Ethylene

Ethylene

SCHEMBL1147680

C=C.CCCCCCC(O)CCCCCCCCCCC(=O)O

nearest known ligand 0.92

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
FFAR4 Q5NUL3 3/20 0.92
FFAR1 O14842 3/20 0.92
GPR84 Q9NQS5 9/20 0.65
PPARG P37231 7/20 0.65
PPARD Q03181 7/20 0.65
PPARA Q07869 7/20 0.65
HDAC11 Q96DB2 5/20 0.65
TSHR P16473 4/20 0.65
PTPN1 P18031 3/20 0.65
ALDH1A1 P00352 2/20 0.65
TLR2 O60603 2/20 0.65
TDP1 Q9NUW8 2/20 0.65
FABP4 P15090 2/20 0.65
SLC22A6 Q4U2R8 1/20 0.65
SLC22A8 Q8TCC7 1/20 0.65
MEN1 O00255 1/20 0.65
ESR1 P03372 1/20 0.65
ALOX15 P16050 1/20 0.65
PDE4A P27815 1/20 0.65
KMT2A Q03164 1/20 0.65

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Palmitic Acid SCHEMBL21526666 0.96 FFAR4 (1.00) FFAR4FFAR1GPR84PPARGPPARD
Palmitic Acid SCHEMBL20818808 0.96 FFAR4 (1.00) FFAR4FFAR1GPR84PPARGPPARD
SCHEMBL22400861 0.96 FFAR4 (1.00) FFAR4FFAR1GPR84PPARGPPARD
Azelaic Acid SCHEMBL25433337 0.96 FFAR4 (1.00) FFAR4FFAR1GPR84PPARGPPARD
SCHEMBL22400945 0.96 FFAR4 (1.00) FFAR4FFAR1GPR84PPARGPPARD
SCHEMBL25190974 0.96 FFAR4 (1.00) FFAR4FFAR1GPR84PPARGPPARD
SCHEMBL22400864 0.96 FFAR4 (1.00) FFAR4FFAR1GPR84PPARGPPARD
Sebacic Acid SCHEMBL25270035 0.96 FFAR4 (1.00) FFAR4FFAR1GPR84PPARGPPARD
SCHEMBL20587804 0.96 FFAR4 (1.00) FFAR4FFAR1GPR84PPARGPPARD
SCHEMBL22400948 0.96 FFAR4 (1.00) FFAR4FFAR1GPR84PPARGPPARD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20120245156-A1 ORAL LYOPHILIZED COMPOSITIONS CEPHALON FRANCE (FR) 2012-09-27 US claimed
EP-2359812-A1 Oral lyophilised compositions CEPHALON FRANCE (FR) 2011-08-24 EP claimed
WO-2011086193-A1 ORAL LYOPHILIZED COMPOSITIONS CEPHALON FRANCE (FR) 2011-07-21 WO claimed
CN-117464242-A Rosin base resin for lead-free solder flux, and lead-free solder paste 荒川化学工业株式会社 2024-01-30 CN disclosed
CN-114196486-A Stock solution for detergent composition, and detergent composition containing the same 荒川化学工业株式会社 2022-03-18 CN disclosed
CN-112935632-A Rosin-based base resin for lead-free solder flux, and lead-free solder paste 荒川化学工业株式会社 2021-06-11 CN disclosed
EP-2243592-B1 SOLDER BONDING STRUCTURE AND SOLDER PASTE HARIMA CHEMICALS INC (JP) 2020-04-01 EP disclosed
CN-107206552-A Without lead solder solder flux and leadless solder paste 荒川化学工业株式会社 2017-09-26 CN disclosed
CN-106233005-A The adhesion separation method of bur, metallic composite 株式会社村田制作所 2016-12-14 CN disclosed
CN-103269826-B Lead-free solder scaling powder and lead-free solder paste 荒川化学工业株式会社 2016-12-07 CN disclosed
CN-104321387-B Scaling powder base resin, scaling powder and soldering paste 荒川化学工业株式会社 2016-10-12 CN disclosed
US-8679263-B2 Solder bonding structure and soldering flux HARIMA CHEMICALS, INC. (JP) 2014-03-25 US disclosed
CN-103269826-A Lead-free solder flux and lead-free solder paste ARAKAWA CHEM IND 2013-08-28 CN disclosed
CN-101939130-B Welded joint structure and flux for brazing HARIMA CHEMICALS INC 2013-05-08 CN disclosed
US-20120245156-A1 ORAL LYOPHILIZED COMPOSITIONS CEPHALON FRANCE (FR) 2012-09-27 US disclosed
EP-2359812-A1 Oral lyophilised compositions CEPHALON FRANCE (FR) 2011-08-24 EP disclosed
WO-2011086193-A1 ORAL LYOPHILIZED COMPOSITIONS CEPHALON FRANCE (FR) 2011-07-21 WO disclosed
US-20110036628-A1 SOLDER BONDING STRUCTURE AND SOLDERING FLUX HARIMA CHEMICALS, INC. (JP) 2011-02-17 US disclosed
CN-101939130-A Welded joint structure and flux for brazing HARIMA CHEMICALS INC 2011-01-05 CN disclosed
EP-2243592-A1 SOLDER BONDING STRUCTURE AND SOLDERING FLUX Harima Chemicals, Inc. (JP) 2010-10-27 EP disclosed