⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6635693 | 0.72 | — | — | |
| SCHEMBL5704808 | 0.72 | — | — | |
| SCHEMBL6636128 | 0.71 | — | — | |
| SCHEMBL143587 | 0.67 | — | — | |
| SCHEMBL43218 | 0.67 | — | — | |
| SCHEMBL2232731 | 0.62 | — | — | |
| SCHEMBL3931 | 0.61 | — | — | |
| SCHEMBL4136354 | 0.61 | — | — | |
| Butadiene SCHEMBL2933701 | 0.55 | — | — | |
| Butadiene SCHEMBL28451 | 0.55 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3896114-B1 | POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHINETSU CHEMICAL CO (JP) | 2023-10-18 | — | — | EP | disclosed |
| US-11572442-B2 | Compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic component | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2023-02-07 | — | — | US | disclosed |
| CN-113527101-A | Novel compound, polymer and method for producing same, photosensitive resin composition, method for forming pattern, cured film, and electronic component | 信越化学工业株式会社 | 2021-10-22 | — | — | CN | disclosed |
| EP-3896114-A1 | NOVEL COMPOUND, POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2021-10-20 | — | — | EP | disclosed |
| US-20210317270-A1 | NOVEL COMPOUND, POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-10-14 | — | — | US | disclosed |
| EP-3352281-B1 | NON-AQUEOUS ELECTROLYTE SOLUTION AND NON-AQUEOUS ELECTROLYTE SECONDARY BATTERY | ADEKA CORP (JP) | 2021-08-11 | — | — | EP | disclosed |
| US-10734684-B2 | Nonaqueous electrolyte solution and nonaqueous electrolyte secondary battery | ADEKA CORPORATION (JP) | 2020-08-04 | — | — | US | disclosed |
| US-10328683-B2 | Adhesive agent, adhesive material using the same, and method of use thereof | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2019-06-25 | — | — | US | disclosed |
| US-10322572-B2 | Adhesive agent, adhesive material using the same, and method of use thereof | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2019-06-18 | — | — | US | disclosed |
| US-20180226683-A1 | NONAQUEOUS ELECTROLYTE SOLUTION AND NONAQUEOUS ELECTROPLYTE SECONDARY BATTERY | ADKEA CORPORATION (JP) | 2018-08-09 | — | — | US | disclosed |
| US-8436173-B2 | Boron compounds, their production processes, and functional electronic devices using same | KYOTO UNIVERSITY (JP) | 2013-05-07 | — | — | US | disclosed |
| US-20130020021-A1 | ADHESIVE AGENT, ADHESIVE MATERIAL USING THE SAME, AND METHOD OF USE THEREOF | HITACHI CHEMICAL COMPANY, LTD. | 2013-01-24 | — | — | US | disclosed |
| US-20130008592-A1 | ADHESIVE AGENT, ADHESIVE MATERIAL USING THE SAME, AND METHOD OF USE THEREOF | HITACHI CHEMICAL COMPANY, LTD. | 2013-01-10 | — | — | US | disclosed |
| US-20130008593-A1 | ADHESIVE AGENT, ADHESIVE MATERIAL USING THE SAME, AND METHOD OF USE THEREOF | HITACHI CHEMICAL COMPANY, LTD. | 2013-01-10 | — | — | US | disclosed |
| US-20110046372-A1 | NOVEL BORON COMPOUNDS, THEIR PRODUCTION PROCESSES, AND FUNCTIONAL ELECTRONIC DEVICES USING SAME | Kyoto University and Nippon Shokubai Co., LTD. | 2011-02-24 | — | — | US | disclosed |
| EP-2233490-A1 | NOVEL BORON COMPOUND, METHOD FOR PRODUCING THE SAME, AND FUNCTIONAL ELECTRONIC DEVICE USING THE SAME | Kyoto University (JP) | 2010-09-29 | — | — | EP | disclosed |
| US-7141351-B2 | Basic compound, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-11-28 | — | — | US | disclosed |
| US-20040234884-A1 | Basic compound, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-11-25 | — | — | US | disclosed |
| US-6335143-B1 | Resist composition containing specific cross-linking agent | WAKO PURE CHEMICAL INDUSTRIES LTD. (JP) | 2002-01-01 | — | — | US | disclosed |
| EP-0887706-A1 | Resist composition containing specific cross-linking agent | WAKO PURE CHEMICAL INDUSTRIES, LTD (JP) | 1998-12-30 | — | — | EP | disclosed |