SCHEMBL12465285

SCHEMBL12465285

CCC(C)(C)c1ccc(C(I)(CC)CC)cc1

nearest known ligand 0.58

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 3/20 0.47
RAB9A P51151 3/20 0.47
MAPT P10636 1/20 0.47
LMNA P02545 1/20 0.40
MAPK1 P28482 1/20 0.40
CASP3 P42574 1/20 0.40
ATM Q13315 1/20 0.40
SMN1; SMN2 Q16637 1/20 0.40
SENP8 Q96LD8 1/20 0.40
SENP7 Q9BQF6 1/20 0.40
SENP6 Q9GZR1 1/20 0.40
CNR2 P34972 2/20 0.39
HRH3 Q9Y5N1 12/20 0.38
MAOB P27338 8/20 0.38
POLB P06746 1/20 0.36
CYP2C9 P11712 1/20 0.36
SHBG P04278 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL779443 0.84 NPC1 (0.58) NPC1RAB9AMAPTLMNAMAPK1
SCHEMBL12967599 0.83 NPC1 (0.48) NPC1RAB9AMAPTLMNAMAPK1
SCHEMBL10252651 0.83 TSHR (0.46) NPC1RAB9AMAPTLMNAMAPK1
SCHEMBL11952283 0.81 NPC1 (0.52) NPC1RAB9AMAPTLMNAMAPK1
SCHEMBL13016 0.80 NPC1 (0.50) NPC1RAB9AMAPTLMNAMAPK1
SCHEMBL200312 0.78 NPC1 (0.48) NPC1RAB9AMAPTLMNAMAPK1
Iodide SCHEMBL5175074 0.78 NPC1 (0.48) NPC1RAB9AMAPTLMNAMAPK1
SCHEMBL3625528 0.77 NPC1 (0.52) NPC1RAB9AMAPTLMNAMAPK1
SCHEMBL5552840 0.77 NPC1 (0.52) NPC1RAB9AMAPTLMNAMAPK1
SCHEMBL3292125 0.77 NPC1 (0.52) NPC1RAB9AMAPTLMNAMAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20210173309-A1 METHOD OF FORMING REVERSED PATTERN AND METHOD OF MANUFACTURING ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2021-06-10 US disclosed
US-9760003-B2 Pattern forming method and actinic-ray- or radiation-sensitive resin composition FUJIFILM CORPORATION (JP) 2017-09-12 US disclosed
EP-1199603-B1 Positive photosensitive composition FUJIFILM CORP (JP) 2016-11-30 EP disclosed
US-9423690-B2 Pattern forming method, electron beam-sensitive or extreme ultraviolet ray-sensitive resin composition, resist film, and method for manufacturing electronic device, and electronic device using the same FUJIFILM CORPORATION (JP) 2016-08-23 US disclosed
US-9250532-B2 Pattern forming method, multi-layered resist pattern, multi-layered film for organic solvent development, resist composition, method for manufacturing electronic device, and electronic device FUJIFILM CORPORATION (JP) 2016-02-02 US disclosed
US-20150168834-A1 PATTERN FORMING METHOD, ELECTRON BEAM-SENSITIVE OR EXTREME ULTRAVIOLET RAY-SENSITIVE RESIN COMPOSITION, RESIST FILM, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE USING THE SAME FUJIFILM CORPORATION (JP) 2015-06-18 US disclosed
US-20140127629-A1 METHOD OF FORMING PATTERN FUJIFILM CORPORATION (JP) 2014-05-08 US disclosed
US-8709704-B2 Pattern forming method using developer containing organic solvent and rinsing solution for use in the pattern forming method FUJIFILM CORPORATION (JP) 2014-04-29 US disclosed
EP-1964894-B1 Ink composition, inkjetrecording method, printed material, method for producing planographic printing plate, and planographic printing plate FUJIFILM CORP (JP) 2013-01-23 EP disclosed
US-20110183263-A1 ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN USING THE COMPOSITION FUJIFILM CORPORATION (JP) 2011-07-28 US disclosed
EP-1762599-A1 Ink composition, inkjet recording method, printed material, process for producing lithographic plate, and lithographic printing plate FUJIFILM Corporation (JP) 2007-03-14 EP disclosed