Morpholine

Morpholine

SCHEMBL11515192

C1COCCN1.OB(O)Oc1cccc2ccc3cc4ccccc4cc3c12

nearest known ligand 0.32

Full drug profile on Sugi Atlas →

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
APEX1 P27695 1/20 0.32
ERBB2 P04626 1/20 0.31
CYP1A2 P05177 1/20 0.31
FYN P06241 1/20 0.31
MAOA P21397 1/20 0.31
ACHE P22303 1/20 0.31
AHR P35869 1/20 0.31
SLC6A4 P31645 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19259375 0.85 CYP1A2 (0.41) ERBB2CYP1A2FYNMAOAACHE
SCHEMBL445634 0.84 CYP1A2 (0.40) ERBB2CYP1A2FYNMAOAACHE
Ammonia Solution, Strong SCHEMBL1035827 0.84 CYP1A2 (0.40) ERBB2CYP1A2FYNMAOAACHE
Phosphine SCHEMBL3288817 0.84 CYP1A2 (0.40) ERBB2CYP1A2FYNMAOAACHE
SCHEMBL19252585 0.84 CYP1A2 (0.40) ERBB2CYP1A2FYNMAOAACHE
SCHEMBL1314570 0.84 CYP1A2 (0.40) ERBB2CYP1A2FYNMAOAACHE
Hydrogen Sulfide SCHEMBL17372873 0.84 CYP1A2 (0.40) ERBB2CYP1A2FYNMAOAACHE
SCHEMBL911163 0.84 CYP1A2 (0.40) ERBB2CYP1A2FYNMAOAACHE
SCHEMBL73568 0.84 CYP1A2 (0.40) ERBB2CYP1A2FYNMAOAACHE
Iodide SCHEMBL3454480 0.84 CYP1A2 (0.40) ERBB2CYP1A2FYNMAOAACHE

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107022062-A Epoxy resin, reactive epoxy carboxylic acids' ester compounds, reactive polycarboxylic compounds, resin combination, hardening thing, article 日本化药株式会社 2017-08-08 CN disclosed
CN-101370870-B Epoxy resin molding material for sealing and electronic component device HITACHI CHEMICAL CO LTD 2012-07-18 CN disclosed
CN-101370870-A Epoxy resin molding material for sealing and electronic component device HITACHI CHEMICAL CO LTD (JP) 2009-02-18 CN disclosed
US-4138372-A TETRAPHENYL BORATE-AMINE COMPLEX LATENT CATALYST; DIISOCIATION OF URETDIONE TO ISOCYANATE, POLYMERIZATION TO POLYISOCYANURATE AND POL HITACHI, LTD. (JP) 1979-02-06 US disclosed