⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL31141303 | 1.00 | — | — | |
| SCHEMBL12387101 | 1.00 | — | — | |
| SCHEMBL16605560 | 1.00 | — | — | |
| SCHEMBL12387096 | 1.00 | — | — | |
| SCHEMBL19497424 | 1.00 | — | — | |
| SCHEMBL1700006 | 1.00 | — | — | |
| SCHEMBL12387145 | 1.00 | — | — | |
| SCHEMBL1700048 | 1.00 | — | — | |
| SCHEMBL1700008 | 1.00 | — | — | |
| SCHEMBL31511887 | 1.00 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4370606-B1 | THERMAL CONDUCTIVE SILICONE COMPOSITION | DOW SILICONES CORP (US) | 2026-01-28 | — | — | EP | disclosed |
| CN-119894982-A | Thermally conductive silicone composition | 美国陶氏有机硅公司 | 2025-04-25 | — | — | CN | disclosed |
| US-20240318000-A1 | THERMAL CONDUCTIVE SILICONE COMPOSITION | DOW SILICONES CORP (US) | 2024-09-26 | — | — | US | disclosed |
| US-11851603-B2 | Thermally conductive composition and methods and devices in which said composition is used | DOW SILICONES CORPORATION (US) | 2023-12-26 | — | — | US | disclosed |