SCHEMBL1228602

SCHEMBL1228602

CC(C)[O-].CCCCCCCCOP(=O)([O-])OCCCCCCCC.CCCCCCCCOP(=O)([O-])OCCCCCCCC.CCCCCCCCOP(=O)([O-])OCCCCCCCC.[Ti+4]

nearest known ligand 0.64

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
AKT1 P31749 3/20 0.64
CDC25A P30304 2/20 0.64
LMNA P02545 2/20 0.64
ESR1 P03372 1/20 0.64
ADORA3 P0DMS8 1/20 0.64
AGTR1 P30556 1/20 0.64
ADRA1A P35348 1/20 0.64
KCNH2 Q12809 1/20 0.64
LPAR3 Q9UBY5 5/20 0.52
LPAR2 Q9HBW0 4/20 0.52
LPAR1 Q92633 2/20 0.52
PRKD3 O94806 1/20 0.49
PRKCG P05129 1/20 0.49
PRKCB P05771 1/20 0.49
PRKCA P17252 1/20 0.49
PRKCH P24723 1/20 0.49
PRKCI P41743 1/20 0.49
PRKCE Q02156 1/20 0.49
PRKCQ Q04759 1/20 0.49
PRKCZ Q05513 1/20 0.49

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1230065 0.96 AKT1 (0.64) AKT1CDC25ALMNAESR1ADORA3
SCHEMBL1228506 0.96 AKT1 (0.64) AKT1CDC25ALMNAESR1ADORA3
SCHEMBL3243242 0.93 AKT1 (0.56) AKT1CDC25ALMNAESR1ADORA3
SCHEMBL26929071 0.92 AKT1 (0.68) AKT1CDC25ALMNAESR1ADORA3
SCHEMBL3056147 0.92 AKT1 (0.68) AKT1CDC25ALMNAESR1ADORA3
SCHEMBL3062885 0.89 AKT1 (0.64) AKT1CDC25ALMNAESR1ADORA3
SCHEMBL3061043 0.89 AKT1 (0.64) AKT1CDC25ALMNAESR1ADORA3
SCHEMBL23706702 0.88 AKT1 (0.72) AKT1CDC25ALMNAESR1ADORA3
Potassium Ion SCHEMBL7157363 0.88 AKT1 (0.72) AKT1CDC25ALMNAESR1ADORA3
SCHEMBL673085 0.88 AKT1 (0.72) AKT1CDC25ALMNAESR1ADORA3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240210827-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-06-27 US disclosed
US-20240176240-A1 PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE CURED FILM USING SAME, AND POLYIMIDE CURED FILM ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-05-30 US disclosed
US-20240101761-A1 POLYIMIDE PRECURSOR RESIN COMPOSITION AND METHOD FOR MANUFACTURING SAME ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-03-28 US disclosed
US-20200409263-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS ASAHI KASEI KABUSHIKI KAISHA (JP) 2020-12-31 US disclosed
EP-1749859-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2019-09-11 EP disclosed
EP-1746134-B1 CURABLE COMPOSITION WITH IMPROVED CURABILITY AND ADHESIVENESS KANEKA CORP (JP) 2019-09-04 EP disclosed
EP-1746135-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2019-05-29 EP disclosed
EP-1749858-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2019-04-03 EP disclosed
EP-1749857-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2019-03-27 EP disclosed
EP-1391476-B1 PHOTOREACTIVE COMPOSITION SEKISUI CHEMICAL CO LTD (JP) 2015-12-09 EP disclosed
US-20070219299-A1 Organic polymer having a silane tiol group, a titanium, aluminum or a zirconium catalyst, and a low molecular weight compound containing a hydrolyzable silicon group; sealants, adhesives KANEKA CORPORATION 2007-09-20 US disclosed
EP-1752496-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2007-02-14 EP disclosed
EP-1749859-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2007-02-07 EP disclosed
EP-1749858-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2007-02-07 EP disclosed
EP-1749857-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2007-02-07 EP disclosed
EP-1746133-A1 CURABLE COMPOSITION IMPROVED IN ADHESIVENESS Kaneka Corporation (JP) 2007-01-24 EP disclosed
EP-1746134-A1 CURABLE COMPOSITION WITH IMPROVED CURABILITY AND ADHESIVENESS Kaneka Corporation (JP) 2007-01-24 EP disclosed
EP-1746135-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2007-01-24 EP disclosed
US-20040202956-A1 a photocurable mixture of a hydrolyzable metal (silyl) compound and a reaction, polymerization or crosslinking promoter; curing; adhesives, seals, semiconductors, dielectrics, microlenses, optical fibers, color filters, gas permeable films SEKISUI CHEMICAL CO., LTD. (JP) 2004-10-14 US disclosed
EP-1391476-A1 PHOTOREACTIVE COMPOSITION SEKISUI CHEMICAL CO., LTD. (JP) 2004-02-25 EP disclosed