Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KCNN4 | O15554 | 1/20 | 0.44 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.44 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.44 |
| ▸ | TAAR1 | Q96RJ0 | 3/20 | 0.41 |
| ▸ | ADRA2A | P08913 | 1/20 | 0.40 |
| ▸ | ADRA2C | P18825 | 1/20 | 0.40 |
| ▸ | LMNA | P02545 | 1/20 | 0.40 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.40 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.40 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.39 |
| ▸ | DPP4 | P27487 | 2/20 | 0.39 |
| ▸ | F2 | P00734 | 1/20 | 0.39 |
| ▸ | KIF11 | P52732 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5284524 | 0.82 | KCNN4 (0.44) | KCNN4CYP1A2CYP2D6TAAR1ADRA2A | |
| Bromide SCHEMBL5088285 | 0.80 | CYP1A2 (0.42) | KCNN4CYP1A2CYP2D6TAAR1ADRA2A | |
| SCHEMBL14944876 | 0.80 | CYP1A2 (0.42) | KCNN4CYP1A2CYP2D6TAAR1ADRA2A | |
| Hydrochloric Acid SCHEMBL5087108 | 0.80 | CYP1A2 (0.42) | KCNN4CYP1A2CYP2D6TAAR1ADRA2A | |
| Water SCHEMBL11129746 | 0.80 | CYP1A2 (0.42) | KCNN4CYP1A2CYP2D6TAAR1ADRA2A | |
| Iodide SCHEMBL5091725 | 0.80 | CYP1A2 (0.42) | KCNN4CYP1A2CYP2D6TAAR1ADRA2A | |
| SCHEMBL28024684 | 0.78 | CYP2D6 (0.46) | KCNN4CYP1A2CYP2D6TAAR1ADRA2A | |
| SCHEMBL6741619 | 0.78 | TAAR1 (0.41) | KCNN4CYP1A2CYP2D6TAAR1ADRA2A | |
| SCHEMBL6542251 | 0.78 | CYP2D6 (0.54) | KCNN4CYP1A2CYP2D6TAAR1HIF1A | |
| SCHEMBL11772008 | 0.76 | KCNN4 (0.48) | KCNN4CYP1A2CYP2D6TAAR1ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 362 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11535686-B2 | Tough, high temperature polymers produced by stereolithography | CARBON, INC. (US) | 2022-12-27 | — | — | US | claimed |
| CN-111205646-B | Black matte polyimide film and preparation method thereof | 株洲时代华鑫新材料技术有限公司 | 2022-09-09 | — | — | CN | claimed |
| CN-110873919-B | Optical film | 住友化学株式会社 | 2022-08-19 | — | — | CN | claimed |
| CN-114605153-A | Preparation method of high-thermal-conductivity graphite film | 中汇睿能凤阳新材料科技有限公司 | 2022-06-10 | — | — | CN | claimed |
| EP-3459983-A1 | MANUFACTURE OF POLYURETHANE SYSTEMS | Evonik Degussa GmbH (DE) | 2019-03-27 | — | — | EP | claimed |
| US-8779036-B2 | Catalysis of epoxy resin formulations | EVONIK DEGUSSA GMBH (DE) | 2014-07-15 | — | — | US | claimed |
| EP-2456804-A1 | CATALYSIS OF EPOXY RESIN FORMULATIONS HAVING SPARINGLY SOLUBLE CATALYSTS | Evonik Degussa GmbH (DE) | 2012-05-30 | — | — | EP | claimed |
| US-20120115988-A1 | CATALYSIS OF EPOXY RESIN FORMULATIONS HAVING SPARINGLY SOLUBLE CATALYSTS | EVONIK DEGUSSA GMBH (DE) | 2012-05-10 | — | — | US | claimed |
| EP-2424916-A1 | CATALYSIS OF EPOXY RESIN FORMULATIONS | Evonik Degussa GmbH (DE) | 2012-03-07 | — | — | EP | claimed |
| US-20120041101-A1 | CATALYSIS OF EPOXY RESIN FORMULATIONS | EVONIK DEGUSSA GMBH (DE) | 2012-02-16 | — | — | US | claimed |
| WO-2011009648-A1 | CATALYSIS OF EPOXY RESIN FORMULATIONS HAVING SPARINGLY SOLUBLE CATALYSTS | EVONIK DEGUSSA GMBH (DE) | 2011-01-27 | — | — | WO | claimed |
| WO-2010124901-A1 | CATALYSIS OF EPOXY RESIN FORMULATIONS | EVONIK DEGUSSA GMBH (DE) | 2010-11-04 | — | — | WO | claimed |
| US-7416695-B2 | Semiconductive polymide film and process for production thereof | KANEKA CORPORATION (JP) | 2008-08-26 | — | — | US | claimed |
| EP-0538850-B1 | New polyurea resins and their preparation and use | IHARA CHEMICAL IND CO (JP) | 1997-01-22 | — | — | EP | claimed |
| EP-0362649-B1 | Radiation-sensitive compositions and their use | BASF AG (DE) | 1994-03-02 | — | — | EP | claimed |
| US-5284734-A | Insulating layers and printed circuits; precursors for polyimides and polyquinazolines | BASF AKTIENGESELLSCHAFT (DE) | 1994-02-08 | — | — | US | claimed |
| EP-0538850-A2 | New polyurea resins and their preparation and use | IHARA CHEMICAL INDUSTRY Co., Ltd. (JP) | 1993-04-28 | — | — | EP | claimed |
| EP-0362649-A2 | Radiation-sensitive compositions and their use | BASF Aktiengesellschaft (DE) | 1990-04-11 | — | — | EP | claimed |
| EP-0323644-A1 | Polyimide resin and insulating film for electric and electronic devices | NISSAN CHEMICAL INDUSTRIES LTD. (JP) | 1989-07-12 | — | — | EP | claimed |
| CN-115891346-B | Metal-clad laminate, circuit board, electronic component, and electronic device | 日铁化学材料株式会社 | 2026-05-15 | — | — | CN | disclosed |
| US-12590208-B2 | Thermoplastic resin foam, thermoplastic resin foam sheet, fiber-reinforced resin composite, method for manufacturing thermoplastic resin foam, thermoplastic resin foam molded article, method for manufacturing thermoplastic resin foam molded article, and foamed resin composite | SEKISUI KASEI CO., LTD. (JP) | 2026-03-31 | — | — | US | disclosed |
| US-20250346717-A1 | FOAMED THERMOPLASTIC RESIN PARTICLES, MOLDED BODY OF FOAMED THERMOPLASTIC RESIN PARTICLES, FOAMED RESIN COMPOSITE, METHOD FOR PRODUCING FOAMED THERMOPLASTIC RESIN PARTICLES, AND METHOD FOR PRODUCING MOLDED BODY OF FOAMED THERMOPLASTIC RESIN PARTICLES | SEKISUI KASEI CO., LTD. (JP) | 2025-11-13 | — | — | US | disclosed |
| EP-3505573-B1 | BLACK PIGMENT, METHOD FOR PRODUCING SAME, PIGMENT DISPERSION LIQUID, PHOTOSENSITIVE COMPOSITION AND CURED PRODUCT OF SAID PHOTOSENSITIVE COMPOSITION | TORAY INDUSTRIES (JP) | 2025-10-22 | — | — | EP | disclosed |
| EP-4190533-B1 | THERMOPLASTIC RESIN FOAM, THERMOPLASTIC RESIN FOAM SHEET, FIBER-REINFORCED RESIN COMPOSITE, METHOD FOR MANUFACTURING THERMOPLASTIC RESIN FOAM, THERMOPLASTIC RESIN FOAM MOLDED ARTICLE, METHOD FOR MANUFACTURING THERMOPLASTIC RESIN FOAM MOLDED ARTICLE, AND FOAMED RESIN COMPOSITE | SEKISUI KASEI CO LTD (JP) | 2025-10-01 | — | — | EP | disclosed |
| CN-120153013-A | Prepreg, laminate, printed wiring board, and semiconductor package | 株式会社力森诺科 | 2025-06-13 | — | — | CN | disclosed |
| EP-4538319-A1 | FOAMED THERMOPLASTIC RESIN PARTICLES, MOLDED BODY OF FOAMED THERMOPLASTIC RESIN PARTICLES, FOAMED RESIN COMPOSITE, METHOD FOR PRODUCING FOAMED THERMOPLASTIC RESIN PARTICLES, AND METHOD FOR PRODUCING MOLDED BODY OF FOAMED THERMOPLASTIC RESIN PARTICLES | Sekisui Kasei Co., Ltd. (JP) | 2025-04-16 | — | — | EP | disclosed |
| CN-116507667-B | Multilayer polyimide film, metal foil-clad laminate, and method for producing multilayer polyimide film | 株式会社钟化 | 2025-02-14 | — | — | CN | disclosed |
| CN-119365523-A | Articles comprising a combination of polymer aerogel and melamine formaldehyde foam and related systems and methods | 气凝胶科技有限责任公司 | 2025-01-24 | — | — | CN | disclosed |
| US-20250019242-A1 | DISPERSION OF CARBON NANOTUBES, COATING LIQUID COMPOSITION FOR ELECTRODE USING SAME, ELECTRODE, AND LITHIUM ION SECONDARY BATTERY | DKS CO. LTD. (JP) | 2025-01-16 | — | — | US | disclosed |
| CN-119110828-A | Thermosetting resin composition, prepreg, resin film, laminate, printed wiring board, antenna device, antenna module, and communication device | 株式会社力森诺科 | 2024-12-10 | — | — | CN | disclosed |
| CN-111978511-B | Epoxy resin, method for producing same, curable epoxy resin composition, cured product, prepreg, insulating sheet, and laminate | 日铁化学材料株式会社 | 2024-10-25 | — | — | CN | disclosed |
| CN-118749007-A | Polyamic acid, polyimide, non-thermoplastic polyimide film, multilayer polyimide film, and metal-clad laminate | 株式会社钟化 | 2024-10-08 | — | — | CN | disclosed |
| CN-118742610-A | Thermosetting resin composition, prepreg, resin film, laminate, printed wiring board, and semiconductor package | 株式会社力森诺科 | 2024-10-01 | — | — | CN | disclosed |
