⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL251268 | 0.96 | — | — | |
| SCHEMBL3286387 | 0.93 | — | — | |
| SCHEMBL27598619 | 0.93 | — | — | |
| SCHEMBL2315815 | 0.93 | — | — | |
| SCHEMBL1719840 | 0.93 | — | — | |
| SCHEMBL3854312 | 0.93 | — | — | |
| Hydrochloric Acid SCHEMBL4024833 | 0.90 | — | — | |
| Hydrochloric Acid SCHEMBL11581409 | 0.90 | — | — | |
| Bromide SCHEMBL5862208 | 0.90 | — | — | |
| SCHEMBL5534423 | 0.90 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 368 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119882373-A | IC carrier plate film removing agent and preparation and use methods thereof | 昆山市板明电子科技有限公司 | 2025-04-25 | — | — | CN | claimed |
| CN-116178758-A | Preparation method of composite board with fireproof function for evacuation platform | 江苏亚冠轨道交通科技有限公司 | 2023-05-30 | — | — | CN | claimed |
| CN-114539961-A | Single-component motor adhesive capable of being stored stably at normal temperature and rapidly cured at medium temperature and preparation method thereof | 湖北回天新材料股份有限公司 | 2022-05-27 | — | — | CN | claimed |
| CN-111892749-B | Boron nitride high-thermal-conductivity insulating filler with imidazole-copper complex adsorbed on surface, insulating and heat-dissipating epoxy resin composition and preparation method thereof | 浙江荣泰科技企业有限公司 | 2022-03-22 | — | — | CN | claimed |
| CN-112663063-A | Tin stripping liquid and method for recycling tin stripping liquid after application | 广东臻鼎环境科技有限公司 | 2021-04-16 | — | — | CN | claimed |
| CN-111892749-A | Boron nitride high-thermal-conductivity insulating filler with imidazole-copper complex adsorbed on surface, insulating and heat-dissipating epoxy resin composition and preparation method thereof | 浙江荣泰科技企业有限公司 | 2020-11-06 | — | — | CN | claimed |
| CN-110684202-A | Two-dimensional layered imidazole copper C60Material, preparation method and application thereof | 汕头大学 | 2020-01-14 | — | — | CN | claimed |
| US-4339448-A | Imidazole-copper complex compounds and fungicides containing them | BASF AKTIENGESELLSCHAFT (DE) | 1982-07-13 | — | — | US | claimed |
| EP-0010723-B1 | COPPER COMPLEXES OF IMIDAZOLE, THEIR PREPARATION AND FUNGICIDES CONTAINING THEM | BASF Aktiengesellschaft (DE) | 1981-07-29 | — | — | EP | claimed |
| CN-116178758-B | Preparation method of composite board with fireproof function for evacuation platform | 江苏亚冠轨道交通科技有限公司 | 2025-09-19 | — | — | CN | disclosed |
| CN-119882373-A | IC carrier plate film removing agent and preparation and use methods thereof | 昆山市板明电子科技有限公司 | 2025-04-25 | — | — | CN | disclosed |
| CN-119882373-A | IC carrier plate film removing agent and preparation and use methods thereof | 昆山市板明电子科技有限公司 | 2025-04-25 | — | — | CN | disclosed |
| CN-110168146-B | Copper electrodeposition solution and method for high aspect ratio patterns | 阿文尼公司 | 2024-01-09 | — | — | CN | disclosed |
| CN-114539961-B | Single-component motor adhesive capable of being stored stably at normal temperature and being cured rapidly at medium temperature and preparation method thereof | 湖北回天新材料股份有限公司 | 2023-11-17 | — | — | CN | disclosed |
| JP-2000252622-A | PRINTED WIRING BOARD AND ITS MANUFACTURE | IBIDEN CO LTD | 2000-09-14 | — | — | JP | disclosed |
| EP-0999731-A1 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME | IBIDEN CO., LTD. (JP) | 2000-05-10 | — | — | EP | disclosed |
| US-4339448-A | Imidazole-copper complex compounds and fungicides containing them | BASF AKTIENGESELLSCHAFT (DE) | 1982-07-13 | — | — | US | disclosed |
| US-4339448-A | Imidazole-copper complex compounds and fungicides containing them | BASF AKTIENGESELLSCHAFT (DE) | 1982-07-13 | — | — | US | disclosed |
| US-4282159-A | Preparation of alkylene oxides | WISCONSIN ALUMNI RESEARCH FOUNDATION (US) | 1981-08-04 | — | — | US | disclosed |
| US-4282159-A | Preparation of alkylene oxides | WISCONSIN ALUMNI RESEARCH FOUNDATION (US) | 1981-08-04 | — | — | US | disclosed |