SCHEMBL1190952

SCHEMBL1190952

[CH2]C(C)OCC(C)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7102261 0.90 TDP1 (0.52)
SCHEMBL13727002 0.90 TDP1 (0.52)
SCHEMBL6437728 0.76
SCHEMBL6435835 0.76
SCHEMBL19467 0.75
SCHEMBL9910554 0.75 TDP1 (0.46)
SCHEMBL1416856 0.75
SCHEMBL2703 0.75
SCHEMBL8149144 0.75 TDP1 (0.46)
SCHEMBL1416868 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 78 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107072954-B Pharmaceutical composition for oral administration comprising lobemidone 株式会社 钟根堂 2023-05-26 CN disclosed
EP-1719794-B1 NOVEL POLYMERS AND USES THEREOF MITSUI CHEMICALS INC (JP) 2017-01-04 EP disclosed
WO-2016072748-A1 PHARMACEUTICAL COMPOSITIONS COMPRISING LOBEGLITAZONE FOR ORAL ADMINISTRATION CHONG KUN DANG PHARMACEUTICAL CORP. (KR) 2016-05-12 WO disclosed
US-8584352-B2 Process for producing multilayer printed wiring board AJINOMOTO CO., INC. (JP) 2013-11-19 US disclosed
US-8382996-B2 Metal-clad laminate AJINOMOTO CO., INC. (JP) 2013-02-26 US disclosed
US-8357443-B2 Laminate including water soluble release layer for producing circuit board and method of producing circuit board AJINOMOTO CO., INC. (JP) 2013-01-22 US disclosed
US-7977429-B2 Polymers and uses thereof MITSUI CHEMICALS, INC. (JP) 2011-07-12 US disclosed
US-20110036625-A1 PROCESS FOR PRODUCING MULTILAYER PRINTED WIRING BOARD AJINOMOTO CO., INC. (JP) 2011-02-17 US disclosed
US-20100230382-A1 METAL-CLAD LAMINATE AJINOMOTO CO. INC. (JP) 2010-09-16 US disclosed
US-20100044078-A1 PROCESS FOR PRODUCING CIRCUIT BOARD AJINOMOTO CO., INC. (JP) 2010-02-25 US disclosed
EP-0768423-A2 Process for dyeing, printing, coating condensations products of melamin-formaldehyde, with pigments BASF Aktiengesellschaft (DE) 1997-04-16 EP disclosed
WO-1997007149-A1 MODIFIED MELAMINE FORMALDEHYDE RESINS BASF AKTIENGESELLSCHAFT (DE) 1997-02-27 WO disclosed
WO-1996020229-A1 PROCESS FOR PREPARING DYED MELAMINE-FORMALDEHYDE CONDENSATION PRODUCTS BASF AKTIENGESELLSCHAFT (DE) 1996-07-04 WO disclosed
US-5530031-A Water-insoluble melamine-formaldehyde resins BASF AKTIENGESELLSCHAFT (DE) 1996-06-25 US disclosed
WO-1996015207-A1 FIRE PROTECTION COVERS MADE OF MELAMINE-FORMALDEHYDE RESIN FIBRES BASF AKTIENGESELLSCHAFT (DE) 1996-05-23 WO disclosed
EP-0702107-A2 Process for dyeing melamine-formaldehyde condensation products BASF Aktiengesellschaft (DE) 1996-03-20 EP disclosed
EP-0523485-B1 Modified melamine-formaldehyde resins BASF AG (DE) 1995-12-13 EP disclosed
EP-0643085-A1 Water-insoluble resins of melamine and formaldehyde BASF Aktiengesellschaft (DE) 1995-03-15 EP disclosed
US-5322915-A Modified melamine-formaldehyde resins BASF AKTIENGESELLSCHAFT (DE) 1994-06-21 US disclosed
EP-0523485-A1 Modified melamine-formaldehyde resins BASF Aktiengesellschaft (DE) 1993-01-20 EP disclosed