| EP-4428195-A1 | DISPERSION OF CARBON NANOTUBES, COATING LIQUID COMPOSITION FOR ELECTRODE USING SAME, ELECTRODE, AND LITHIUM ION SECONDARY BATTERY | DKS Co. Ltd. (JP) | 2024-09-11 | — | — | EP | disclosed |
| CN-118541450-A | Thermosetting resin composition, prepreg, resin film, laminated board, printed circuit board, antenna device, antenna module, and communication device | 株式会社力森诺科 | 2024-08-23 | — | — | CN | disclosed |
| CN-113950516-B | Thermoplastic resin member with primer and resin-resin joined body | 株式会社力森诺科 | 2024-07-23 | — | — | CN | disclosed |
| CN-118339212-A | Method for treating polyimide | 古德温公开有限公司 | 2024-07-12 | — | — | CN | disclosed |
| CN-115003506-B | Multilayer film and method for producing same | ＡＧＣ株式会社 | 2024-07-09 | — | — | CN | disclosed |
| EP-4388034-A1 | METHOD FOR TREATING POLYIMIDE | Goodwin PLC (GB) | 2024-06-26 | — | — | EP | disclosed |
| CN-118176259-A | Dispersion of carbon nanotubes, coating liquid composition for electrode using same, electrode, and lithium ion secondary battery | 第一工业制药株式会社 | 2024-06-11 | — | — | CN | disclosed |
| US-11940729-B2 | Photosensitive composition, negative photosensitive composition, pixel division layer and organic EL display device | TORAY INDUSTRIES, INC. (JP) | 2024-03-26 | — | — | US | disclosed |
| CN-112898738-B | Epoxy resin composition, prepreg, laminate, printed wiring board, and cured product using same | 日铁化学材料株式会社 | 2024-03-22 | — | — | CN | disclosed |
| CN-110982267-B | Thermosetting resin composition, method for producing same, prepreg, laminated board, and printed wiring board | 株式会社力森诺科 | 2024-03-08 | — | — | CN | disclosed |
| CN-115971017-B | Method for producing polyimide film, method for producing metal-clad laminate, and method for producing circuit board | 日铁化学材料株式会社 | 2024-01-16 | — | — | CN | disclosed |
| CN-112585191-B | Process and formulation for producing polyamides with low caprolactam concentration and specific relative viscosity | 奥升德功能材料运营有限公司 | 2023-12-19 | — | — | CN | disclosed |
| WO-2023238958-A1 | FOAMED THERMOPLASTIC RESIN PARTICLES, MOLDED BODY OF FOAMED THERMOPLASTIC RESIN PARTICLES, FOAMED RESIN COMPOSITE, METHOD FOR PRODUCING FOAMED THERMOPLASTIC RESIN PARTICLES, AND METHOD FOR PRODUCING MOLDED BODY OF FOAMED THERMOPLASTIC RESIN PARTICLES | 積水化成品工業株式会社 | 2023-12-14 | — | — | WO | disclosed |
| US-11834574-B2 | Dual cure additive manufacturing resins for production of flame retardant objects | CARBON, INC. (US) | 2023-12-05 | — | — | US | disclosed |
| CN-115195104-B | Dual precursor resin system for additive manufacturing with dual cure resins | 卡本有限公司 | 2023-12-05 | — | — | CN | disclosed |
| US-11833744-B2 | Dual precursor resin systems for additive manufacturing with dual cure resins | CARBON, INC. (US) | 2023-12-05 | — | — | US | disclosed |
| CN-110520433-B | Phosphorus-containing phenol compound, phosphorus-containing epoxy resin, curable resin composition or epoxy resin composition, and cured product thereof | 日铁化学材料株式会社 | 2023-12-05 | — | — | CN | disclosed |
| US-11814472-B2 | Epoxy dual cure resins for additive manufacturing | CARBON, INC. (US) | 2023-11-14 | — | — | US | disclosed |
| CN-109679094-B | Polyimide precursor, polyimide, laminate, and flexible device | 日铁化学材料株式会社 | 2023-10-24 | — | — | CN | disclosed |
| CN-114008139-B | Resin composition, method for producing resin composition, and insulated wire | 住友电气工业株式会社 | 2023-10-20 | — | — | CN | disclosed |
| US-20230330946-A1 | METHOD FOR JOINING METAL AND RESIN, AND JOINED BODY THEREOF | SHOWA DENKO K.K. (JP) | 2023-10-19 | — | — | US | disclosed |
| EP-3620459-B9 | PHOSPHORUS-CONTAINING PHENOLIC COMPOUND, PHOSPHORUS-CONTAINING EPOXY RESIN, CURABLE RESIN COMPOSITION THEREOF, OR EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF | NIPPON STEEL CHEMICAL & MAT CO LTD (JP) | 2023-10-04 | — | — | EP | disclosed |
| CN-112601781-B | Polyamide composition and plating application thereof | 奥升德功能材料运营有限公司 | 2023-09-29 | — | — | CN | disclosed |
| CN-116802054-A | High-thickness multilayer polyimide film and preparation method thereof | 聚酰亚胺先端材料有限公司 | 2023-09-22 | — | — | CN | disclosed |
| US-20230295420-A1 | THERMOPLASTIC RESIN FOAM, THERMOPLASTIC RESIN FOAM SHEET, FIBER-REINFORCED RESIN COMPOSITE, METHOD FOR MANUFACTURING THERMOPLASTIC RESIN FOAM, THERMOPLASTIC RESIN FOAM MOLDED ARTICLE, METHOD FOR MANUFACTURING THERMOPLASTIC RESIN FOAM MOLDED ARTICLE, AND FOAMED RESIN COMPOSITE | SEKISUI KASEI CO., LTD. (JP) | 2023-09-21 | — | — | US | disclosed |
| CN-112585189-B | Epoxy resin composition, prepreg, laminated board, material for circuit board, cured product, and method for producing phosphorus-containing epoxy resin | 日铁化学材料株式会社 | 2023-08-01 | — | — | CN | disclosed |
| CN-116507667-A | Multilayer polyimide film, metal foil-clad laminate, and method for producing multilayer polyimide film | 株式会社钟化 | 2023-07-28 | — | — | CN | disclosed |
| CN-116419849-A | Non-thermoplastic polyimide film, multi-layer polyimide film and metal foil clad laminate | 株式会社钟化 | 2023-07-11 | — | — | CN | disclosed |
| CN-111819077-B | Laminate and method for producing same | 株式会社有泽制作所 | 2023-07-07 | — | — | CN | disclosed |
| CN-116353168-A | Resin laminate, circuit board, electronic component, and electronic device | 日铁化学材料株式会社 | 2023-06-30 | — | — | CN | disclosed |
| CN-116367413-A | Metal-clad laminate and circuit board | 日铁化学材料株式会社 | 2023-06-30 | — | — | CN | disclosed |
| CN-115315463-B | Polyimide resin, method for producing same, polyimide resin solution, coating material, and molding material | 杰富意化学株式会社 | 2023-06-20 | — | — | CN | disclosed |
| EP-3845578-B1 | PHOSPHOROUS-CONTAINING EPOXY RESIN, EPOXY RESIN COMPOSITION, PREPREG, LAMINATED PLATE, MATERIAL FOR CIRCUIT BOARD AND CURED PRODUCT | NIPPON STEEL CHEMICAL & MAT CO LTD (JP) | 2023-06-07 | — | — | EP | disclosed |
| EP-4190533-A1 | THERMOPLASTIC RESIN FOAM, THERMOPLASTIC RESIN FOAM SHEET, FIBER-REINFORCED RESIN COMPOSITE, METHOD FOR MANUFACTURING THERMOPLASTIC RESIN FOAM, THERMOPLASTIC RESIN FOAM MOLDED ARTICLE, METHOD FOR MANUFACTURING THERMOPLASTIC RESIN FOAM MOLDED ARTICLE, AND FOAMED RESIN COMPOSITE | Sekisui Kasei Co., Ltd. (JP) | 2023-06-07 | — | — | EP | disclosed |
| WO-2023094840-A1 | METHOD FOR TREATING POLYIMIDE | GOODWIN PLC (GB) | 2023-06-01 | — | — | WO | disclosed |
| CN-116178713-A | Polyimide film | 住友化学株式会社 | 2023-05-30 | — | — | CN | disclosed |
| EP-3620459-B1 | PHOSPHORUS-CONTAINING PHENOLIC COMPOUND, PHOSPHORUS-CONTAINING EPOXY RESIN, CURABLE RESIN COMPOSITION THEREOF, OR EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF | NIPPON STEEL CHEMICAL & MAT CO LTD (JP) | 2023-05-24 | — | — | EP | disclosed |
| CN-116113536-A | Method for joining metal and resin and joined body thereof | 株式会社力森诺科 | 2023-05-12 | — | — | CN | disclosed |
| WO-2023080059-A1 | DISPERSION OF CARBON NANOTUBES, COATING LIQUID COMPOSITION FOR ELECTRODE USING SAME, ELECTRODE, AND LITHIUM ION SECONDARY BATTERY | 第一工業製薬株式会社 | 2023-05-11 | — | — | WO | disclosed |
| US-20230143277-A1 | DUAL CURE STEREOLITHOGRAPHY RESINS CONTAINING DIELS-ALDER ADDUCTS | CARBON INC (US) | 2023-05-11 | — | — | US | disclosed |
| CN-116034030-A | Method for producing laminated film, and laminated film | ＡＧＣ株式会社 | 2023-04-28 | — | — | CN | disclosed |
