SCHEMBL11917985

SCHEMBL11917985

O=Nc1ccccc1COC(=O)NC1CCCCC1

nearest known ligand 0.65

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
EPHX1 P07099 5/20 0.65
ALDH1A1 P00352 3/20 0.49
RAB9A P51151 1/20 0.49
NAAA Q02083 1/20 0.47
KMT2A Q03164 2/20 0.47
MEN1 O00255 1/20 0.47
GAA P10253 1/20 0.47
TSHR P16473 1/20 0.45
FAAH O00519 1/20 0.44
EPHX2 P34913 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13064256 1.00 EPHX1 (0.65) EPHX1ALDH1A1RAB9ANAAAKMT2A
SCHEMBL13064257 1.00 EPHX1 (0.65) EPHX1ALDH1A1RAB9ANAAAKMT2A
SCHEMBL11982333 0.87 EPHX1 (0.50) EPHX1ALDH1A1NAAAGAATSHR
SCHEMBL13343848 0.85 EPHX1 (0.60) EPHX1ALDH1A1RAB9AKMT2AMEN1
SCHEMBL28177943 0.85 EPHX1 (0.53) EPHX1ALDH1A1RAB9ANAAAKMT2A
SCHEMBL13081617 0.82 EPHX1 (0.44) EPHX1ALDH1A1KMT2AMEN1
SCHEMBL12196011 0.79 EPHX1 (1.00) EPHX1ALDH1A1RAB9ANAAAKMT2A
SCHEMBL13131263 0.79 EPHX1 (0.65) EPHX1ALDH1A1RAB9ANAAAKMT2A
SCHEMBL8393719 0.77 EPHX1 (0.84) EPHX1ALDH1A1RAB9AKMT2AMEN1
SCHEMBL1424064 0.77 EPHX1 (0.84) EPHX1ALDH1A1RAB9AKMT2AMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8236476-B2 Multiple exposure photolithography methods and photoresist compositions INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2012-08-07 US disclosed
US-20100304297-A1 PATTERNING PROCESS AND RESIST COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-12-02 US disclosed
US-7838198-B2 Photoresist compositions and method for multiple exposures with multiple layer resist systems INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2010-11-23 US disclosed
US-20090176174-A1 MULTIPLE EXPOSURE PHOTOLITHOGRAPHY METHODS AND PHOTORESIST COMPOSTIONS INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2009-07-09 US disclosed
US-20090155718-A1 PHOTORESIST COMPOSITIONS AND METHOD FOR MULTIPLE EXPOSURES WITH MULTIPLE LAYER RESIST SYSTEMS INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2009-06-18 US disclosed
US-7354521-B2 Method of fabricating inkjet print head using photocurable resin composition SAMSUNG ELECTRONICS CO., LTD. (KR) 2008-04-08 US disclosed
US-7341775-B2 Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device MATSUSHITA ELECTRIC INDUSTRIAL CO. LTD. (JP) 2008-03-11 US disclosed