN-108459469-B Pattern forming method 信越化学工业株式会社 2022-11-11 CN disclosed
US-11256174-B2 Pattern forming process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2022-02-22 US disclosed
CN-105404096-B Chemically amplified positive resist dry film, dry film laminate and method for producing laminate 信越化学工业株式会社 2021-07-16 CN disclosed
CN-105319852-B Photosensitive resin composition, protective film and element with protective film 奇美实业股份有限公司 2020-06-26 CN disclosed
CN-105319845-B Photosensitive resin composition, protective film and element with protective film 奇美实业股份有限公司 2020-04-21 CN disclosed
EP-3367164-B1 PATTERN FORMING PROCESS SHINETSU CHEMICAL CO (JP) 2019-11-13 EP disclosed
EP-3327504-B1 CHEMICALLY AMPLIFIED POSITIVE RESIST FILM LAMINATE AND PATTERN FORMING PROCESS SHINETSU CHEMICAL CO (JP) 2019-05-15 EP disclosed
US-5817603-A HERBICIDES BASF AKTIENGESELLSCHAFT (DE) 1998-10-06 US disclosed
US-5602074-A HERBICIDES; PLANT DESICCATION, DEFOLIATION BASF AKTIENGESELLSCHAFT (DE) 1997-02-11 US disclosed
WO-1996005179-A1 SUBSTITUTED TRIAZOLINONES AS PLANT PROTECTIVE AGENTS BASF AKTIENGESELLSCHAFT (DE) 1996-02-22 WO disclosed
EP-0641321-A1 SUBSTITUTED ISOINDOLONES BASF Aktiengesellschaft (DE) 1995-03-08 EP disclosed
WO-1994011344-A1 SUBSTITUTED 3,4,5,6-TETRAHYDROPHTHALIMIDES FOR USE AS HERBICIDES AND/OR DEFOLIANTS OR DESICCANTS BASF AKTIENGESELLSCHAFT (DE) 1994-05-26 WO disclosed
WO-1993024456-A1 SUBSTITUTED ISOINDOLONES BASF AKTIENGESELLSCHAFT (DE) 1993-12-09 WO disclosed
US-5266171-A Electrochemical oxidation in and etherification BASF AKTIENGESELLSCHAFT (DE) 1993-11-30 US disclosed
WO-1993022280-A1 SUBSTITUTED CYCLOHEXENE-1,2-BICARBOXYLIC ACID DERIVATIVES AND RAW MATERIALS FOR PRODUCING THEM BASF AKTIENGESELLSCHAFT (DE) 1993-11-11 WO disclosed
US-5179210-A PREPARATION OF N-SUBSTITUTED IMIDAZOLES BASF AKTIENGESELLSCHAFT (DE) 1993-01-12 US disclosed