| US-20230127537-A1 | PHOTOSENSITIVE COMPOSITION, NEGATIVE PHOTOSENSITIVE COMPOSITION, PIXEL DIVISION LAYER AND ORGANIC EL DISPLAY DEVICE | TORAY INDUSTRIES, INC. (JP) | 2023-04-27 | — | — | US | disclosed |
| CN-115971017-A | Method for producing polyimide film, method for producing metal-clad laminate, and method for producing circuit board | 日铁化学材料株式会社 | 2023-04-18 | — | — | CN | disclosed |
| US-11629202-B2 | Dual cure stereolithography resins containing thermoplastic particles | CARBON, INC. (US) | 2023-04-18 | — | — | US | disclosed |
| CN-112601782-B | Polyamide composition and plating application thereof | 奥升德功能材料运营有限公司 | 2023-04-07 | — | — | CN | disclosed |
| CN-115943062-A | Dual cure additive manufacturing resin for producing flame retardant objects | 卡本有限公司 | 2023-04-07 | — | — | CN | disclosed |
| US-20230104309-A1 | ELECTRODE BODY, METHOD FOR MANUFACTURING ELECTRODE BODY, AND ELECTROCHEMICAL ELEMENT | SHOWA DENKO K.K. (JP) | 2023-04-06 | — | — | US | disclosed |
| EP-3849806-B1 | DUAL CURE ADDITIVE MANUFACTURING RESINS FOR PRODUCTION OF FLAME RETARDANT OBJECTS | CARBON INC (US) | 2023-04-05 | — | — | EP | disclosed |
| CN-115891346-A | Metal-clad laminate, circuit board, electronic component, and electronic device | 日铁化学材料株式会社 | 2023-04-04 | — | — | CN | disclosed |
| CN-115884996-A | Film | 住友化学株式会社 | 2023-03-31 | — | — | CN | disclosed |
| US-20230095097-A1 | TOUGH, HIGH TEMPERATURE POLYMERS PRODUCED BY STEREOLITHOGRAPHY | CARBON INC (US) | 2023-03-30 | — | — | US | disclosed |
| EP-3262110-B1 | IMPREGNATING RESINS WHICH ARE STABLE WHEN STORED AND ELECTRO ISOLATION TAPES | SIEMENS ENERGY GLOBAL GMBH & CO KG (DE) | 2023-03-29 | — | — | EP | disclosed |
| EP-4131594-A1 | ELECTRODE BODY, METHOD FOR MANUFACTURING ELECTRODE BODY, AND ELECTROCHEMICAL ELEMENT | Showa Denko K.K. (JP) | 2023-02-08 | — | — | EP | disclosed |
| CN-115678420-A | Varnish, optical film, and method for producing optical film | 住友化学株式会社 | 2023-02-03 | — | — | CN | disclosed |
| US-11555095-B2 | Dual cure resin for the production of moisture-resistant articles by additive manufacturing | CARBON, INC. (US) | 2023-01-17 | — | — | US | disclosed |
| US-11535686-B2 | Tough, high temperature polymers produced by stereolithography | CARBON, INC. (US) | 2022-12-27 | — | — | US | disclosed |
| CN-111556883-B | Polyimide film having improved alkali resistance and method for preparing the same | 韩国爱思开希可隆PI股份有限公司 | 2022-12-23 | — | — | CN | disclosed |
| CN-110662795-B | Prepreg, method for producing same, laminate, printed wiring board, and semiconductor package | 昭和电工材料株式会社 | 2022-12-06 | — | — | CN | disclosed |
| CN-115403742-A | Oxazolidone ring-containing epoxy resin, process for producing the same, epoxy resin composition and use thereof, and cured epoxy resin | 日铁化学材料株式会社 | 2022-11-29 | — | — | CN | disclosed |
| CN-115380422-A | Electrode body, method for producing electrode body, and electrochemical element | 昭和电工株式会社 | 2022-11-22 | — | — | CN | disclosed |
| CN-115216149-A | Porous polyimide film | 日东电工株式会社 | 2022-10-21 | — | — | CN | disclosed |
| CN-115216148-A | Porous polyimide film | 日东电工株式会社 | 2022-10-21 | — | — | CN | disclosed |
| CN-115195104-A | Dual precursor resin system for additive manufacturing with dual cure resins | 卡本有限公司 | 2022-10-18 | — | — | CN | disclosed |
| CN-115141369-A | Resin film, laminate, coverlay film, resin-containing copper foil, metal-clad laminate, circuit board, and multilayer circuit board | 日铁化学材料株式会社 | 2022-10-04 | — | — | CN | disclosed |
| CN-115124937-A | Covering film | 杜邦-东丽株式会社 | 2022-09-30 | — | — | CN | disclosed |
| CN-108373543-B | Polyimide film | 住友化学株式会社 | 2022-09-20 | — | — | CN | disclosed |
| CN-112375400-B | Black pigment and method for producing same, pigment dispersion liquid, photosensitive composition, and cured product thereof | 东丽株式会社 | 2022-09-09 | — | — | CN | disclosed |
| WO-2022181754-A1 | COMPOSITE LAMINATE AND JOINED BODY | 昭和電工株式会社 | 2022-09-01 | — | — | WO | disclosed |
| CN-110678505-B | Method for producing prepreg, laminated board, printed wiring board, and semiconductor package | 昭和电工材料株式会社 | 2022-08-23 | — | — | CN | disclosed |
| US-11421071-B2 | Phosphorus-containing epoxy resin, epoxy resin composition, prepreg, laminated plate, material for circuit board and cured product | NIPPON STEEL CHEMICAL & MATERIALS CO., LTD. (JP) | 2022-08-23 | — | — | US | disclosed |
| WO-2022168323-A1 | VEHICLE ON-BOARD CAMERA AND MANUFACTURING METHOD THEREFOR | 昭和電工株式会社 | 2022-08-11 | — | — | WO | disclosed |
| WO-2022168329-A1 | BUMPER FASCIA AND PRODUCTION METHOD THEREFOR | 昭和電工株式会社 | 2022-08-11 | — | — | WO | disclosed |
| WO-2022168324-A1 | BUMPER FASCIA AND METHOD OF MANUFACTURING SAME | 昭和電工株式会社 | 2022-08-11 | — | — | WO | disclosed |
| WO-2022168325-A1 | BACK DOOR OUTER PANEL AND PRODUCTION METHOD THEREFOR | 昭和電工株式会社 | 2022-08-11 | — | — | WO | disclosed |
| WO-2022168326-A1 | RADAR DEVICE AND MANUFACTURING METHOD THEREFOR | 昭和電工株式会社 | 2022-08-11 | — | — | WO | disclosed |
| WO-2022168321-A1 | BACKDOOR OUTER PANEL AND MANUFACTURING METHOD THEREFOR | 昭和電工株式会社 | 2022-08-11 | — | — | WO | disclosed |
| CN-114839848-A | Unit and image forming apparatus | 富士胶片商业创新有限公司 | 2022-08-02 | — | — | CN | disclosed |
| CN-107709424-B | Systems and methods for producing aerogel materials | 气凝胶科技有限责任公司 | 2022-08-02 | — | — | CN | disclosed |
| CN-114806395-A | Polyimide precursor varnish and method for producing same, polyimide and method for producing same, flexible device, and laminate for wiring board | 日铁化学材料株式会社 | 2022-07-29 | — | — | CN | disclosed |
| CN-114787240-A | Planarization method and composition | 富士胶片电子材料美国有限公司 | 2022-07-22 | — | — | CN | disclosed |
| US-20220219403-A1 | PRIMER-EQUIPPED THERMOPLASTIC RESIN MEMBER, AND RESIN-RESIN CONJUGATE | SHOWA DENKO K.K. (JP) | 2022-07-14 | — | — | US | disclosed |
| CN-110673234-B | Optical film, flexible display device, and method for manufacturing optical film | 住友化学株式会社 | 2022-07-12 | — | — | CN | disclosed |
| CN-114730128-A | Photosensitive composition, negative photosensitive composition, pixel division layer, and organic EL display device | 东丽株式会社 | 2022-07-08 | — | — | CN | disclosed |
| CN-114728487-A | Shaped body | 住友电工超效能高分子股份有限公司 | 2022-07-08 | — | — | CN | disclosed |
| CN-114716707-A | Polyimide film, copper sheet laminated plate, and circuit board | 日铁化学材料株式会社 | 2022-07-08 | — | — | CN | disclosed |
| CN-108139665-B | Dual precursor resin system for additive manufacturing with dual cure resins | 卡本有限公司 | 2022-07-05 | — | — | CN | disclosed |
| US-11376786-B2 | Methods and apparatus for additive manufacturing | CARBON, INC. (US) | 2022-07-05 | — | — | US | disclosed |
| US-20220203609-A1 | DUAL PRECURSOR RESIN SYSTEMS FOR ADDITIVE MANUFACTURING WITH DUAL CURE RESINS | CARBON INC (US) | 2022-06-30 | — | — | US | disclosed |
| CN-114672048-A | Polyimide film, metal-clad laminate, method for producing metal-clad laminate, and circuit board | 日铁化学材料株式会社 | 2022-06-28 | — | — | CN | disclosed |
| CN-114643759-A | Laminate and display device provided with same | 住友化学株式会社 | 2022-06-21 | — | — | CN | disclosed |
| CN-114641443-A | Method for producing dried film roll | 住友化学株式会社 | 2022-06-17 | — | — | CN | disclosed |
| EP-4011617-A1 | PRIMER-EQUIPPED THERMOPLASTIC RESIN MEMBER, AND RESIN-RESIN CONJUGATE | Showa Denko K.K. (JP) | 2022-06-15 | — | — | EP | disclosed |
