SCHEMBL11997894

SCHEMBL11997894

COCCOc1ccc(C(C)(C)c2ccccc2)cc1

nearest known ligand 0.68

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
▸ SMN1; SMN2 Q16637 5/20 0.68
▸ KDM4E B2RXH2 10/20 0.63
▸ ALDH1A1 P00352 8/20 0.63
▸ LMNA P02545 2/20 0.63
▸ MEN1 O00255 8/20 0.62
▸ KMT2A Q03164 8/20 0.62
▸ POLB P06746 2/20 0.57
▸ HTT P42858 2/20 0.56
▸ TDP1 Q9NUW8 1/20 0.52
▸ GAA P10253 2/20 0.50
▸ MAPT P10636 2/20 0.48
▸ PSMB1 P20618 1/20 0.47
▸ PSMB5 P28074 1/20 0.47
▸ PSMB2 P49721 1/20 0.47
▸ TP53 P04637 1/20 0.47
▸ CYP1A2 P05177 1/20 0.47
▸ HPGD P15428 1/20 0.47
▸ TSHR P16473 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15723550 0.93 SMN1; SMN2 (0.56) SMN1; SMN2KDM4EALDH1A1LMNAMEN1
SCHEMBL8672714 0.89 SMN1; SMN2 (0.71) SMN1; SMN2KDM4EALDH1A1LMNAMEN1
SCHEMBL12192556 0.87 SMN1; SMN2 (0.51) SMN1; SMN2KDM4EALDH1A1LMNAMEN1
SCHEMBL12192569 0.87 SMN1; SMN2 (0.51) SMN1; SMN2KDM4EALDH1A1LMNAMEN1
SCHEMBL8673557 0.87 SMN1; SMN2 (0.70) SMN1; SMN2KDM4EALDH1A1LMNAMEN1
SCHEMBL20457807 0.87 SMN1; SMN2 (0.51) SMN1; SMN2KDM4EALDH1A1LMNAMEN1
SCHEMBL9787289 0.87 SMN1; SMN2 (0.74) SMN1; SMN2KDM4EALDH1A1LMNAMEN1
SCHEMBL12856959 0.86 SMN1; SMN2 (0.50) SMN1; SMN2KDM4EALDH1A1LMNAMEN1
SCHEMBL15037994 0.84 SMN1; SMN2 (0.58) SMN1; SMN2KDM4EALDH1A1LMNAMEN1
SCHEMBL16624889 0.84 SMN1; SMN2 (0.53) SMN1; SMN2KDM4EALDH1A1LMNAMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8795505-B2 Copper electroplating method SAMSUNG ELECTRONICS CO., LTD. (KR) 2014-08-05 — — US disclosed
US-20120211369-A1 COPPER ELECTROPLATING METHOD ADEKA CORPORATION (JP) 2012-08-23 — — US disclosed
US-7879786-B1 comprises alkali metal hydroxyl compound, nonionic surfactant, anionic surfactant, chelating agent, additive, and water; for flat panel displays EVERLIGHT USA, INC. (US) 2011-02-01 — — US disclosed
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