SCHEMBL12348014

SCHEMBL12348014

CCCCCCC(I)(I)I

nearest known ligand 0.50

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.50
THRB P10828 1/20 0.50
GGPS1 O95749 6/20 0.48
FDPS P14324 9/20 0.41
SMPD1 P17405 2/20 0.39
CES2 O00748 1/20 0.39
LPAR1 Q92633 1/20 0.39
LPAR3 Q9UBY5 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16969783 1.00 TSHR (0.50) TSHRTHRBGGPS1FDPSSMPD1
SCHEMBL16969572 1.00 TSHR (0.50) TSHRTHRBGGPS1FDPSSMPD1
SCHEMBL16969596 1.00 TSHR (0.50) TSHRTHRBGGPS1FDPSSMPD1
SCHEMBL16970222 1.00 TSHR (0.50) TSHRTHRBGGPS1FDPSSMPD1
SCHEMBL16970061 1.00 TSHR (0.50) TSHRTHRBGGPS1FDPSSMPD1
SCHEMBL16969681 1.00 TSHR (0.50) TSHRTHRBGGPS1FDPSSMPD1
SCHEMBL16970324 1.00 TSHR (0.50) TSHRTHRBGGPS1FDPSSMPD1
SCHEMBL16969553 1.00 TSHR (0.50) TSHRTHRBGGPS1FDPSSMPD1
SCHEMBL16970194 1.00 TSHR (0.50) TSHRTHRBGGPS1FDPSSMPD1
SCHEMBL16969566 1.00 TSHR (0.50) TSHRTHRBGGPS1FDPSSMPD1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119751718-A Dialkoxy magnesium carrier type solid catalyst component for ethylene polymerization or copolymerization, preparation method and application thereof 任丘市利和科技发展有限公司 2025-04-04 CN claimed
CN-119751718-A Dialkoxy magnesium carrier type solid catalyst component for ethylene polymerization or copolymerization, preparation method and application thereof 任丘市利和科技发展有限公司 2025-04-04 CN disclosed
EP-2905349-B1 Ag ball, solder joint, formed solder, solder paste and silver paste SENJU METAL INDUSTRY CO (JP) 2017-05-17 EP disclosed
US-9266196-B2 Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core ball, solder joint, formed solder, solder paste and ag paste SENJU METAL INDUSTRY CO., LTD. (JP) 2016-02-23 US disclosed
EP-2905349-A2 Ag ball, Ag core ball, flux-coated Ag ball, flux-coated Ag core ball, solder joint, formed solder, solder paste and Ag paste SENJU METAL INDUSTRY CO., LTD. (JP) 2015-08-12 EP disclosed
US-20150217409-A1 Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BALL, SOLDER JOINT, FORMED SOLDER, SOLDER PASTE AND Ag PASTE Senju Metal lndustry Co., Ltd. (JP) 2015-08-06 US disclosed
US-8008506-B2 Indazole compounds ASAHI KASEI PHARMA CORPORATION (JP) 2011-08-30 US disclosed