| EP-4011615-A1 | THERMOPLASTIC RESIN MATERIAL WITH PRIMER, AND RESIN-RESIN CONJUGATE | Showa Denko K.K. (JP) | 2022-06-15 | — | — | EP | disclosed |
| US-11360386-B2 | Organic EL display device | TORAY INDUSTRIES, INC. (JP) | 2022-06-14 | — | — | US | disclosed |
| CN-114605153-A | Preparation method of high-thermal-conductivity graphite film | 中汇睿能凤阳新材料科技有限公司 | 2022-06-10 | — | — | CN | disclosed |
| CN-110031920-B | Optical laminate | 住友化学株式会社 | 2022-06-07 | — | — | CN | disclosed |
| CN-110511566-B | Thermosetting resin composition, method for producing same, prepreg, laminate, and printed wiring board | 昭和电工材料株式会社 | 2022-06-03 | — | — | CN | disclosed |
| CN-114586087-A | Optical laminate and display device | 住友化学株式会社 | 2022-06-03 | — | — | CN | disclosed |
| CN-107722267-B | Polyimide precursor and polyimide produced from the polyimide precursor | 日铁化学材料株式会社 | 2022-05-31 | — | — | CN | disclosed |
| US-20220154009-A1 | THERMOPLASTIC RESIN MATERIAL WITH PRIMER, AND RESIN-RESIN CONJUGATE | SHOWA DENKO K.K. (JP) | 2022-05-19 | — | — | US | disclosed |
| CN-112824438-B | Synthetic method of polyimide | 湘潭大学 | 2022-05-17 | — | — | CN | disclosed |
| CN-110199210-B | Optical film and method for producing optical film | 住友化学株式会社 | 2022-05-17 | — | — | CN | disclosed |
| US-20220145019-A1 | DUAL CURE RESIN FOR THE PRODUCTION OF MOISTURE-RESISTANT ARTICLES BY ADDITIVE MANUFACTURING | CARBON INC (US) | 2022-05-12 | — | — | US | disclosed |
| US-20220143954-A1 | METAL-RESIN JOINED BODY AND PRODUCTION METHOD THEREFOR | SHOWA DENKO K.K. (JP) | 2022-05-12 | — | — | US | disclosed |
| CN-106008969-B | Polyimide film | 杜邦-东丽株式会社 | 2022-05-10 | — | — | CN | disclosed |
| CN-109790308-B | Optical film and method for producing same | 住友化学株式会社 | 2022-05-06 | — | — | CN | disclosed |
| CN-111417879-B | Optically anisotropic film | 住友化学株式会社 | 2022-05-03 | — | — | CN | disclosed |
| US-11312066-B2 | Method of making three-dimensional objects by additive manufacturing | CARBON, INC. (US) | 2022-04-26 | — | — | US | disclosed |
| CN-111499865-B | Synthesis method of phosphorus-containing polyimide | 湘潭大学 | 2022-04-26 | — | — | CN | disclosed |
| CN-114391186-A | Metal-clad laminate for flexible electronic component and flexible electronic component using same | 日铁化学材料株式会社 | 2022-04-22 | — | — | CN | disclosed |
| EP-3600842-B1 | METHOD OF MAKING THREE-DIMENSIONAL OBJECTS BY ADDITIVE MANUFACTURING | CARBON INC (US) | 2022-04-20 | — | — | EP | disclosed |
| CN-110234687-B | Polyimide film and laminate | 住友化学株式会社 | 2022-04-15 | — | — | CN | disclosed |
| CN-112041707-B | Optical film, optical laminate, and flexible image display device | 住友化学株式会社 | 2022-04-15 | — | — | CN | disclosed |
| CN-109417834-B | Film heating device | E.I.内穆尔杜邦公司 | 2022-04-12 | — | — | CN | disclosed |
| CN-114302908-A | Film, method for producing film, metal-clad laminate, and metal-clad conductor | ＡＧＣ株式会社 | 2022-04-08 | — | — | CN | disclosed |
| CN-110713815-B | Conductive adhesive, electromagnetic wave shielding film and shielding printed wiring substrate | 拓自达电线株式会社 | 2022-04-01 | — | — | CN | disclosed |
| CN-109311676-B | Processed graphite sheet and method for producing processed graphite sheet | 株式会社钟化 | 2022-03-25 | — | — | CN | disclosed |
| CN-110520276-B | Method of manufacturing a three-dimensional object by additive manufacturing | 卡本有限公司 | 2022-03-25 | — | — | CN | disclosed |
| CN-114206616-A | Method for producing laminate | 株式会社有泽制作所 | 2022-03-18 | — | — | CN | disclosed |
| CN-114206976-A | Sealing resin composition and electronic component | 住友电木株式会社 | 2022-03-18 | — | — | CN | disclosed |
| WO-2022044740-A1 | METHOD FOR JOINING METAL AND RESIN, AND JOINED BODY THEREOF | 昭和電工株式会社 | 2022-03-03 | — | — | WO | disclosed |
| CN-114008139-A | Resin composition, method for producing resin composition, and insulated wire | 住友电气工业株式会社 | 2022-02-01 | — | — | CN | disclosed |
| CN-113950516-A | Thermoplastic resin member with primer and resin-resin bonded body | 昭和电工株式会社 | 2022-01-18 | — | — | CN | disclosed |
| CN-113950504-A | Thermoplastic resin material with primer and resin-resin bonded body | 昭和电工株式会社 | 2022-01-18 | — | — | CN | disclosed |
| US-11208517-B2 | Dual cure stereolithography resins containing diels-alder adducts | CARBON, INC. (US) | 2021-12-28 | — | — | US | disclosed |
| EP-3912806-A1 | METAL-RESIN JOINED BODY AND PRODUCTION METHOD THEREFOR | Showa Denko K.K. (JP) | 2021-11-24 | — | — | EP | disclosed |
| CN-108884245-B | Polyimide film and method for producing same | 柯尼卡美能达株式会社 | 2021-10-29 | — | — | CN | disclosed |
| WO-2021215542-A2 | MATERIAL WITH PRIMER AND BONDED ARTICLE | SHOWA DENKO K.K. (JP) | 2021-10-28 | — | — | WO | disclosed |
| WO-2021215404-A1 | PRIMER-EQUIPPED MATERIAL AND JOINED BODY | 昭和電工株式会社 (JP) | 2021-10-28 | — | — | WO | disclosed |
| US-11156918-B2 | Photosensitive composition, cured film and organic el display device | TORAY INDUSTRIES, INC. (JP) | 2021-10-26 | — | — | US | disclosed |
| US-11148357-B2 | Method of making composite objects by additive manufacturing | CARBON, INC. (US) | 2021-10-19 | — | — | US | disclosed |
| CN-108884032-B | Method for preparing poly (carbonate-etherimide) compounds | PTT全球化学股份有限公司 | 2021-10-15 | — | — | CN | disclosed |
| CN-113461939-A | Polyimide, polyimide composition, adhesive film, and use thereof | 日铁化学材料株式会社 | 2021-10-01 | — | — | CN | disclosed |
| CN-113462300-A | Resin film, metal-clad laminate, and circuit board | 日铁化学材料株式会社 | 2021-10-01 | — | — | CN | disclosed |
| CN-113402708-A | Polyimide, crosslinked polyimide, adhesive film and use thereof | 日铁化学材料株式会社 | 2021-09-17 | — | — | CN | disclosed |
| US-20210253783-A1 | PHOSPHORUS-CONTAINING EPOXY RESIN, EPOXY RESIN COMPOSITION, PREPREG, LAMINATED PLATE, MATERIAL FOR CIRCUIT BOARD AND CURED PRODUCT | NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) | 2021-08-19 | — | — | US | disclosed |
| US-20210246298-A1 | DUAL CURE ADDITIVE MANUFACTURING RESINS FOR PRODUCTION OF FLAME RETARDANT OBJECTS | CARBON INC (US) | 2021-08-12 | — | — | US | disclosed |
| CN-109825185-B | High-temperature-resistant anticorrosive coating and preparation method thereof | 四川特聚新材料科技有限公司 | 2021-07-30 | — | — | CN | disclosed |
| EP-3849806-A1 | DUAL CURE ADDITIVE MANUFACTURING RESINS FOR PRODUCTION OF FLAME RETARDANT OBJECTS | CARBON, INC. (US) | 2021-07-21 | — | — | EP | disclosed |
| EP-3845578-A1 | PHOSPHOROUS-CONTAINING EPOXY RESIN, EPOXY RESIN COMPOSITION, PREPREG, LAMINATED PLATE, MATERIAL FOR CIRCUIT BOARD AND CURED PRODUCT | NIPPON STEEL Chemical & Material Co., Ltd. (JP) | 2021-07-07 | — | — | EP | disclosed |
| US-20210198419-A1 | EPOXY DUAL CURE RESINS FOR ADDITIVE MANUFACTURING | CARBON INC (US) | 2021-07-01 | — | — | US | disclosed |
| CN-113043690-A | Metal-clad laminate and circuit board | 日铁化学材料株式会社 | 2021-06-29 | — | — | CN | disclosed |
| CN-110066620-B | Insulating coating material with excellent wear resistance | 株式会社钟化 | 2021-06-15 | — | — | CN | disclosed |
| CN-112939915-A | Diamine monomer for photosensitive resin, polyimide precursor, photosensitive resin composition, and use thereof | 武汉柔显科技股份有限公司 | 2021-06-11 | — | — | CN | disclosed |
| WO-2021111860-A1 | PHOTOSENSITIVE COMPOSITION, NEGATIVE-TYPE PHOTOSENSITIVE COMPOSITION, PIXEL DIVISION LAYER, AND ORGANIC EL DISPLAY DEVICE | 東レ株式会社 | 2021-06-10 | — | — | WO | disclosed |
