SCHEMBL114196

SCHEMBL114196

CC(C)CCCCCCCCCCCCCCCOC(=O)CCCCCN1C(=O)C=CC1=O

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PTGS1 P23219 7/20 0.50
PTGS2 P35354 7/20 0.50
MGLL Q99685 5/20 0.45
FAAH O00519 3/20 0.45
ALDH1A1 P00352 3/20 0.45
MAPT P10636 3/20 0.45
MAPK1 P28482 3/20 0.45
RECQL P46063 2/20 0.45
HPGD P15428 2/20 0.45
HSP90AA1 P07900 1/20 0.45
TLR9 Q9NR96 1/20 0.45
LMNA P02545 1/20 0.45
TP53 P04637 1/20 0.45
PKM P14618 1/20 0.45
XBP1 P17861 1/20 0.45
HTT P42858 1/20 0.45
RAB9A P51151 1/20 0.45
SMN1; SMN2 Q16637 1/20 0.45
NPSR1 Q6W5P4 1/20 0.45
GPR35 Q9HC97 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31721951 1.00 PTGS1 (0.50) PTGS1PTGS2MGLLFAAHALDH1A1
SCHEMBL18840673 1.00 PTGS1 (0.50) PTGS1PTGS2MGLLFAAHALDH1A1
SCHEMBL5163801 0.92 PTGS1 (0.53) PTGS1PTGS2MGLLFAAHALDH1A1
SCHEMBL5164620 0.92 PTGS1 (0.53) PTGS1PTGS2MGLLFAAHALDH1A1
SCHEMBL14540366 0.89 PTGS1 (0.62) PTGS1PTGS2MGLLFAAHALDH1A1
SCHEMBL31722230 0.87 PTGS1 (0.48) PTGS1PTGS2MGLLFAAHALDH1A1
SCHEMBL12312431 0.86 PTGS1 (0.53) PTGS1PTGS2MGLLFAAHALDH1A1
SCHEMBL13568739 0.86 PTGS1 (0.53) PTGS1PTGS2MGLLFAAHALDH1A1
SCHEMBL5165574 0.86 PTGS1 (0.44) PTGS1PTGS2MGLLFAAHALDH1A1
SCHEMBL14540361 0.86 PTGS1 (0.54) PTGS1PTGS2MGLLFAAHMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 112 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2004746-B1 RADIATION-CURABLE RUBBER ADHESIVE/SEALANT HENKEL AG & CO KGAA (DE) 2018-08-01 EP disclosed
EP-2297238-B1 THIXOTROPIC CONDUCTIVE COMPOSITION Henkel IP & Holding GmbH (DE) 2018-04-04 EP disclosed
EP-1944797-B1 Making a semiconductor device using a highly conductive composition for wafer coating HENKEL AG & CO KGAA (DE) 2014-11-26 EP disclosed
US-20140190736-A1 RADIATION-CURABLE RUBBER ADHESIVE/SEALANT CAO JIE (US) 2014-07-10 US disclosed
US-20140190736-A1 RADIATION-CURABLE RUBBER ADHESIVE/SEALANT CAO JIE (US) 2014-07-10 US disclosed
US-8426986-B2 Phase separated curable compositions HENKEL CORPORATION (US) 2013-04-23 US disclosed
US-8426986-B2 Phase separated curable compositions HENKEL CORPORATION (US) 2013-04-23 US disclosed
US-8324319-B2 Redox-induced cationically polymerizable compositions with low cure temperature HENKEL AG & CO. KGAA (DE) 2012-12-04 US disclosed
US-8324319-B2 Redox-induced cationically polymerizable compositions with low cure temperature HENKEL AG & CO. KGAA (DE) 2012-12-04 US disclosed
US-8286465-B2 Self-filleting die attach paste HENKEL AG & CO. KGAA (DE) 2012-10-16 US disclosed
EP-1758163-A1 Quinolinols as fluxing and accelerating agents for underfill compositions National Starch and Chemical Investment Holding Corporation (US) 2007-02-28 EP disclosed
EP-1758164-A1 Quinolinols and quinolinol derivatives as adhesion promoters in die attach adhesives National Starch and Chemical Investment Holding Corporation (US) 2007-02-28 EP disclosed
US-20070043136-A1 Radiation-curable desiccant-filled adhesive/sealant HENKEL KGAA (DE) 2007-02-22 US disclosed
US-20070043136-A1 Radiation-curable desiccant-filled adhesive/sealant HENKEL KGAA (DE) 2007-02-22 US disclosed
US-20070032578-A1 Curable liquid compositions containing bisoxazoline HENKEL KGAA (DE) 2007-02-08 US disclosed
US-20070032578-A1 Curable liquid compositions containing bisoxazoline HENKEL KGAA (DE) 2007-02-08 US disclosed
US-7160946-B2 Method to improve high temperature cohesive strength with adhesive having multi-phase system NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION (US) 2007-01-09 US disclosed
US-7160946-B2 Method to improve high temperature cohesive strength with adhesive having multi-phase system NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION (US) 2007-01-09 US disclosed
US-20070003758-A1 Dicing die bonding film NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION 2007-01-04 US disclosed
US-20070003758-A1 Dicing die bonding film NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION 2007-01-04 US disclosed