⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28770921 | 1.00 | — | — | |
| SCHEMBL17296895 | 1.00 | — | — | |
| SCHEMBL28770923 | 1.00 | — | — | |
| SCHEMBL15303964 | 1.00 | — | — | |
| SCHEMBL16330031 | 1.00 | — | — | |
| SCHEMBL28770925 | 1.00 | — | — | |
| SCHEMBL28770918 | 1.00 | — | — | |
| SCHEMBL41640 | 0.95 | — | — | |
| SCHEMBL14339797 | 0.95 | — | — | |
| SCHEMBL10001395 | 0.95 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114539529-A | Dielectric property reducing agent, low dielectric resin composition containing the same, and method for reducing dielectric property of resin | 信越化学工业株式会社 | 2022-05-27 | — | — | CN | disclosed |
| US-20180086915-A1 | RELEASE AGENT COMPOSITION FOR SILICONE ADHESIVE, RELEASE FILM, AND LAMINATE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-03-29 | — | — | US | disclosed |
| US-9646904-B2 | Curable resin composition, and cured product of same | DAICEL CORPORATION (JP) | 2017-05-09 | — | — | US | disclosed |
| US-9644098-B2 | Curable resin composition and cured product thereof, encapsulant, and semiconductor device | DAICEL CORPORATION (JP) | 2017-05-09 | — | — | US | disclosed |
| EP-2944675-B1 | CURABLE RESIN COMPOSITION, AND CURED PRODUCT OF SAME | DAICEL CORP (JP) | 2017-04-12 | — | — | EP | disclosed |
| EP-2767571-B1 | FLUORESCENT COMPOUND, METHOD FOR PRODUCING THE SAME, AND FLUORESCENT RESIN COMPOSITION | SHINETSU CHEMICAL CO (JP) | 2016-12-21 | — | — | EP | disclosed |
| US-9481791-B2 | Curable resin composition and cured product thereof, encapsulant, and semiconductor device | DAICEL CORPORATION (JP) | 2016-11-01 | — | — | US | disclosed |
| US-9447277-B2 | Curable resin composition and cured product thereof, encapsulating agent, and optical semiconductor device | DAICEL CORPORATION (JP) | 2016-09-20 | — | — | US | disclosed |
| EP-2857457-B1 | CURABLE RESIN COMPOSITION, AND CURED PRODUCT, SEALING AGENT, AND OPTICAL SEMICONDUCTOR DEVICE USING SAME | DAICEL CORP (JP) | 2016-08-17 | — | — | EP | disclosed |
| US-9403963-B2 | Particle-comprising polyether alcohols | BASF SE (DE) | 2016-08-02 | — | — | US | disclosed |
| EP-2636706-A1 | CURABLE RESIN COMPOSITION AND CURED ARTICLE | Daicel Corporation (JP) | 2013-09-11 | — | — | EP | disclosed |
| US-20130217796-A1 | PARTICLE-COMPRISING POLYETHER ALCOHOLS | BASF SE (DE) | 2013-08-22 | — | — | US | disclosed |
| US-20130217796-A1 | PARTICLE-COMPRISING POLYETHER ALCOHOLS | BASF SE (DE) | 2013-08-22 | — | — | US | disclosed |
| US-20130217795-A1 | PARTICLE-COMPRISING POLYETHER ALCOHOLS | BASF SE (DE) | 2013-08-22 | — | — | US | disclosed |
| US-20130207041-A1 | FLUORESCENT COMPOUND, MAKING METHOD, AND FLUORESCENT RESIN COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-08-15 | — | — | US | disclosed |
| EP-2626400-A1 | Fluorescent compound, making method, and fluorescent resin composition | Shin-Etsu Chemical Co., Ltd. (JP) | 2013-08-14 | — | — | EP | disclosed |
| US-8497338-B2 | Process of manufacturing organosilicon products with improved quality using heterogeneous precious metal catalysts | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2013-07-30 | — | — | US | disclosed |
| US-20130131265-A1 | CURABLE RESIN COMPOSITION AND CURED ARTICLE | DAICEL CORPORATION (JP) | 2013-05-23 | — | — | US | disclosed |
| US-20130109772-A1 | Process of Manufacturing Organosilicon Products with Improved Quality Using Heterogeneous Precious Metal Catalysts | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2013-05-02 | — | — | US | disclosed |
| US-20110251339-A1 | SOLVENTLESS RELEASER COMPOSITION FOR USE WITH SILICONE PRESSURE-SENSITIVE ADHESIVES AND RELEASE LINER | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-10-13 | — | — | US | disclosed |