| CN-108047978-B | Insulating coating material and method for producing same, and insulated cable and method for producing same | 株式会社钟化 | 2021-06-08 | — | — | CN | disclosed |
| CN-112898738-A | Epoxy resin composition, prepreg, laminate, printed wiring board, and cured product using same | 日铁化学材料株式会社 | 2021-06-04 | — | — | CN | disclosed |
| CN-110853796-B | Insulating coating material with excellent wear resistance | 株式会社钟化 | 2021-05-28 | — | — | CN | disclosed |
| CN-112824438-A | Novel synthesis method of polyimide | 湘潭大学 | 2021-05-21 | — | — | CN | disclosed |
| CN-108699243-B | Polyamic acid, thermoplastic polyimide, resin film, laminate, and circuit board | 日铁化学材料株式会社 | 2021-05-18 | — | — | CN | disclosed |
| WO-2021084999-A1 | OPTICAL LAYERED BODY AND DISPLAY DEVICE | 住友化学株式会社 | 2021-05-06 | — | — | WO | disclosed |
| US-20210107211-A1 | LIP SUPPORTS USEFUL FOR MAKING OBJECTS BY ADDITIVE MANUFACTURING | CARBON INC (US) | 2021-04-15 | — | — | US | disclosed |
| CN-109293881-B | Phosphorus-containing epoxy resin, composition containing the epoxy resin as essential component, and cured product | 日铁化学材料株式会社 | 2021-04-13 | — | — | CN | disclosed |
| US-10975193-B2 | Epoxy dual cure resins for additive manufacturing | CARBON, INC. (US) | 2021-04-13 | — | — | US | disclosed |
| WO-2021065390-A1 | JOINED BODY AND PRIMER-EQUIPPED MATERIAL | 昭和電工株式会社 | 2021-04-08 | — | — | WO | disclosed |
| CN-112585189-A | Phosphorus-containing epoxy resin, epoxy resin composition, prepreg, laminate, material for circuit board, and cured product | 日铁化学材料株式会社 | 2021-03-30 | — | — | CN | disclosed |
| CN-112469560-A | Metal-clad laminate and circuit board | 日铁化学材料株式会社 | 2021-03-09 | — | — | CN | disclosed |
| CN-109219513-B | Method for manufacturing flexible metal-clad laminate | 株式会社有泽制作所 | 2021-03-09 | — | — | CN | disclosed |
| CN-108291011-B | Epoxy dual cure resin for additive manufacturing | 卡本有限公司 | 2021-03-02 | — | — | CN | disclosed |
| CN-112437724-A | Laminated body | 株式会社有泽制作所 | 2021-03-02 | — | — | CN | disclosed |
| CN-108753101-B | Epoxy powder coating and application thereof | 江门市新会区新日旭电子材料有限公司 | 2021-02-26 | — | — | CN | disclosed |
| CN-112375400-A | Black pigment and method for producing same, pigment dispersion liquid, photosensitive composition and cured product thereof | 东丽株式会社 | 2021-02-19 | — | — | CN | disclosed |
| CN-112368315-A | Method for producing rigid polyurethane foams and use thereof as heat-insulating material | 巴斯夫欧洲公司 | 2021-02-12 | — | — | CN | disclosed |
| CN-108314774-B | Phosphorus-containing epoxy resin, composition containing the epoxy resin as essential component, and cured product | 日铁化学材料株式会社 | 2021-02-12 | — | — | CN | disclosed |
| WO-2021024980-A1 | THERMOPLASTIC RESIN MATERIAL WITH PRIMER, AND RESIN-RESIN CONJUGATE | 昭和電工株式会社 | 2021-02-11 | — | — | WO | disclosed |
| WO-2021024978-A1 | PRIMER-EQUIPPED THERMOPLASTIC RESIN MEMBER, AND RESIN-RESIN CONJUGATE | 昭和電工株式会社 | 2021-02-11 | — | — | WO | disclosed |
| WO-2021024979-A1 | THERMOPLASTIC RESIN MATERIAL WITH PRIMER, AND RESIN-RESIN CONJUGATE | 昭和電工株式会社 | 2021-02-11 | — | — | WO | disclosed |
| EP-3347399-B1 | EPOXY DUAL CURE RESINS FOR ADDITIVE MANUFACTURING | CARBON INC (US) | 2020-12-09 | — | — | EP | disclosed |
| CN-108587400-B | Bi-component insulating paint for magnetic ring | 江门市新会区新日旭电子材料有限公司 | 2020-12-08 | — | — | CN | disclosed |
| US-20200376746-A1 | METHOD OF MAKING THREE-DIMENSIONAL OBJECTS BY ADDITIVE MANUFACTURING | CARBON INC (US) | 2020-12-03 | — | — | US | disclosed |
| CN-109642089-B | Black pigment and method for producing same, pigment dispersion liquid, photosensitive composition and cured product thereof | 东丽株式会社 | 2020-12-01 | — | — | CN | disclosed |
| CN-111978511-A | Epoxy resin, method for producing same, curable epoxy resin composition, cured product, prepreg, insulating sheet, and laminate | 日铁化学材料株式会社 | 2020-11-24 | — | — | CN | disclosed |
| WO-2020205212-A1 | DUAL CURE RESIN FOR THE PRODUCTION OF MOISTURE-RESISTANT ARTICLES BY ADDITIVE MANUFACTURING | CARBON, INC. (US) | 2020-10-08 | — | — | WO | disclosed |
| CN-111484600-A | Epoxy resin composition and cured product thereof, prepreg, insulating sheet, adhesive sheet, laminate, sealing material, and casting material | 日铁化学材料株式会社 | 2020-08-04 | — | — | CN | disclosed |
| US-10723884-B2 | Black pigment, method for producing same, pigment dispersion liquid, photosensitive composition and cured product of said photosensitive composition | TORAY INDUSTRIES, INC. (JP) | 2020-07-28 | — | — | US | disclosed |
| WO-2020149248-A1 | COMPOSITE LAMINATE, METHOD FOR PRODUCING SAME, AND METAL-RESIN JOINED BODY | 昭和電工株式会社 | 2020-07-23 | — | — | WO | disclosed |
| US-20200223992-A1 | EPOXY DUAL CURE RESINS FOR ADDITIVE MANUFACTURING | CARBON INC (US) | 2020-07-16 | — | — | US | disclosed |
| CN-106467653-B | Flame-retardant epoxy resin composition, prepreg, insulating sheet, adhesive sheet, laminate, sealing material, casting material, and cured product | 日铁化学材料株式会社 | 2020-05-05 | — | — | CN | disclosed |
| CN-105968321-B | Oxazolidone ring-containing epoxy resin, method for producing same, epoxy resin composition, cured product thereof, and application thereof | 日铁化学材料株式会社 | 2020-05-05 | — | — | CN | disclosed |
| CN-111051982-A | Organic EL display device and method for forming pixel division layer and planarization layer | 东丽株式会社 | 2020-04-21 | — | — | CN | disclosed |
| EP-2579275-B1 | INSULATED ELECTRIC WIRE | LS CABLE LTD (KR) | 2020-04-08 | — | — | EP | disclosed |
| CN-110962410-A | Metal-clad laminate and circuit board | 日铁化学材料株式会社 | 2020-04-07 | — | — | CN | disclosed |
| WO-2020055682-A1 | DUAL CURE ADDITIVE MANUFACTURING RESINS FOR PRODUCTION OF FLAME RETARDANT OBJECTS | CARBON, INC. (US) | 2020-03-19 | — | — | WO | disclosed |
| US-20200081344-A1 | ORGANIC EL DISPLAY DEVICE | TORAY INDUSTRIES, INC. (JP) | 2020-03-12 | — | — | US | disclosed |
| EP-3620459-A1 | PHOSPHORUS-CONTAINING PHENOLIC COMPOUND, PHOSPHORUS-CONTAINING EPOXY RESIN, CURABLE RESIN COMPOSITION THEREOF, OR EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF | NIPPON STEEL Chemical & Material Co., Ltd. (JP) | 2020-03-11 | — | — | EP | disclosed |
| WO-2020045150-A1 | PHOSPHOROUS-CONTAINING EPOXY RESIN, EPOXY RESIN COMPOSITION, PREPREG, LAMINATED PLATE, MATERIAL FOR CIRCUIT BOARD AND CURED PRODUCT | 日鉄ケミカル＆マテリアル株式会社 | 2020-03-05 | — | — | WO | disclosed |
| US-20200070407-A1 | TOUGH, HIGH TEMPERATURE POLYMERS PRODUCED BY STEREOLITHOGRAPHY | CARBON INC (US) | 2020-03-05 | — | — | US | disclosed |
| CN-110853796-A | Insulating coating material with excellent wear resistance | 株式会社钟化 | 2020-02-28 | — | — | CN | disclosed |
| EP-3600842-A1 | METHOD OF MAKING THREE-DIMENSIONAL OBJECTS BY ADDITIVE MANUFACTURING | Carbon, Inc. (US) | 2020-02-05 | — | — | EP | disclosed |
| US-20200033728-A1 | PHOTOSENSITIVE COMPOSITION, CURED FILM AND ORGANIC EL DISPLAY DEVICE | TORAY INDUSTRIES, INC. (JP) | 2020-01-30 | — | — | US | disclosed |
| CN-110713815-A | Conductive adhesive, electromagnetic wave shielding film and shielding printed wiring substrate | 拓自达电线株式会社 | 2020-01-21 | — | — | CN | disclosed |
| US-10479857-B2 | Storage-stable impregnating resins and electrical insulating tapes | SIEMENS AKTIENGESELLSCHAFT (DE) | 2019-11-19 | — | — | US | disclosed |
| US-20190345270-A1 | Dual Cure Stereolithography Resins Containing Thermoplastic Particles | CARBON INC (US) | 2019-11-14 | — | — | US | disclosed |
