SCHEMBL11519009

SCHEMBL11519009

[Mn].[Ni].[Si]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11519012 1.00
SCHEMBL27933558 0.87
SCHEMBL38661047 0.87
SCHEMBL28121160 0.87
SCHEMBL2475094 0.87
SCHEMBL2475090 0.87
SCHEMBL28834721 0.87
SCHEMBL15106336 0.87
SCHEMBL9799026 0.87
SCHEMBL9751319 0.87

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-120133797-A Self-lubricating filiform nickel-based brazing filler metal and preparation method and application thereof 内蒙古旭阳新材料股份有限公司 2025-06-13 CN disclosed
EP-4065301-A4 LOW MELTING NICKEL-MANGANESE-SILICON BASED BRAZE FILLER METALS FOR HEAT EXCHANGER APPLICATIONS Oerlikon Metco (US) Inc. (US) 2023-12-13 EP disclosed
WO-2023224218-A1 COPPER-NICKEL-SILICON-MANGANESE-TIN-BASED COPPER ALLOY MATERIAL HAVING EXCELLENT STRENGTH, ELECTRICAL CONDUCTIVITY, AND BENDING WORKABILITY, AND METHOD FOR MANUFACTURING SAME 주식회사 풍산 2023-11-23 WO disclosed
US-20220371116-A1 LOW MELTING NICKEL-MANGANESE-SILICON BASED BRAZE FILLER METALS FOR HEAT EXCHANGER APPLICATIONS OERLIKON METCO (US) INC. (US) 2022-11-24 US disclosed
US-20220371116-A1 LOW MELTING NICKEL-MANGANESE-SILICON BASED BRAZE FILLER METALS FOR HEAT EXCHANGER APPLICATIONS OERLIKON METCO (US) INC. (US) 2022-11-24 US disclosed
EP-4065301-A1 LOW MELTING NICKEL-MANGANESE-SILICON BASED BRAZE FILLER METALS FOR HEAT EXCHANGER APPLICATIONS Oerlikon Metco (US) Inc. (US) 2022-10-05 EP disclosed
CN-114641363-A Low melting point nickel-manganese-silicon based brazing filler metals for heat exchanger applications 欧瑞康美科(美国)公司 2022-06-17 CN disclosed
CN-114641363-A Low melting point nickel-manganese-silicon based brazing filler metals for heat exchanger applications 欧瑞康美科(美国)公司 2022-06-17 CN disclosed
WO-2021108578-A1 LOW MELTING NICKEL-MANGANESE-SILICON BASED BRAZE FILLER METALS FOR HEAT EXCHANGER APPLICATIONS OERLIKON METCO (US) INC. (US) 2021-06-03 WO disclosed
WO-2014073629-A1 COPPER ALLOY 大豊工業株式会社 (JP) 2014-05-15 WO disclosed
CN-103275526-A Nickel-manganese-silicon containing anticorrosion paint with chromium-free zinc aluminium coating ZHANG JUN 2013-09-04 CN disclosed
US-4135656-A MANGANESE, SILICON, COPPER, BORON AND RARE EARTH ALLOY METALS, INC. (US) 1979-01-23 US disclosed
US-4075009-A MANGANESE-SILICON-COPPER-BORON-RARE EARTH METAL ALLOY METALS, INC. (US) 1978-02-21 US disclosed