⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5918510 | 0.67 | — | — | |
| SCHEMBL1225117 | 0.62 | — | — | |
| SCHEMBL17763366 | 0.61 | — | — | |
| SCHEMBL6064169 | 0.59 | — | — | |
| SCHEMBL2496276 | 0.59 | — | — | |
| SCHEMBL3094487 | 0.57 | — | — | |
| Hydrochloric Acid SCHEMBL11287020 | 0.57 | — | — | |
| SCHEMBL62080 | 0.56 | — | — | |
| SCHEMBL11496746 | 0.56 | — | — | |
| Phosphine SCHEMBL8873093 | 0.53 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 105 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114369113-A | Methylphenyldimethoxysilane and synthetic method thereof | 武汉全福茂新材料有限公司 | 2022-04-19 | — | — | CN | claimed |
| CN-114402036-B | Curable composition, cured product, and method for using curable composition | 琳得科株式会社 | 2023-11-21 | — | — | CN | disclosed |
| CN-116981751-A | Adhesive paste, method for using adhesive paste, and method for manufacturing semiconductor device | 琳得科株式会社 | 2023-10-31 | — | — | CN | disclosed |
| CN-113574117-B | Curable composition, cured product, and method for using curable composition | 琳得科株式会社 | 2023-09-12 | — | — | CN | disclosed |
| CN-113574116-B | Curable composition, cured product, and method for using curable composition | 琳得科株式会社 | 2023-02-28 | — | — | CN | disclosed |
| CN-112739775-B | Curable composition, cured product, and method for using curable composition | 琳得科株式会社 | 2022-11-01 | — | — | CN | disclosed |
| CN-112739776-B | Curable composition, cured product, and method for using curable composition | 琳得科株式会社 | 2022-10-28 | — | — | CN | disclosed |
| WO-2022209064-A1 | ADHESIVE PASTE, METHOD FOR USING ADHESIVE PASTE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | リンテック株式会社 | 2022-10-06 | — | — | WO | disclosed |
| CN-115151611-A | Curable composition, cured product, and method for using curable composition | 琳得科株式会社 | 2022-10-04 | — | — | CN | disclosed |
| CN-115124973-A | Adhesive paste, method for using adhesive paste, and method for manufacturing semiconductor device | 琳得科株式会社 | 2022-09-30 | — | — | CN | disclosed |
| US-20110054139-A1 | ADHESIVE MAINLY COMPOSED OF POLYORGANOSILOXANE COMPOUND | LINTEC CORPORATION (JP) | 2011-03-03 | — | — | US | disclosed |
| US-20110034659-A1 | MOLDING MATERIAL COMPOSED OF POLYORGANOSILOXANE COMPOUND, SEALING MATERIAL, AND SEALED OPTICAL DEVICE | LINTEC CORPORATION (JP) | 2011-02-10 | — | — | US | disclosed |
| US-20090005530-A1 | Molding material comprising polysilsesquioxane compound, sealing material, and sealed optical element | LINTEC CORPORATION (JP) | 2009-01-01 | — | — | US | disclosed |
| US-20080249278-A1 | Sealing material for optical element and sealed optical element | LINTEC CORPORATION (JP) | 2008-10-09 | — | — | US | disclosed |
| US-5501904-A | POLYSILOXANE-VINYL GRAFT POLYMER | TAKEMOTO YUSHI KABUSHIKI KAISHA (JP) | 1996-03-26 | — | — | US | disclosed |
| US-5405691-A | Polysiloxane-polyvinyl graft copolymer | TAKEMOTO YUSHI KABUSHIKI KAISHA (JP) | 1995-04-11 | — | — | US | disclosed |
| US-5296569-A | Consisting of polysiloxane and vinyl polymer mixed together without bonding | TAKEMOTO YUSHI KABUSHIKI KAISHA (JP) | 1994-03-22 | — | — | US | disclosed |
| US-4839453-A | ALKOXYSILAZANES AS BOTH SCAVENGERS AND INTEGRATED CROSSLINKING AGENTS; SHELF LIFE | GENERAL ELECTRIC COMPANY (US) | 1989-06-13 | — | — | US | disclosed |
| US-4720531-A | Novel scavengers for one-component RTV compositions | GENERAL ELECTRIC COMPANY (US) | 1988-01-19 | — | — | US | disclosed |
| EP-0139064-A1 | Novel scavengers for one-component RTV compositions | GENERAL ELECTRIC COMPANY (US) | 1985-05-02 | — | — | EP | disclosed |