| US-20190322785-A1 | Dual Cure Stereolithography Resins Containing Diels-Alder Adducts | CARBON INC (US) | 2019-10-24 | — | — | US | disclosed |
| EP-1296540-B1 | DISPLAY | TORAY INDUSTRIES (JP) | 2019-10-16 | — | — | EP | disclosed |
| US-20190283316-A1 | DUAL PRECURSOR RESIN SYSTEMS FOR ADDITIVE MANUFACTURING WITH DUAL CURE RESINS | CARBON INC (US) | 2019-09-19 | — | — | US | disclosed |
| US-20190218396-A1 | BLACK PIGMENT, METHOD FOR PRODUCING SAME, PIGMENT DISPERSION LIQUID, PHOTOSENSITIVE COMPOSITION AND CURED PRODUCT OF SAID PHOTOSENSITIVE COMPOSITION | TORAY INDUSTRIES, INC. (JP) | 2019-07-18 | — | — | US | disclosed |
| US-10350823-B2 | Dual precursor resin systems for additive manufacturing with dual cure resins | CARBON, INC. (US) | 2019-07-16 | — | — | US | disclosed |
| EP-3505573-A1 | BLACK PIGMENT, METHOD FOR PRODUCING SAME, PIGMENT DISPERSION LIQUID, PHOTOSENSITIVE COMPOSITION AND CURED PRODUCT OF SAID PHOTOSENSITIVE COMPOSITION | Toray Industries, Inc. (JP) | 2019-07-03 | — | — | EP | disclosed |
| US-20180304541-A1 | 3D LATTICE SUPPORTS FOR ADDITIVE MANUFACTURING | CARBON INC (US) | 2018-10-25 | — | — | US | disclosed |
| US-20180304526-A1 | METHODS AND APPARATUS FOR ADDITIVE MANUFACTURING | CARBON INC (US) | 2018-10-25 | — | — | US | disclosed |
| US-20180264719-A1 | DUAL PRECURSOR RESIN SYSTEMS FOR ADDITIVE MANUFACTURING WITH DUAL CURE RESINS | CARBON INC (US) | 2018-09-20 | — | — | US | disclosed |
| WO-2018165090-A1 | TOUGH, HIGH TEMPERATURE POLYMERS PRODUCED BY STEREOLITHOGRAPHY | CARBON, INC. (US) | 2018-09-13 | — | — | WO | disclosed |
| EP-3368198-A1 | HIGHLY BRANCHED NON-CROSSLINKED AEROGEL, METHODS OF MAKING, AND USES THEREOF | Blueshift International Materials, Inc. (US) | 2018-09-05 | — | — | EP | disclosed |
| EP-3347399-A1 | EPOXY DUAL CURE RESINS FOR ADDITIVE MANUFACTURING | Carbon, Inc. (US) | 2018-07-18 | — | — | EP | disclosed |
| WO-2018129023-A1 | DUAL CURE STEREOLITHOGRAPHY RESINS CONTAINING DIELS-ALDER ADDUCTS | CARBON, INC. (US) | 2018-07-12 | — | — | WO | disclosed |
| WO-2018129020-A1 | DUAL CURE STEREOLITHOGRAPHY RESINS CONTAINING THERMOPLASTIC PARTICLES | CARBON, INC. (US) | 2018-07-12 | — | — | WO | disclosed |
| EP-3341792-A1 | DUAL PRECURSOR RESIN SYSTEMS FOR ADDITIVE MANUFACTURING WITH DUAL CURE RESINS | Carbon, Inc. (US) | 2018-07-04 | — | — | EP | disclosed |
| US-20180171066-A1 | STORAGE-STABLE IMPREGNATING RESINS AND ELECTRICAL INSULATING TAPES | SIEMENS AKTIENGESELLSCHAFT (DE) | 2018-06-21 | — | — | US | disclosed |
| US-20180051172-A1 | CONDUCTIVE AROMATIC POLYIMIDE POROUS FILM AND METHOD FOR PRODUCING SAME | UBE INDUSTRIES, LTD. (JP) | 2018-02-22 | — | — | US | disclosed |
| US-20180044851-A1 | SIZING AGENT FOR SYNTHETIC FIBER, REINFORCING FIBER BUNDLE, AND FIBER-REINFORCED COMPOSITE MATERIAL | NICCA CHEMICAL CO., LTD. (JP) | 2018-02-15 | — | — | US | disclosed |
| EP-3267519-A1 | CONDUCTIVE AROMATIC POLYIMIDE POROUS FILM AND METHOD FOR PRODUCING SAME | UBE INDUSTRIES, LTD. (JP) | 2018-01-10 | — | — | EP | disclosed |
| EP-3262110-A1 | STORAGE-STABLE IMPREGNATING RESINS AND ELECTRICAL INSULATING TAPES | Siemens Aktiengesellschaft (DE) | 2018-01-03 | — | — | EP | disclosed |
| WO-2017074751-A1 | HIGHLY BRANCHED NON-CROSSLINKED AEROGEL, METHODS OF MAKING, AND USES THEREOF | BLUESHIFT INTERNATIONAL MATERIALS, INC. (US) | 2017-05-04 | — | — | WO | disclosed |
| WO-2017044381-A1 | EPOXY DUAL CURE RESINS FOR ADDITIVE MANUFACTURING | CARBON3D, INC. (US) | 2017-03-16 | — | — | WO | disclosed |
| WO-2016180595-A1 | STORAGE-STABLE IMPREGNATING RESINS AND ELECTRICAL INSULATING TAPES | SIEMENS AKTIENGESELLSCHAFT (DE) | 2016-11-17 | — | — | WO | disclosed |
| EP-3091049-A1 | IMPREGNATING RESINS WHICH ARE STABLE WHEN STORED AND ELECTRO ISOLATION TAPES | Siemens Aktiengesellschaft (DE) | 2016-11-09 | — | — | EP | disclosed |
| CN-103589356-B | Multilayer polyimide film, plywood and metal-clad | KANEKA CORPORATION (JP) | 2016-01-20 | — | — | CN | disclosed |
| US-9123689-B2 | Epoxy resin composition, method for producing same, and semiconductor device using same | TORAY INDUSTRIES, INC. (JP) | 2015-09-01 | — | — | US | disclosed |
| US-8779036-B2 | Catalysis of epoxy resin formulations | EVONIK DEGUSSA GMBH (DE) | 2014-07-15 | — | — | US | disclosed |
| US-20140005318-A1 | EPOXY RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND SEMICONDUCTOR DEVICE USING SAME | TORAY INDUSTRIES, INC. (JP) | 2014-01-02 | — | — | US | disclosed |
| US-8394492-B1 | Surface modified aerogel monoliths | THE UNITED STATES OF AMERICA AS REPRESENTED BY THE UNITED STATES NATIONAL AERONAUTICS AND SPACE ADMINISTRATION (US) | 2013-03-12 | — | — | US | disclosed |
| EP-2456804-A1 | CATALYSIS OF EPOXY RESIN FORMULATIONS HAVING SPARINGLY SOLUBLE CATALYSTS | Evonik Degussa GmbH (DE) | 2012-05-30 | — | — | EP | disclosed |
| US-20120115988-A1 | CATALYSIS OF EPOXY RESIN FORMULATIONS HAVING SPARINGLY SOLUBLE CATALYSTS | EVONIK DEGUSSA GMBH (DE) | 2012-05-10 | — | — | US | disclosed |
| EP-2424916-A1 | CATALYSIS OF EPOXY RESIN FORMULATIONS | Evonik Degussa GmbH (DE) | 2012-03-07 | — | — | EP | disclosed |
| US-20120041101-A1 | CATALYSIS OF EPOXY RESIN FORMULATIONS | EVONIK DEGUSSA GMBH (DE) | 2012-02-16 | — | — | US | disclosed |
| US-8067478-B1 | Process for preparing polymer reinforced silica aerogels | THE UNITED STATES OF AMERICA AS REPRESENTED BY THE ADMINISTRATOR OF NATIONAL AERONAUTICS AND SPACE ADMINISTRATION (US) | 2011-11-29 | — | — | US | disclosed |
| WO-2011009648-A1 | CATALYSIS OF EPOXY RESIN FORMULATIONS HAVING SPARINGLY SOLUBLE CATALYSTS | EVONIK DEGUSSA GMBH (DE) | 2011-01-27 | — | — | WO | disclosed |
| WO-2010124901-A1 | CATALYSIS OF EPOXY RESIN FORMULATIONS | EVONIK DEGUSSA GMBH (DE) | 2010-11-04 | — | — | WO | disclosed |
| US-7459217-B2 | Flame retardant polyester film and processed product including the same | TORAY INDUSTRIES, INC. (JP) | 2008-12-02 | — | — | US | disclosed |
| US-20080146692-A1 | Unsaturated Group-Containing Polyimide Resin, Photosensitive Resin Composition Containing Same, And Cured Product Thereof | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2008-06-19 | — | — | US | disclosed |
| US-7339009-B2 | Cross-linked polyimide and method of making them | GENERAL ELECTRIC COMPANY (US) | 2008-03-04 | — | — | US | disclosed |
| EP-1142936-B1 | BIAXIALLY ORIENTED FILM AND MAGNETIC RECORDING MEDIUM | TORAY INDUSTRIES (JP) | 2008-01-02 | — | — | EP | disclosed |
| EP-1441001-B1 | Flame-retardant polyester film and processed product including the same | TORAY INDUSTRIES (JP) | 2007-11-28 | — | — | EP | disclosed |
| EP-1826230-A1 | UNSATURATED GROUP-CONTAINING POLYIMIDE RESIN, PHOTOSENSITIVE RESIN COMPOSITION CONTAINING SAME, AND CURED PRODUCT THEREOF | Nippon Kayaku Kabushiki Kaisha (JP) | 2007-08-29 | — | — | EP | disclosed |
| WO-2007076014-A2 | THERMAL MANAGEMENT CIRCUIT MATERIALS, METHOD OF MANUFACTURE THEREOF, AND ARTICLES FORMED THEREFROM | WORLD PROPERTIES, INC. (US) | 2007-07-05 | — | — | WO | disclosed |
| US-20060135732-A1 | Cross-linked polyimide and method of making them | GENERAL ELECTRIC COMPANY | 2006-06-22 | — | — | US | disclosed |
| US-7022396-B1 | Biaxially oriented film having specified micro protrusions | TORAY INDUSTRIES, INC. (JP) | 2006-04-04 | — | — | US | disclosed |
| EP-1215043-B1 | Polyester film and magnetic recording medium using the same | TORAY INDUSTRIES (JP) | 2006-03-22 | — | — | EP | disclosed |
| US-6900269-B2 | Halogen-free resin composition | CHANG CHUN PLASTICS CO., LTD. (TW) | 2005-05-31 | — | — | US | disclosed |
| US-6887643-B2 | Photosensitive resin precursor composition | TORAY INDUSTRIES, INC. (JP) | 2005-05-03 | — | — | US | disclosed |
| EP-0878740-B1 | Radiation sensitive polymer composition | TORAY INDUSTRIES (JP) | 2004-11-10 | — | — | EP | disclosed |
| EP-1011107-B1 | Insulated wire | SUMITOMO ELECTRIC WINTEC INC (JP) | 2004-09-22 | — | — | EP | disclosed |
| US-6783889-B2 | FOR USE IN DIGITAL RECORDING TYPE CASSETTE TAPE; QUALITY; FOR HIGH-DENSITY RECORDING, DIMENSIONAL STABILITY | TORAY INDUSTRIES, INC. (JP) | 2004-08-31 | — | — | US | disclosed |
| US-20040161620-A1 | Flame retardant polyester film and processed product including the same | TORAY INDUSTRIES, INC. (JP) | 2004-08-19 | — | — | US | disclosed |
| US-20040147640-A1 | Halogen-free resin composition | CHANG CHUN PLASTICS CO., LTD. (TW) | 2004-07-29 | — | — | US | disclosed |
| EP-1441001-A2 | Flame-retardant polyester film and processed product including the same | TORAY INDUSTRIES, INC. (JP) | 2004-07-28 | — | — | EP | disclosed |
| US-20040053156-A1 | Photosensitive resin precursor composition | TORAY INDUSTRIES, INC. (JP) | 2004-03-18 | — | — | US | disclosed |
| US-6696112-B2 | POSITIVE-TYPE, PHOTOSENSITIVITY; FLAT PANEL DISPLAYS | TORAY INDUSTRIES, INC. (JP) | 2004-02-24 | — | — | US | disclosed |
| EP-1388758-A1 | Photosensitive heat resistant resin precursor composition | TORAY INDUSTRIES, INC. (JP) | 2004-02-11 | — | — | EP | disclosed |
| EP-0915383-B1 | Photosensitive resin composition | HITACHI CHEMICAL CO LTD (JP) | 2004-01-21 | — | — | EP | disclosed |
| EP-1296540-A1 | DISPLAY | TORAY INDUSTRIES, INC. (JP) | 2003-03-26 | — | — | EP | disclosed |
| US-20020162998-A1 | Display | TORAY INDUSTRIES, INC. (JP) | 2002-11-07 | — | — | US | disclosed |
| US-20020114977-A1 | Polyester film and magnetic recording medium using the same | TORAY INDUSTRIES, INC. (JP) | 2002-08-22 | — | — | US | disclosed |
| EP-1215043-A1 | Polyester film and magnetic recording medium using the same | TORAY INDUSTRIES, INC. (JP) | 2002-06-19 | — | — | EP | disclosed |
| US-6403063-B1 | APPLYING POLYUREA; CURING | SAWYER KENNETH I (US) | 2002-06-11 | — | — | US | disclosed |
| US-6401724-B1 | POLYUREA-FORMING COMPOSITION SUCH AS 1)AN AMINOBENZOIC ACID ESTER OR AMIDE OF A POSSIBLY OLIGOMERIC POLYOL OR POLYAMINE OR AN AROMATIC DIAMINE AND 2)A POLYISOCYANATE | PAR PHARMACEUTICALS INCORPORATED | 2002-06-11 | — | — | US | disclosed |
| EP-1142936-A1 | BIAXIALLY ORIENTED FILM AND MAGNETIC RECORDING MEDIUM | TORAY INDUSTRIES, INC. (JP) | 2001-10-10 | — | — | EP | disclosed |
| US-6288342-B1 | Insulated wire | SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) | 2001-09-11 | — | — | US | disclosed |
| US-6238840-B1 | CURABLE SOLDER RESIST COMPRISING A PHOTOSENSITIVE RESIN HAVING ONE OR MORE CARBOXYL GROUPS, A PHENOLIC DIGLYCIDYL ETHER EPOXY CURING AGENT, AND A PHOTOINITIATOR; ADHESION, HEAT RESISTANCE, RESOLUTION | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2001-05-29 | — | — | US | disclosed |
| WO-2000069943-A1 | POLYUREA COMPOSITION | K & L TECHNOLOGIES, INC. (US) | 2000-11-23 | — | — | WO | disclosed |
| US-6090525-A | PHOTOSENSITIVE POLYIMIDE COATING AGENT COMPOSITION WITH BOTH GOOD VISCOSITY STABILITY AT ROOM TEMPERATURE WITH LAPSE OF TIME AND GOOD PHOTOSENSITIVE PERFORMANCE | TORAY INDUSTRIES, INC. (JP) | 2000-07-18 | — | — | US | disclosed |
| EP-1011107-A1 | Insulated wire | Sumitomo Electric Industries, Ltd. (JP) | 2000-06-21 | — | — | EP | disclosed |
| US-6027794-A | Prepregs, processes for their production, and composite laminates | TORAY INDUSTRIES, INC. (JP) | 2000-02-22 | — | — | US | disclosed |
| EP-0632087-B1 | PREPREG, METHOD OF MANUFACTURING THE SAME, AND LAMINATED COMPOSITE | TORAY INDUSTRIES (JP) | 1999-08-18 | — | — | EP | disclosed |
| EP-0915383-A2 | Photosensitive resin composition | HITACHI CHEMICAL CO., LTD. (JP) | 1999-05-12 | — | — | EP | disclosed |
| EP-0878740-A1 | Radiation sensitive polymer composition | TORAY INDUSTRIES, INC. (JP) | 1998-11-18 | — | — | EP | disclosed |
| EP-0621299-B1 | Solutions of polyimide-forming substances and their use as coating material | BASF LACKE & FARBEN (DE) | 1997-07-09 | — | — | EP | disclosed |
| US-5608013-A | Polyimides and thermosetting resin compositions containing the same | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1997-03-04 | — | — | US | disclosed |
| EP-0596150-B1 | Solutions of polyimide precursors | BASF LACKE & FARBEN (DE) | 1997-02-05 | — | — | EP | disclosed |
| EP-0538850-B1 | New polyurea resins and their preparation and use | IHARA CHEMICAL IND CO (JP) | 1997-01-22 | — | — | EP | disclosed |
| EP-0596149-B1 | Solutions of polyimide precursors | BASF LACKE & FARBEN (DE) | 1996-10-16 | — | — | EP | disclosed |
| EP-0553612-B1 | Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides | HITACHI CHEMICAL CO LTD (JP) | 1996-08-21 | — | — | EP | disclosed |
| US-5510425-A | AROMATIC POLYIMIDE-EPOXY COPOLYMER MODIFIED BY BISMALEIMIDE COMPOUND; FLEXIBILITY, PEELING STRENGTH; COLDSETTING RESINS, ADHESIVES | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1996-04-23 | — | — | US | disclosed |
| US-5508357-A | SOLUBILITY IN SOLVENT, LOW MELTING POINT | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1996-04-16 | — | — | US | disclosed |
| US-5489644-A | COMPRISING AROMATIC DIAMINES AND TETRAESTER OF AROMATIC TETRACARBOXYLIC ACID; PROTECTIVE COATING FOR METALS, SILICON WAFERS, GLASS | BASF LACKE + FARBEN (DE) | 1996-02-06 | — | — | US | disclosed |
| EP-0456515-B1 | Polyimides and thermosetting resin compositions containing the same | HITACHI CHEMICAL CO LTD (JP) | 1995-11-08 | — | — | EP | disclosed |
| EP-0361377-B1 | Pervaporation method of separating liquid organic compound mixture through aromatic imide polymer asymmetric membrane | UBE INDUSTRIES (JP) | 1995-06-28 | — | — | EP | disclosed |
| US-5393612-A | Conductor and insulating coating having tensile strength of at least 13 kg/mm2 | SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) | 1995-02-28 | — | — | US | disclosed |
| EP-0632087-A1 | PREPREG, METHOD OF MANUFACTURING THE SAME, AND LAMINATED COMPOSITE | TORAY INDUSTRIES, INC. (JP) | 1995-01-04 | — | — | EP | disclosed |
| EP-0621299-A1 | Solutions of polyimide-forming substances and their use as coating material | BASF Lacke + Farben AG (DE) | 1994-10-26 | — | — | EP | disclosed |
| US-5332799-A | Aromatic diamines, diesters of aromatic tetracarboxylic acids, circuit coatings | BASF LACKE+FARBEN AKTIENGESELLSCHAFT (DE) | 1994-07-26 | — | — | US | disclosed |
| EP-0604038-A2 | Plasticized polyetherimide adhesive compositions | GENERAL ELECTRIC COMPANY (US) | 1994-06-29 | — | — | EP | disclosed |
| US-5319058-A | Improved heat resistance when polyisocyanate component is a combination of an aliphatic diisocyanate and a cyclic trimer of an aliphatic polyisocyanate | IHARA CHEMICAL INDUSTRY CO., LTD. (JP) | 1994-06-07 | — | — | US | disclosed |
| EP-0481316-B1 | Process for the preparation of 2,2,-bis(aminophenyl)-propane | BAYER AG (DE) | 1994-06-01 | — | — | EP | disclosed |
| EP-0596150-A1 | Solutions of polyimide precursors | BASF Lacke + Farben Aktiengesellschaft (DE) | 1994-05-11 | — | — | EP | disclosed |
| EP-0596149-A1 | Solutions of polyimide precursors | BASF Lacke + Farben Aktiengesellschaft (DE) | 1994-05-11 | — | — | EP | disclosed |
| EP-0362649-B1 | Radiation-sensitive compositions and their use | BASF AG (DE) | 1994-03-02 | — | — | EP | disclosed |
| US-5284734-A | Insulating layers and printed circuits; precursors for polyimides and polyquinazolines | BASF AKTIENGESELLSCHAFT (DE) | 1994-02-08 | — | — | US | disclosed |
| US-5264545-A | Aromatic or partly aromatic diamine with tetracarboxylic acid | BASF LACKE+FARBEN AKTIENGESELLSCHAFT (DE) | 1993-11-23 | — | — | US | disclosed |
| EP-0553612-A2 | Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides | HITACHI CHEMICAL CO., LTD. (JP) | 1993-08-04 | — | — | EP | disclosed |
| EP-0538850-A2 | New polyurea resins and their preparation and use | IHARA CHEMICAL INDUSTRY Co., Ltd. (JP) | 1993-04-28 | — | — | EP | disclosed |
| US-5185467-A | PROCESS FOR THE PREPARATION OF 2,2-BIS-(AMINOPHENYL)-PROPANE | BAYER AKTIENGESELLSCHAFT (DE) | 1993-02-09 | — | — | US | disclosed |
| EP-0481316-A1 | Process for the preparation of 2,2,-bis(aminophenyl)-propane | BAYER AG (DE) | 1992-04-22 | — | — | EP | disclosed |
| US-5089593-A | For casting dielectric films having heat resistance, low moisture absorption, low glass transition temperatures | AMOCO CORPORATION (US) | 1992-02-18 | — | — | US | disclosed |
| EP-0456515-A1 | Polyimides and thermosetting resin compositions containing the same | Hitachi Chemical Co., Ltd. (JP) | 1991-11-13 | — | — | EP | disclosed |
| US-5053314-A | Improved solubility, excellent dimensional stability | NITTO DENKO CORPORATION (JP) | 1991-10-01 | — | — | US | disclosed |
| US-4997462-A | Pervaporation method of selectively separating water from an organic material aqueous solution through aromatic imide polymer asymmetric membrane | UBE INDUSTRIES, LTD. (JP) | 1991-03-05 | — | — | US | disclosed |
| EP-0408540-A1 | Mixed polyimides and process for preparing them | Lenzing Aktiengesellschaft (AT) | 1991-01-16 | — | — | EP | disclosed |
| EP-0248932-B1 | PROCESS FOR PREPARING POLYAMIDES | Asahi Kasei Kogyo Kabushiki Kaisha (JP) | 1991-01-09 | — | — | EP | disclosed |
| EP-0391699-A1 | Pervaporation method of selectively separating water from an organic material aqueous solution through aromatic imide polymer asymmetric membrane | UBE INDUSTRIES, LTD. (JP) | 1990-10-10 | — | — | EP | disclosed |
| US-4959151-A | Pervaporation method of separating liquid organic compound mixture through aromatic imide polymer asymmetric membrane | UBE INDUSTRIES (JP) | 1990-09-25 | — | — | US | disclosed |
| EP-0378156-A2 | Positively photosensitive polyimide composition | NITTO DENKO CORPORATION (JP) | 1990-07-18 | — | — | EP | disclosed |
| EP-0378457-A2 | Aromatic allyl amine thermosetting resin composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1990-07-18 | — | — | EP | disclosed |
| EP-0361377-A2 | Pervaporation method of separating liquid organic compound mixture through aromatic imide polymer asymmetric membrane | UBE INDUSTRIES, LTD. (JP) | 1990-04-04 | — | — | EP | disclosed |
| EP-0358395-A2 | Aromatic imide polymer fiber-reinforced prepreg and cured resinous laminate material derived from same | UBE INDUSTRIES, LTD. (JP) | 1990-03-14 | — | — | EP | disclosed |
| EP-0350958-A2 | Improved polyimide and polyimide film and manufacturing method thereof | KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) | 1990-01-17 | — | — | EP | disclosed |
| EP-0345810-A1 | Intra-ocular lens | Menicon Co., Ltd. (JP) | 1989-12-13 | — | — | EP | disclosed |
| EP-0337343-A1 | Process and apparatus for manufacturing polymers | KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) | 1989-10-18 | — | — | EP | disclosed |
| EP-0337386-A1 | Process for continuous mixing of a two-liquid curing type resin | KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) | 1989-10-18 | — | — | EP | disclosed |
| EP-0325718-A2 | Ternary polymer blends containing a polyetherimide, a polyphthalate carbonate, and rubber modified vinyl aromatic polymer | GENERAL ELECTRIC COMPANY (US) | 1989-08-02 | — | — | EP | disclosed |
| EP-0323644-A1 | Polyimide resin and insulating film for electric and electronic devices | NISSAN CHEMICAL INDUSTRIES LTD. (JP) | 1989-07-12 | — | — | EP | disclosed |
| EP-0292166-A2 | Metal articles having corrosion resistant epoxy coatings | FORD MOTOR COMPANY LIMITED (GB) | 1988-11-23 | — | — | EP | disclosed |
| EP-0248932-A1 | Process for preparing polyamides | Asahi Kasei Kogyo Kabushiki Kaisha (JP) | 1987-12-16 | — | — | EP | disclosed |
| EP-0097937-B1 | CROSS-LINKED POLYESTERAMIDES AND PRODUCTION THEREOF | Takeda Chemical Industries, Ltd. (JP) | 1985-11-13 | — | — | EP | disclosed |
| EP-0160558-A2 | Polyimide composition for fixing metallic sheets | NITTO DENKO CORPORATION (JP) | 1985-11-06 | — | — | EP | disclosed |
| EP-0147799-A2 | Polyalkylenelactone modified polyetherimides | GENERAL ELECTRIC COMPANY (US) | 1985-07-10 | — | — | EP | disclosed |
| EP-0134252-A1 | Polyetherimide-polysulfide blends | GENERAL ELECTRIC COMPANY (US) | 1985-03-20 | — | — | EP | disclosed |
| EP-0132853-A1 | Preimpregnated reinforcements and high strength composites therefrom | AMOCO CORPORATION (US) | 1985-02-13 | — | — | EP | disclosed |
| EP-0054925-B1 | CATHODIC, WATER-BORNE ELECTROPHORETIC COATING COMPOSITION, ITS USE AND METHOD OF COATING ELECTRICAL CONDUCTORS | Herberts Gesellschaft mit beschränkter Haftung (DE) | 1984-05-16 | — | — | EP | disclosed |
| EP-0091118-A1 | Polyetherimide-polyphenylene ether blends | GENERAL ELECTRIC COMPANY (US) | 1983-10-12 | — | — | EP | disclosed |
| US-4384946-A | CATIONIC RESIN BINDER, WATER INSOLUBLE COATING RESIN | HERBERTS G.M.B.H. (DE) | 1983-05-24 | — | — | US | disclosed |
| EP-0054925-A1 | Cathodic, water-borne electrophoretic coating composition, its use and method of coating electrical conductors | Herberts Gesellschaft mit beschränkter Haftung (DE) | 1982-06-30 | — | — | EP | disclosed |
| US-4121266-A | Polyamide-imide precondensates | BASF AKTIENGESELLSCHAFT (DE) | 1978-10-17 | — | — | US | disclosed |
| US-4042620-A | Continuous process for the production of maeamic acids | RHONE-POULENC, S.A. (FR) | 1977-08-16 | — | — | US | disclosed |
| US-4033923-A | DYEING, SUBLIMATION FASTNESS | MITSUI TOATSU CHEMICALS, INCORPORATED (JA) | 1977-07-05 | — | — | US | disclosed |
| US-4001192-A | Transparent polyamides from bis(aminomethyl)-norbornanes | HOECHST AKTIENGESELLSCHAFT (DT) | 1977-01-04 | — | — | US | disclosed |
| US-3960887-A | Continuous process for the preparation of maleimides | RHONE-POULENC S.A. (FR) | 1976-06-01 | — | — | US | disclosed |
| US-3947493-A | Process for the production of maleamic acids | RHONE-POULENC, S.A. (FR) | 1976-03-30 | — | — | US | disclosed |
| US-3947493-A | Process for the production of maleamic acids | RHONE-POULENC, S.A. (FR) | 1976-03-30 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12590208-B2 | Thermoplastic resin foam, thermoplastic resin foam sheet, fiber-reinforced resin composite, method for manufacturing thermoplastic resin foam, thermoplastic resin foam molded article, method for manufacturing thermoplastic resin foam molded article, and foamed resin composite | TAF9, TAF1, TAF11 | KCNN4 3958/4885CYP1A2 3763/4885CYP2D6 4352/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.